Copper-core MCPCB with thermal vias for high-power COB LED modules

Eveliina Juntunen, Olli Tapaninen, Aila Sitomaniemi, M. Jämsä, Veli Heikkinen, Mikko Karppinen, Pentti Karioja

Research output: Contribution to journalArticleScientificpeer-review

26 Citations (Scopus)

Abstract

To improve thermal performance of high-power chip-on-board multichip LED module, a copper-core metal core printed circuit board (MCPCB) substrate with copper filled microvias is introduced. As a reference, the performance is compared with alumina module with the same layout by means of thermal simulations and measurements. Up to 55% reduction in the thermal resistance from the LED source to the bottom of the substrate is demonstrated. The excellent performance of the Cu MCPCB module is due to copper-filled microvias under the blue LED chips that occupy the majority of the multichip module. The conclusion was verified by measuring increased thermal resistances of red chips without thermal vias on the Cu MCPCB module. However, as the blue LEDs dominate the thermal power of the module, they also dominate the module thermal resistance. The thermal resistance was demonstrated to correspond with the number of vias as lower thermal resistance was measured on modules with larger number of vias. The Cu MCPCB was processed in standard PCB manufacturing and low cost material, FR4, was utilized for the electrical insulation. Thus, the solution is potentially cost-effective despite the higher cost of copper in comparison with aluminum that is the most commonly used MCPCB core material.
Original languageEnglish
Pages (from-to)1410-1417
JournalIEEE Transactions on Power Electronics
Volume29
Issue number3
DOIs
Publication statusPublished - 2014
MoE publication typeA1 Journal article-refereed

Fingerprint

Heat resistance
Printed circuit boards
Light emitting diodes
Copper
Metals
Multichip modules
Costs
Substrates
Polychlorinated biphenyls
Insulation
Alumina
Hot Temperature
Aluminum

Keywords

  • eielectrics and electrical insulation
  • light emitting diodes (LEDs)
  • multichip modules
  • substrates
  • thermal analysis

Cite this

Juntunen, Eveliina ; Tapaninen, Olli ; Sitomaniemi, Aila ; Jämsä, M. ; Heikkinen, Veli ; Karppinen, Mikko ; Karioja, Pentti. / Copper-core MCPCB with thermal vias for high-power COB LED modules. In: IEEE Transactions on Power Electronics. 2014 ; Vol. 29, No. 3. pp. 1410-1417.
@article{f23797f58de84a2baf76f07dedb0861c,
title = "Copper-core MCPCB with thermal vias for high-power COB LED modules",
abstract = "To improve thermal performance of high-power chip-on-board multichip LED module, a copper-core metal core printed circuit board (MCPCB) substrate with copper filled microvias is introduced. As a reference, the performance is compared with alumina module with the same layout by means of thermal simulations and measurements. Up to 55{\%} reduction in the thermal resistance from the LED source to the bottom of the substrate is demonstrated. The excellent performance of the Cu MCPCB module is due to copper-filled microvias under the blue LED chips that occupy the majority of the multichip module. The conclusion was verified by measuring increased thermal resistances of red chips without thermal vias on the Cu MCPCB module. However, as the blue LEDs dominate the thermal power of the module, they also dominate the module thermal resistance. The thermal resistance was demonstrated to correspond with the number of vias as lower thermal resistance was measured on modules with larger number of vias. The Cu MCPCB was processed in standard PCB manufacturing and low cost material, FR4, was utilized for the electrical insulation. Thus, the solution is potentially cost-effective despite the higher cost of copper in comparison with aluminum that is the most commonly used MCPCB core material.",
keywords = "eielectrics and electrical insulation, light emitting diodes (LEDs), multichip modules, substrates, thermal analysis",
author = "Eveliina Juntunen and Olli Tapaninen and Aila Sitomaniemi and M. J{\"a}ms{\"a} and Veli Heikkinen and Mikko Karppinen and Pentti Karioja",
year = "2014",
doi = "10.1109/TPEL.2013.2260769",
language = "English",
volume = "29",
pages = "1410--1417",
journal = "IEEE Transactions on Power Electronics",
issn = "0885-8993",
publisher = "Institute of Electrical and Electronic Engineers IEEE",
number = "3",

}

Copper-core MCPCB with thermal vias for high-power COB LED modules. / Juntunen, Eveliina; Tapaninen, Olli; Sitomaniemi, Aila; Jämsä, M.; Heikkinen, Veli; Karppinen, Mikko; Karioja, Pentti.

In: IEEE Transactions on Power Electronics, Vol. 29, No. 3, 2014, p. 1410-1417.

Research output: Contribution to journalArticleScientificpeer-review

TY - JOUR

T1 - Copper-core MCPCB with thermal vias for high-power COB LED modules

AU - Juntunen, Eveliina

AU - Tapaninen, Olli

AU - Sitomaniemi, Aila

AU - Jämsä, M.

AU - Heikkinen, Veli

AU - Karppinen, Mikko

AU - Karioja, Pentti

PY - 2014

Y1 - 2014

N2 - To improve thermal performance of high-power chip-on-board multichip LED module, a copper-core metal core printed circuit board (MCPCB) substrate with copper filled microvias is introduced. As a reference, the performance is compared with alumina module with the same layout by means of thermal simulations and measurements. Up to 55% reduction in the thermal resistance from the LED source to the bottom of the substrate is demonstrated. The excellent performance of the Cu MCPCB module is due to copper-filled microvias under the blue LED chips that occupy the majority of the multichip module. The conclusion was verified by measuring increased thermal resistances of red chips without thermal vias on the Cu MCPCB module. However, as the blue LEDs dominate the thermal power of the module, they also dominate the module thermal resistance. The thermal resistance was demonstrated to correspond with the number of vias as lower thermal resistance was measured on modules with larger number of vias. The Cu MCPCB was processed in standard PCB manufacturing and low cost material, FR4, was utilized for the electrical insulation. Thus, the solution is potentially cost-effective despite the higher cost of copper in comparison with aluminum that is the most commonly used MCPCB core material.

AB - To improve thermal performance of high-power chip-on-board multichip LED module, a copper-core metal core printed circuit board (MCPCB) substrate with copper filled microvias is introduced. As a reference, the performance is compared with alumina module with the same layout by means of thermal simulations and measurements. Up to 55% reduction in the thermal resistance from the LED source to the bottom of the substrate is demonstrated. The excellent performance of the Cu MCPCB module is due to copper-filled microvias under the blue LED chips that occupy the majority of the multichip module. The conclusion was verified by measuring increased thermal resistances of red chips without thermal vias on the Cu MCPCB module. However, as the blue LEDs dominate the thermal power of the module, they also dominate the module thermal resistance. The thermal resistance was demonstrated to correspond with the number of vias as lower thermal resistance was measured on modules with larger number of vias. The Cu MCPCB was processed in standard PCB manufacturing and low cost material, FR4, was utilized for the electrical insulation. Thus, the solution is potentially cost-effective despite the higher cost of copper in comparison with aluminum that is the most commonly used MCPCB core material.

KW - eielectrics and electrical insulation

KW - light emitting diodes (LEDs)

KW - multichip modules

KW - substrates

KW - thermal analysis

U2 - 10.1109/TPEL.2013.2260769

DO - 10.1109/TPEL.2013.2260769

M3 - Article

VL - 29

SP - 1410

EP - 1417

JO - IEEE Transactions on Power Electronics

JF - IEEE Transactions on Power Electronics

SN - 0885-8993

IS - 3

ER -