Abstract
In this work we show that an accurate and straightforward extraction of the contact resistivity from contact resistance data can be achieved using properly designed self-aligned test patterns. In this way, the parasitic effects are minimized and the contact resistivity can be derived using simple one-dimensional models as confirmed by our computer simulation. Experimental results obtained in self-aligned structures are presented for Al/CoSi 2/n+ Si and Al-Si/n+ Si contacts.
Original language | English |
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Pages (from-to) | 532-536 |
Journal | IEEE Transactions on Electron Devices |
Volume | 34 |
Issue number | 3 |
DOIs | |
Publication status | Published - 1987 |
MoE publication type | A1 Journal article-refereed |