Deep plasma etching of glass for fluidic devices with different mask materials

Kai Kolari, Ville Saarela, Sami Franssila

Research output: Contribution to journalArticleScientificpeer-review

48 Citations (Scopus)

Abstract

Deep reactive ion etching (DRIE) processes have been developed for fabricating fluidic devices in glass (Pyrex™ and fused silica) substrates with cavities deeper than 100 µm. By using a standard silicon wafer as the etch mask, patterned by silicon DRIE, very deep and nearly vertical structures can be etched into the glass. In this work, an atmospheric pressure chemical ionization chip was fabricated. Also the results show potential for satisfactory etch characteristics with Ni, amorphous silicon (a-Si) and SU-8 as mask materials.
Original languageEnglish
Article number064010
Number of pages6
JournalJournal of Micromechanics and Microengineering
Volume18
Issue number6
DOIs
Publication statusPublished - 2008
MoE publication typeA1 Journal article-refereed

Fingerprint Dive into the research topics of 'Deep plasma etching of glass for fluidic devices with different mask materials'. Together they form a unique fingerprint.

  • Cite this