Comparison of Thermal Maps with Damage Revealed by Silicone Impregnation

Atsushi Tanaka, Heikki Kettunen, Tatsuo Yamauchi

Research output: Contribution to journalArticleScientificpeer-review

1 Citation (Scopus)

Abstract

Two different techniques were used to detect the local fracture process zone of paper. The silicone impregnation technique was used to reveal the area where broken bonds scatter light. Thermographic technique was used to measure the local temperature variation at crack tip. In the in-plane tear test, the area where temperature rises was larger than the area of damage revealed by the silicone technique. This could derive from heat generation during elastic destraining. In the short span tensile test, temperature profile was the same as in the in-plane tear test for every sample. On the basis of our results, the fracture process zone does not seem vary much between different in-plane test geometries.
Original languageEnglish
Pages (from-to)287-290
Number of pages4
JournalPaperi ja puu
Volume85
Issue number8
Publication statusPublished - 2003
MoE publication typeA1 Journal article-refereed

Fingerprint

silicone
Silicones
Impregnation
heat
damage
testing
Heat generation
Crack tips
Temperature
methodology
temperature profile
temperature profiles
temperature
crack
Geometry
geometry
Hot Temperature
comparison
test
sampling

Keywords

  • Fracture
  • Fiber bonding
  • Damage
  • Image analysis
  • Infrared thermography
  • Test methods

Cite this

Tanaka, Atsushi ; Kettunen, Heikki ; Yamauchi, Tatsuo. / Comparison of Thermal Maps with Damage Revealed by Silicone Impregnation. In: Paperi ja puu. 2003 ; Vol. 85, No. 8. pp. 287-290.
@article{94a301b451c44184aa75990dee9c44e9,
title = "Comparison of Thermal Maps with Damage Revealed by Silicone Impregnation",
abstract = "Two different techniques were used to detect the local fracture process zone of paper. The silicone impregnation technique was used to reveal the area where broken bonds scatter light. Thermographic technique was used to measure the local temperature variation at crack tip. In the in-plane tear test, the area where temperature rises was larger than the area of damage revealed by the silicone technique. This could derive from heat generation during elastic destraining. In the short span tensile test, temperature profile was the same as in the in-plane tear test for every sample. On the basis of our results, the fracture process zone does not seem vary much between different in-plane test geometries.",
keywords = "Fracture, Fiber bonding, Damage, Image analysis, Infrared thermography, Test methods",
author = "Atsushi Tanaka and Heikki Kettunen and Tatsuo Yamauchi",
year = "2003",
language = "English",
volume = "85",
pages = "287--290",
journal = "Paperi ja puu",
issn = "0031-1243",
number = "8",

}

Tanaka, A, Kettunen, H & Yamauchi, T 2003, 'Comparison of Thermal Maps with Damage Revealed by Silicone Impregnation', Paperi ja puu, vol. 85, no. 8, pp. 287-290.

Comparison of Thermal Maps with Damage Revealed by Silicone Impregnation. / Tanaka, Atsushi; Kettunen, Heikki; Yamauchi, Tatsuo.

In: Paperi ja puu, Vol. 85, No. 8, 2003, p. 287-290.

Research output: Contribution to journalArticleScientificpeer-review

TY - JOUR

T1 - Comparison of Thermal Maps with Damage Revealed by Silicone Impregnation

AU - Tanaka, Atsushi

AU - Kettunen, Heikki

AU - Yamauchi, Tatsuo

PY - 2003

Y1 - 2003

N2 - Two different techniques were used to detect the local fracture process zone of paper. The silicone impregnation technique was used to reveal the area where broken bonds scatter light. Thermographic technique was used to measure the local temperature variation at crack tip. In the in-plane tear test, the area where temperature rises was larger than the area of damage revealed by the silicone technique. This could derive from heat generation during elastic destraining. In the short span tensile test, temperature profile was the same as in the in-plane tear test for every sample. On the basis of our results, the fracture process zone does not seem vary much between different in-plane test geometries.

AB - Two different techniques were used to detect the local fracture process zone of paper. The silicone impregnation technique was used to reveal the area where broken bonds scatter light. Thermographic technique was used to measure the local temperature variation at crack tip. In the in-plane tear test, the area where temperature rises was larger than the area of damage revealed by the silicone technique. This could derive from heat generation during elastic destraining. In the short span tensile test, temperature profile was the same as in the in-plane tear test for every sample. On the basis of our results, the fracture process zone does not seem vary much between different in-plane test geometries.

KW - Fracture

KW - Fiber bonding

KW - Damage

KW - Image analysis

KW - Infrared thermography

KW - Test methods

M3 - Article

VL - 85

SP - 287

EP - 290

JO - Paperi ja puu

JF - Paperi ja puu

SN - 0031-1243

IS - 8

ER -