D-Band Antenna and Array Designs for 5G Applications

Antti Lamminen; Mikko Kaunisto; Jussi Säily; Mikko Kantanen; Mario Schober; Alberto Chico; Juha Ala-Laurinaho; Vladimir Ermolov

doi:10.1109/EuCNC/6GSummit58263.2023.10188240

D-Band Antenna and Array Designs for 5G Applications

Antti Lamminen
, Mikko Kaunisto
, Jussi Säily
, Mikko Kantanen
, Mario Schober
, Alberto Chico
, Juha Ala-Laurinaho
, Vladimir Ermolov

Aalto University
AT&S Austria Technologie & Systemtechnik AG
TTI Telecommunications

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

5 Citations (Scopus)

Abstract

This paper presents the design, manufacturing and characterization of a parasitic patch microstrip D-band antenna and a 16-element segmented antenna array on a multilayer printed circuit board (PCB) targeted for 5G applications. The antennas are manufactured using printed circuit board technology with semi-additive processing (mSAP) of conductors on a multilayered substrate. The measured maximum gains for a single antenna and a 16-element array are respectively 9 dBi and 16.5 dBi at 157 GHz. The measured antenna array input matching bandwidth is 20 GHz.

Original language	English
Title of host publication	2023 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2023
Publisher	IEEE Institute of Electrical and Electronic Engineers
Pages	597-601
Number of pages	5
ISBN (Electronic)	979-8-3503-1102-0
DOIs	https://doi.org/10.1109/EuCNC/6GSummit58263.2023.10188240
Publication status	Published - 2023
MoE publication type	A4 Article in a conference publication
Event	2023 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2023 - Gothenburg, Sweden Duration: 6 Jun 2023 → 9 Jun 2023

Conference

Conference	2023 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2023
Country/Territory	Sweden
City	Gothenburg
Period	6/06/23 → 9/06/23

Funding

ACKNOWLEDGMENT This work was conducted within the framework of the H2020 DRAGON project, which is partially funded by the Commission of the European Union (Grant Agreement No. 955699).

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Keywords

antenna
antenna array
D-band
millimeter waves

Access to Document

10.1109/EuCNC/6GSummit58263.2023.10188240

Cite this

Lamminen, A., Kaunisto, M., Säily, J., Kantanen, M., Schober, M., Chico, A., Ala-Laurinaho, J., & Ermolov, V. (2023). D-Band Antenna and Array Designs for 5G Applications. In 2023 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2023 (pp. 597-601). IEEE Institute of Electrical and Electronic Engineers. https://doi.org/10.1109/EuCNC/6GSummit58263.2023.10188240

@inproceedings{f7bb309b1aca4782ad20fd587fc0ccce,

title = "D-Band Antenna and Array Designs for 5G Applications",

abstract = "This paper presents the design, manufacturing and characterization of a parasitic patch microstrip D-band antenna and a 16-element segmented antenna array on a multilayer printed circuit board (PCB) targeted for 5G applications. The antennas are manufactured using printed circuit board technology with semi-additive processing (mSAP) of conductors on a multilayered substrate. The measured maximum gains for a single antenna and a 16-element array are respectively 9 dBi and 16.5 dBi at 157 GHz. The measured antenna array input matching bandwidth is 20 GHz.",

keywords = "antenna, antenna array, D-band, millimeter waves",

author = "Antti Lamminen and Mikko Kaunisto and Jussi S{\"a}ily and Mikko Kantanen and Mario Schober and Alberto Chico and Juha Ala-Laurinaho and Vladimir Ermolov",

note = "Funding Information: ACKNOWLEDGMENT This work was conducted within the framework of the H2020 DRAGON project, which is partially funded by the Commission of the European Union (Grant Agreement No. 955699). Publisher Copyright: {\textcopyright} 2023 IEEE.; 2023 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2023 ; Conference date: 06-06-2023 Through 09-06-2023",

year = "2023",

doi = "10.1109/EuCNC/6GSummit58263.2023.10188240",

language = "English",

pages = "597--601",

booktitle = "2023 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2023",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

address = "United States",

}

Lamminen, A , Kaunisto, M , Säily, J , Kantanen, M, Schober, M, Chico, A, Ala-Laurinaho, J & Ermolov, V 2023, D-Band Antenna and Array Designs for 5G Applications. in 2023 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2023. IEEE Institute of Electrical and Electronic Engineers, pp. 597-601, 2023 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2023, Gothenburg, Sweden, 6/06/23. https://doi.org/10.1109/EuCNC/6GSummit58263.2023.10188240

D-Band Antenna and Array Designs for 5G Applications. / Lamminen, Antti ; Kaunisto, Mikko ; Säily, Jussi et al.
2023 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2023. IEEE Institute of Electrical and Electronic Engineers, 2023. p. 597-601.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

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T1 - D-Band Antenna and Array Designs for 5G Applications

AU - Lamminen, Antti

AU - Kaunisto, Mikko

AU - Säily, Jussi

AU - Kantanen, Mikko

AU - Schober, Mario

AU - Chico, Alberto

AU - Ala-Laurinaho, Juha

AU - Ermolov, Vladimir

N1 - Funding Information: ACKNOWLEDGMENT This work was conducted within the framework of the H2020 DRAGON project, which is partially funded by the Commission of the European Union (Grant Agreement No. 955699). Publisher Copyright: © 2023 IEEE.

PY - 2023

Y1 - 2023

N2 - This paper presents the design, manufacturing and characterization of a parasitic patch microstrip D-band antenna and a 16-element segmented antenna array on a multilayer printed circuit board (PCB) targeted for 5G applications. The antennas are manufactured using printed circuit board technology with semi-additive processing (mSAP) of conductors on a multilayered substrate. The measured maximum gains for a single antenna and a 16-element array are respectively 9 dBi and 16.5 dBi at 157 GHz. The measured antenna array input matching bandwidth is 20 GHz.

AB - This paper presents the design, manufacturing and characterization of a parasitic patch microstrip D-band antenna and a 16-element segmented antenna array on a multilayer printed circuit board (PCB) targeted for 5G applications. The antennas are manufactured using printed circuit board technology with semi-additive processing (mSAP) of conductors on a multilayered substrate. The measured maximum gains for a single antenna and a 16-element array are respectively 9 dBi and 16.5 dBi at 157 GHz. The measured antenna array input matching bandwidth is 20 GHz.

KW - antenna

KW - antenna array

KW - D-band

KW - millimeter waves

UR - https://www.scopus.com/pages/publications/85168419808

U2 - 10.1109/EuCNC/6GSummit58263.2023.10188240

DO - 10.1109/EuCNC/6GSummit58263.2023.10188240

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EP - 601

BT - 2023 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2023

PB - IEEE Institute of Electrical and Electronic Engineers

T2 - 2023 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2023

Y2 - 6 June 2023 through 9 June 2023

ER -

D-Band Antenna and Array Designs for 5G Applications

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D-Band Antenna and Array Designs for 5G Applications

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