Contactless electrical sintering of silver nanoparticles on flexible substrates

Research output: Contribution to journalArticleScientificpeer-review

48 Citations (Scopus)

Abstract

Contactless rapid electrical sintering (RES) is demonstrated using microwave power. The method is implemented by coupling the near-field electric field of a sintering head across an underlying nanoparticle layer. We provide appropriate biasing conditions required for controlled power delivery and demonstrate real-time monitoring of the process by measuring the reflected power at 1.8 GHz. A small-scale sintering head is designed and fabricated on a printed circuit board (PCB). The PCB head is shown to provide a tenfold improvement in sintering efficiency when compared to a sintering head with a less focused electric field pattern. Finally, a high-power coaxial sintering head, with a narrow electrode spacing and biasing conditions similar to the PCB head, is used for demonstrating contactless RES over an air gap. Silver nanoparticle patterning inkjet printed on a temperature-sensitive flexible substrate is efficiently sintered in two passes with 50-W input power and 25-mm/s processing speed, when the vertical working distance to the constantly moving substrate is 1 mm. The demonstrated sintering technology can be applied to a number of printed electronics applications.
Original languageEnglish
Pages (from-to)1419-1429
Number of pages11
JournalIEEE Transactions on Microwave Theory and Techniques
Volume59
Issue number5
DOIs
Publication statusPublished - 2011
MoE publication typeA1 Journal article-refereed

Fingerprint

sintering
Silver
Sintering
silver
Nanoparticles
nanoparticles
Substrates
printed circuits
circuit boards
Printed circuit boards
Electric fields
electric fields
delivery
near fields
Electronic equipment
Microwaves
spacing
microwaves
Electrodes
electrodes

Keywords

  • Flexible substrate
  • impedance matching
  • inkjet printing
  • nanoparticle ink
  • near-field coupling
  • rapid electrical sintering (RES)

Cite this

@article{747b6ece4aa14742bc95b8af712dc9a3,
title = "Contactless electrical sintering of silver nanoparticles on flexible substrates",
abstract = "Contactless rapid electrical sintering (RES) is demonstrated using microwave power. The method is implemented by coupling the near-field electric field of a sintering head across an underlying nanoparticle layer. We provide appropriate biasing conditions required for controlled power delivery and demonstrate real-time monitoring of the process by measuring the reflected power at 1.8 GHz. A small-scale sintering head is designed and fabricated on a printed circuit board (PCB). The PCB head is shown to provide a tenfold improvement in sintering efficiency when compared to a sintering head with a less focused electric field pattern. Finally, a high-power coaxial sintering head, with a narrow electrode spacing and biasing conditions similar to the PCB head, is used for demonstrating contactless RES over an air gap. Silver nanoparticle patterning inkjet printed on a temperature-sensitive flexible substrate is efficiently sintered in two passes with 50-W input power and 25-mm/s processing speed, when the vertical working distance to the constantly moving substrate is 1 mm. The demonstrated sintering technology can be applied to a number of printed electronics applications.",
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author = "M. Allen and A. Alastalo and M. Suhonen and T. Mattila and J. Lepp{\"a}niemi and H. Sepp{\"a}",
year = "2011",
doi = "10.1109/TMTT.2011.2123910",
language = "English",
volume = "59",
pages = "1419--1429",
journal = "IEEE Transactions on Microwave Theory and Techniques",
issn = "0018-9480",
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}

Contactless electrical sintering of silver nanoparticles on flexible substrates. / Allen, M.; Alastalo, A.; Suhonen, M.; Mattila, T.; Leppäniemi, J.; Seppä, H.

In: IEEE Transactions on Microwave Theory and Techniques, Vol. 59, No. 5, 2011, p. 1419-1429.

Research output: Contribution to journalArticleScientificpeer-review

TY - JOUR

T1 - Contactless electrical sintering of silver nanoparticles on flexible substrates

AU - Allen, M.

AU - Alastalo, A.

AU - Suhonen, M.

AU - Mattila, T.

AU - Leppäniemi, J.

AU - Seppä, H.

PY - 2011

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N2 - Contactless rapid electrical sintering (RES) is demonstrated using microwave power. The method is implemented by coupling the near-field electric field of a sintering head across an underlying nanoparticle layer. We provide appropriate biasing conditions required for controlled power delivery and demonstrate real-time monitoring of the process by measuring the reflected power at 1.8 GHz. A small-scale sintering head is designed and fabricated on a printed circuit board (PCB). The PCB head is shown to provide a tenfold improvement in sintering efficiency when compared to a sintering head with a less focused electric field pattern. Finally, a high-power coaxial sintering head, with a narrow electrode spacing and biasing conditions similar to the PCB head, is used for demonstrating contactless RES over an air gap. Silver nanoparticle patterning inkjet printed on a temperature-sensitive flexible substrate is efficiently sintered in two passes with 50-W input power and 25-mm/s processing speed, when the vertical working distance to the constantly moving substrate is 1 mm. The demonstrated sintering technology can be applied to a number of printed electronics applications.

AB - Contactless rapid electrical sintering (RES) is demonstrated using microwave power. The method is implemented by coupling the near-field electric field of a sintering head across an underlying nanoparticle layer. We provide appropriate biasing conditions required for controlled power delivery and demonstrate real-time monitoring of the process by measuring the reflected power at 1.8 GHz. A small-scale sintering head is designed and fabricated on a printed circuit board (PCB). The PCB head is shown to provide a tenfold improvement in sintering efficiency when compared to a sintering head with a less focused electric field pattern. Finally, a high-power coaxial sintering head, with a narrow electrode spacing and biasing conditions similar to the PCB head, is used for demonstrating contactless RES over an air gap. Silver nanoparticle patterning inkjet printed on a temperature-sensitive flexible substrate is efficiently sintered in two passes with 50-W input power and 25-mm/s processing speed, when the vertical working distance to the constantly moving substrate is 1 mm. The demonstrated sintering technology can be applied to a number of printed electronics applications.

KW - Flexible substrate

KW - impedance matching

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KW - nanoparticle ink

KW - near-field coupling

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JO - IEEE Transactions on Microwave Theory and Techniques

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