Cost-effective packaging of laser modules using LTCC substrates

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

8 Citations (Scopus)
Original languageEnglish
Title of host publicationPhotonics Packaging and Integration IV
PublisherInternational Society for Optics and Photonics SPIE
Pages111-121
DOIs
Publication statusPublished - 2004
MoE publication typeA4 Article in a conference publication
EventIntegrated Optoelectronic Devices 2004: Photonics Packaging and Integration IV - San Jose, United States
Duration: 26 Jan 200429 Jan 2004

Publication series

SeriesProceedings of SPIE
Volume5358

Conference

ConferenceIntegrated Optoelectronic Devices 2004
CountryUnited States
CitySan Jose
Period26/01/0429/01/04

Keywords

  • low temperature co-fired ceramic
  • LTCC
  • electronics packaging
  • microelectronics packaging
  • lasers
  • optics

Cite this

Keränen, K., Mäkinen, J-T., Heilala, J., Väätäinen, O., Kautio, K., Ollila, J., Petäjä, J., Karppinen, M., Heikkinen, V., & Karioja, P. (2004). Cost-effective packaging of laser modules using LTCC substrates. In Photonics Packaging and Integration IV (pp. 111-121). International Society for Optics and Photonics SPIE. Proceedings of SPIE, Vol.. 5358 https://doi.org/10.1117/12.528280