Conductive adhesives as die-bonding materials for power electric modules

Jaakko Lenkkeri, Outi Rusanen

Research output: Contribution to journalArticleScientificpeer-review

Abstract

Five different epoxy based silver filled adhesives have been tested with respect to their usefulness for die-bonding of power chip components. The measurements of electrical resistance and mechanical strength are reported for joints tested in high temperature ageing and in high temperature/high humidity ageing. Test structures had copper plates with either nickel or Au/Ni plating joined to thick film AgPt, Cu or Au metallizations on alumina substrate. In accelerated ageing tests the structures with Au/Ni-plated surfaces gave better results than those with Ni-plating. One of the adhesives survived the tests better than the other adhesives. The thermal resistances have been measured for silicon diodes either glued or soldered on alumina substrate. The results agree fairly well with those estimated by thermal simulations.

Original languageEnglish
Pages (from-to)199 - 204
Number of pages6
JournalJournal of Electronics Manufacturing
Volume3
Issue number4
DOIs
Publication statusPublished - 1993
MoE publication typeA1 Journal article-refereed

Fingerprint

Adhesives
Aging of materials
Plating
Alumina
Acoustic impedance
Substrates
Metallizing
Thick films
Heat resistance
Strength of materials
Atmospheric humidity
Diodes
Silver
Nickel
Copper
Silicon
Temperature
Hot Temperature

Cite this

Lenkkeri, Jaakko ; Rusanen, Outi. / Conductive adhesives as die-bonding materials for power electric modules. In: Journal of Electronics Manufacturing. 1993 ; Vol. 3, No. 4. pp. 199 - 204.
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Conductive adhesives as die-bonding materials for power electric modules. / Lenkkeri, Jaakko; Rusanen, Outi.

In: Journal of Electronics Manufacturing, Vol. 3, No. 4, 1993, p. 199 - 204.

Research output: Contribution to journalArticleScientificpeer-review

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AB - Five different epoxy based silver filled adhesives have been tested with respect to their usefulness for die-bonding of power chip components. The measurements of electrical resistance and mechanical strength are reported for joints tested in high temperature ageing and in high temperature/high humidity ageing. Test structures had copper plates with either nickel or Au/Ni plating joined to thick film AgPt, Cu or Au metallizations on alumina substrate. In accelerated ageing tests the structures with Au/Ni-plated surfaces gave better results than those with Ni-plating. One of the adhesives survived the tests better than the other adhesives. The thermal resistances have been measured for silicon diodes either glued or soldered on alumina substrate. The results agree fairly well with those estimated by thermal simulations.

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