Abstract
This paper presents the design, manufacturing and characterization of a parasitic patch microstrip D-band antenna and a 16-element segmented antenna array on a multilayer printed circuit board (PCB) targeted for 5G applications. The antennas are manufactured using printed circuit board technology with semi-additive processing (mSAP) of conductors on a multilayered substrate. The measured maximum gains for a single antenna and a 16-element array are respectively 9 dBi and 16.5 dBi at 157 GHz. The measured antenna array input matching bandwidth is 20 GHz.
Original language | English |
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Title of host publication | 2023 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2023 |
Publisher | IEEE Institute of Electrical and Electronic Engineers |
Pages | 597-601 |
Number of pages | 5 |
ISBN (Electronic) | 979-8-3503-1102-0 |
DOIs | |
Publication status | Published - 2023 |
MoE publication type | A4 Article in a conference publication |
Event | 2023 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2023 - Gothenburg, Sweden Duration: 6 Jun 2023 → 9 Jun 2023 |
Conference
Conference | 2023 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2023 |
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Country/Territory | Sweden |
City | Gothenburg |
Period | 6/06/23 → 9/06/23 |
Funding
ACKNOWLEDGMENT This work was conducted within the framework of the H2020 DRAGON project, which is partially funded by the Commission of the European Union (Grant Agreement No. 955699).
Keywords
- antenna
- antenna array
- D-band
- millimeter waves