Cost-effective packaging of laser modules using LTCC substrates

Kimmo Keränen; Jukka-Tapani Mäkinen; Juhani Heilala; Otso Väätäinen; Kari Kautio; Jyrki Ollila; Jarno Petäjä; Mikko Karppinen; Veli Heikkinen; Pentti Karioja

doi:10.1117/12.528280

Cost-effective packaging of laser modules using LTCC substrates

Kimmo Keränen, Jukka-Tapani Mäkinen, Juhani Heilala, Otso Väätäinen, Kari Kautio, Jyrki Ollila, Jarno Petäjä, Mikko Karppinen, Veli Heikkinen, Pentti Karioja

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

9 Citations (Scopus)

Original language	English
Title of host publication	Photonics Packaging and Integration IV
Publisher	International Society for Optics and Photonics SPIE
Pages	111-121
DOIs	https://doi.org/10.1117/12.528280
Publication status	Published - 2004
MoE publication type	A4 Article in a conference publication
Event	Integrated Optoelectronic Devices 2004: Photonics Packaging and Integration IV - San Jose, United States Duration: 26 Jan 2004 → 29 Jan 2004

Publication series

Series	Proceedings of SPIE
Volume	5358

Conference

Conference	Integrated Optoelectronic Devices 2004
Country/Territory	United States
City	San Jose
Period	26/01/04 → 29/01/04

Keywords

low temperature co-fired ceramic
LTCC
electronics packaging
microelectronics packaging
lasers
optics

Access to Document

10.1117/12.528280

Cite this

@inproceedings{1d2bf39a24fe44928fecff8ffe54f176,

title = "Cost-effective packaging of laser modules using LTCC substrates",

keywords = "low temperature co-fired ceramic, LTCC, electronics packaging, microelectronics packaging, lasers, optics",

author = "Kimmo Ker{\"a}nen and Jukka-Tapani M{\"a}kinen and Juhani Heilala and Otso V{\"a}{\"a}t{\"a}inen and Kari Kautio and Jyrki Ollila and Jarno Pet{\"a}j{\"a} and Mikko Karppinen and Veli Heikkinen and Pentti Karioja",

year = "2004",

doi = "10.1117/12.528280",

language = "English",

series = "Proceedings of SPIE",

publisher = "International Society for Optics and Photonics SPIE",

pages = "111--121",

booktitle = "Photonics Packaging and Integration IV",

address = "United States",

note = "Integrated Optoelectronic Devices 2004 : Photonics Packaging and Integration IV ; Conference date: 26-01-2004 Through 29-01-2004",

}

Keränen, K, Mäkinen, J-T, Heilala, J, Väätäinen, O, Kautio, K, Ollila, J , Petäjä, J , Karppinen, M, Heikkinen, V & Karioja, P 2004, Cost-effective packaging of laser modules using LTCC substrates. in Photonics Packaging and Integration IV. International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 5358, pp. 111-121, Integrated Optoelectronic Devices 2004, San Jose, California, United States, 26/01/04. https://doi.org/10.1117/12.528280

Cost-effective packaging of laser modules using LTCC substrates. / Keränen, Kimmo; Mäkinen, Jukka-Tapani; Heilala, Juhani et al.
Photonics Packaging and Integration IV. International Society for Optics and Photonics SPIE, 2004. p. 111-121 (Proceedings of SPIE, Vol. 5358).

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Cost-effective packaging of laser modules using LTCC substrates

AU - Keränen, Kimmo

AU - Mäkinen, Jukka-Tapani

AU - Heilala, Juhani

AU - Väätäinen, Otso

AU - Kautio, Kari

AU - Ollila, Jyrki

AU - Petäjä, Jarno

AU - Karppinen, Mikko

AU - Heikkinen, Veli

AU - Karioja, Pentti

PY - 2004

Y1 - 2004

KW - low temperature co-fired ceramic

KW - LTCC

KW - electronics packaging

KW - microelectronics packaging

KW - lasers

KW - optics

U2 - 10.1117/12.528280

DO - 10.1117/12.528280

M3 - Conference article in proceedings

T3 - Proceedings of SPIE

SP - 111

EP - 121

BT - Photonics Packaging and Integration IV

PB - International Society for Optics and Photonics SPIE

T2 - Integrated Optoelectronic Devices 2004

Y2 - 26 January 2004 through 29 January 2004

ER -