D-Band Antenna and Array Designs for 5G Applications

Antti Lamminen, Mikko Kaunisto, Jussi Säily, Mikko Kantanen, Mario Schober, Alberto Chico, Juha Ala-Laurinaho, Vladimir Ermolov

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    1 Citation (Scopus)

    Abstract

    This paper presents the design, manufacturing and characterization of a parasitic patch microstrip D-band antenna and a 16-element segmented antenna array on a multilayer printed circuit board (PCB) targeted for 5G applications. The antennas are manufactured using printed circuit board technology with semi-additive processing (mSAP) of conductors on a multilayered substrate. The measured maximum gains for a single antenna and a 16-element array are respectively 9 dBi and 16.5 dBi at 157 GHz. The measured antenna array input matching bandwidth is 20 GHz.

    Original languageEnglish
    Title of host publication2023 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2023
    PublisherIEEE Institute of Electrical and Electronic Engineers
    Pages597-601
    Number of pages5
    ISBN (Electronic)979-8-3503-1102-0
    DOIs
    Publication statusPublished - 2023
    MoE publication typeA4 Article in a conference publication
    Event2023 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2023 - Gothenburg, Sweden
    Duration: 6 Jun 20239 Jun 2023

    Conference

    Conference2023 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2023
    Country/TerritorySweden
    CityGothenburg
    Period6/06/239/06/23

    Funding

    ACKNOWLEDGMENT This work was conducted within the framework of the H2020 DRAGON project, which is partially funded by the Commission of the European Union (Grant Agreement No. 955699).

    Keywords

    • antenna
    • antenna array
    • D-band
    • millimeter waves

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