Abstract
| Original language | English |
|---|---|
| Pages (from-to) | 2854-2858 |
| Journal | Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films |
| Volume | 5 |
| Issue number | 5 |
| DOIs | |
| Publication status | Published - 1987 |
| MoE publication type | A1 Journal article-refereed |
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Correlation between resistance behavior and mass transport in Al–Si/Ti multilayer interconnects. / Finetti, Manuela; Suni, Ilkka; Armigliato, Aldo; Garulli, Antonio; Scorzoni, Andrea.
In: Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films, Vol. 5, No. 5, 1987, p. 2854-2858.Research output: Contribution to journal › Article › Scientific › peer-review
TY - JOUR
T1 - Correlation between resistance behavior and mass transport in Al–Si/Ti multilayer interconnects
AU - Finetti, Manuela
AU - Suni, Ilkka
AU - Armigliato, Aldo
AU - Garulli, Antonio
AU - Scorzoni, Andrea
PY - 1987
Y1 - 1987
N2 - In this work we investigate the correlation between the resistance behavior and the mass transport in narrow line interconnects with a laminated structure incorporating single or multiple layers of Ti in AI-Si. For comparison, homogeneous AI-Si films are also studied. A temperature-ramp resistance analysis is applied at direct wafer level. In multilayer interconnects the resistance change is only detected above the typical failure temperatures of the homogeneous stripes. Different degradation mechanisms are also observed, although the activation energies suggest similar electromigration processes. The improved stability against electromigration in the laminated structures is related to the formation of a continuous barrier of the intermetallic compound TiA13' preventing voids from propagating across the film.
AB - In this work we investigate the correlation between the resistance behavior and the mass transport in narrow line interconnects with a laminated structure incorporating single or multiple layers of Ti in AI-Si. For comparison, homogeneous AI-Si films are also studied. A temperature-ramp resistance analysis is applied at direct wafer level. In multilayer interconnects the resistance change is only detected above the typical failure temperatures of the homogeneous stripes. Different degradation mechanisms are also observed, although the activation energies suggest similar electromigration processes. The improved stability against electromigration in the laminated structures is related to the formation of a continuous barrier of the intermetallic compound TiA13' preventing voids from propagating across the film.
U2 - 10.1116/1.574254
DO - 10.1116/1.574254
M3 - Article
VL - 5
SP - 2854
EP - 2858
JO - Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
JF - Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
SN - 0734-2101
IS - 5
ER -