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INIS
adhesion
7%
aluminium nitrides
100%
ammonia
7%
comparative evaluations
100%
concentration
7%
density
7%
deposition
100%
detection
7%
films
100%
friction
7%
gases
7%
hardness
7%
impurities
7%
layers
100%
magnetrons
100%
mechanical properties
100%
molybdenum 100
7%
molybdenum 110
7%
plasma
100%
polycrystals
7%
recoils
7%
residual stresses
14%
sputtering
100%
substrates
28%
texture
7%
thickness
7%
thin films
7%
time-of-flight method
7%
values
7%
voltage
7%
wear
14%
x-ray diffraction
7%
Keyphrases
(111)-oriented
11%
Adhesion
11%
Al(111)
11%
AlN Film
11%
Aluminum Nitride Film
100%
Aluminum Nitride Thin Film
11%
Bias Voltage
11%
Crystallinity
11%
Diffraction
11%
Elastic Modulus
11%
Elemental Composition
11%
Film Properties
11%
Friction Coefficient
11%
Gaseous Ammonia
11%
Impurity Concentration
11%
Load Behavior
11%
Magnetron Plasma
100%
Magnetron Sputtering
100%
Mass Density
11%
Mechanical Composition
100%
Mechanical Properties
100%
Mo(110)
11%
N-ratio
22%
Nanoindentation Test
11%
Plasma Gases
11%
Plasma-enhanced Atomic Layer Deposition (PEALD)
100%
Process Parameters Influence
11%
Reactive Magnetron Sputtering
11%
Residual Stress
11%
Si(111)
11%
Sputtered AlN
22%
Sputtered Films
55%
Structural Composition
11%
Substrate Effect
11%
Substrate Texture
11%
Temperature Bias
11%
Tensile Residual Stress
11%
Time-of-flight Elastic Recoil Detection Analysis
11%
Wear Characteristics
11%
Engineering
Atomic Layer Deposition
100%
Bias Voltage
11%
Coefficient of Friction
11%
Critical Load
11%
Crystallinity
11%
Elemental Composition
11%
Film Property
11%
Gas Plasma
11%
Magnetron
100%
Modulus of Elasticity
11%
Nitride
100%
Polycrystalline
11%
Process Parameter
11%
Ray Diffraction
11%
Residual Stress
11%
Structural Composition
11%
Tensile Residual Stress
11%
Tensiles
11%
Thin Films
11%
Time-of-Flight
11%
Material Science
Aluminum Nitride
100%
Coefficient of Friction
11%
Density
11%
Elastic Moduli
11%
Film
100%
Film Deposition
33%
Magnetron Sputtering
11%
Nanoindentation
11%
Residual Stress
22%
Sputtered Film
55%
Thin Films
11%