Deep plasma etching of glass for fluidic devices with different mask materials

Kai Kolari, Ville Saarela, Sami Franssila

Research output: Contribution to journalArticleScientificpeer-review

45 Citations (Scopus)

Abstract

Deep reactive ion etching (DRIE) processes have been developed for fabricating fluidic devices in glass (Pyrex™ and fused silica) substrates with cavities deeper than 100 µm. By using a standard silicon wafer as the etch mask, patterned by silicon DRIE, very deep and nearly vertical structures can be etched into the glass. In this work, an atmospheric pressure chemical ionization chip was fabricated. Also the results show potential for satisfactory etch characteristics with Ni, amorphous silicon (a-Si) and SU-8 as mask materials.
Original languageEnglish
Article number064010
Number of pages6
JournalJournal of Micromechanics and Microengineering
Volume18
Issue number6
DOIs
Publication statusPublished - 2008
MoE publication typeA1 Journal article-refereed

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Fluidic devices
Plasma etching
Reactive ion etching
Masks
Glass
Silicon
Fused silica
Amorphous silicon
Silicon wafers
Atmospheric pressure
Ionization
Substrates

Cite this

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title = "Deep plasma etching of glass for fluidic devices with different mask materials",
abstract = "Deep reactive ion etching (DRIE) processes have been developed for fabricating fluidic devices in glass (Pyrex™ and fused silica) substrates with cavities deeper than 100 µm. By using a standard silicon wafer as the etch mask, patterned by silicon DRIE, very deep and nearly vertical structures can be etched into the glass. In this work, an atmospheric pressure chemical ionization chip was fabricated. Also the results show potential for satisfactory etch characteristics with Ni, amorphous silicon (a-Si) and SU-8 as mask materials.",
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Deep plasma etching of glass for fluidic devices with different mask materials. / Kolari, Kai; Saarela, Ville; Franssila, Sami.

In: Journal of Micromechanics and Microengineering, Vol. 18, No. 6, 064010, 2008.

Research output: Contribution to journalArticleScientificpeer-review

TY - JOUR

T1 - Deep plasma etching of glass for fluidic devices with different mask materials

AU - Kolari, Kai

AU - Saarela, Ville

AU - Franssila, Sami

PY - 2008

Y1 - 2008

N2 - Deep reactive ion etching (DRIE) processes have been developed for fabricating fluidic devices in glass (Pyrex™ and fused silica) substrates with cavities deeper than 100 µm. By using a standard silicon wafer as the etch mask, patterned by silicon DRIE, very deep and nearly vertical structures can be etched into the glass. In this work, an atmospheric pressure chemical ionization chip was fabricated. Also the results show potential for satisfactory etch characteristics with Ni, amorphous silicon (a-Si) and SU-8 as mask materials.

AB - Deep reactive ion etching (DRIE) processes have been developed for fabricating fluidic devices in glass (Pyrex™ and fused silica) substrates with cavities deeper than 100 µm. By using a standard silicon wafer as the etch mask, patterned by silicon DRIE, very deep and nearly vertical structures can be etched into the glass. In this work, an atmospheric pressure chemical ionization chip was fabricated. Also the results show potential for satisfactory etch characteristics with Ni, amorphous silicon (a-Si) and SU-8 as mask materials.

U2 - 10.1088/0960-1317/18/6/064010

DO - 10.1088/0960-1317/18/6/064010

M3 - Article

VL - 18

JO - Journal of Micromechanics and Microengineering

JF - Journal of Micromechanics and Microengineering

SN - 0960-1317

IS - 6

M1 - 064010

ER -