Cost-effective packaging of laser modules using LTCC substrates

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

8 Citations (Scopus)
Original languageEnglish
Title of host publicationPhotonics Packaging and Integration IV
PublisherInternational Society for Optics and Photonics SPIE
Pages111-121
DOIs
Publication statusPublished - 2004
MoE publication typeA4 Article in a conference publication
EventIntegrated Optoelectronic Devices 2004: Photonics Packaging and Integration IV - San Jose, United States
Duration: 26 Jan 200429 Jan 2004

Publication series

NameProceedings of SPIE
PublisherSPIE
Volume5358

Conference

ConferenceIntegrated Optoelectronic Devices 2004
CountryUnited States
CitySan Jose
Period26/01/0429/01/04

Keywords

  • low temperature co-fired ceramic
  • LTCC
  • electronics packaging
  • microelectronics packaging
  • lasers
  • optics

Cite this

Keränen, K., Mäkinen, J-T., Heilala, J., Väätäinen, O., Kautio, K., Ollila, J., ... Karioja, P. (2004). Cost-effective packaging of laser modules using LTCC substrates. In Photonics Packaging and Integration IV (pp. 111-121). International Society for Optics and Photonics SPIE. Proceedings of SPIE, Vol.. 5358 https://doi.org/10.1117/12.528280
Keränen, Kimmo ; Mäkinen, Jukka-Tapani ; Heilala, Juhani ; Väätäinen, Otso ; Kautio, Kari ; Ollila, Jyrki ; Petäjä, Jarno ; Karppinen, Mikko ; Heikkinen, Veli ; Karioja, Pentti. / Cost-effective packaging of laser modules using LTCC substrates. Photonics Packaging and Integration IV. International Society for Optics and Photonics SPIE, 2004. pp. 111-121 (Proceedings of SPIE, Vol. 5358).
@inproceedings{1d2bf39a24fe44928fecff8ffe54f176,
title = "Cost-effective packaging of laser modules using LTCC substrates",
keywords = "low temperature co-fired ceramic, LTCC, electronics packaging, microelectronics packaging, lasers, optics",
author = "Kimmo Ker{\"a}nen and Jukka-Tapani M{\"a}kinen and Juhani Heilala and Otso V{\"a}{\"a}t{\"a}inen and Kari Kautio and Jyrki Ollila and Jarno Pet{\"a}j{\"a} and Mikko Karppinen and Veli Heikkinen and Pentti Karioja",
year = "2004",
doi = "10.1117/12.528280",
language = "English",
series = "Proceedings of SPIE",
publisher = "International Society for Optics and Photonics SPIE",
pages = "111--121",
booktitle = "Photonics Packaging and Integration IV",
address = "United States",

}

Keränen, K, Mäkinen, J-T, Heilala, J, Väätäinen, O, Kautio, K, Ollila, J, Petäjä, J, Karppinen, M, Heikkinen, V & Karioja, P 2004, Cost-effective packaging of laser modules using LTCC substrates. in Photonics Packaging and Integration IV. International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 5358, pp. 111-121, Integrated Optoelectronic Devices 2004, San Jose, United States, 26/01/04. https://doi.org/10.1117/12.528280

Cost-effective packaging of laser modules using LTCC substrates. / Keränen, Kimmo; Mäkinen, Jukka-Tapani; Heilala, Juhani; Väätäinen, Otso; Kautio, Kari; Ollila, Jyrki; Petäjä, Jarno; Karppinen, Mikko; Heikkinen, Veli; Karioja, Pentti.

Photonics Packaging and Integration IV. International Society for Optics and Photonics SPIE, 2004. p. 111-121 (Proceedings of SPIE, Vol. 5358).

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

TY - GEN

T1 - Cost-effective packaging of laser modules using LTCC substrates

AU - Keränen, Kimmo

AU - Mäkinen, Jukka-Tapani

AU - Heilala, Juhani

AU - Väätäinen, Otso

AU - Kautio, Kari

AU - Ollila, Jyrki

AU - Petäjä, Jarno

AU - Karppinen, Mikko

AU - Heikkinen, Veli

AU - Karioja, Pentti

PY - 2004

Y1 - 2004

KW - low temperature co-fired ceramic

KW - LTCC

KW - electronics packaging

KW - microelectronics packaging

KW - lasers

KW - optics

U2 - 10.1117/12.528280

DO - 10.1117/12.528280

M3 - Conference article in proceedings

T3 - Proceedings of SPIE

SP - 111

EP - 121

BT - Photonics Packaging and Integration IV

PB - International Society for Optics and Photonics SPIE

ER -

Keränen K, Mäkinen J-T, Heilala J, Väätäinen O, Kautio K, Ollila J et al. Cost-effective packaging of laser modules using LTCC substrates. In Photonics Packaging and Integration IV. International Society for Optics and Photonics SPIE. 2004. p. 111-121. (Proceedings of SPIE, Vol. 5358). https://doi.org/10.1117/12.528280