Deep plasma etching of glass for fluidic devices with different mask materials

Keyphrases

• Deep Reactive Ion Etching 100%
• Plasma Etching 100%
• Mask Material 100%
• Fluidic Device 100%
• Silicon Wafer 50%
• Amorphous Silicon 50%
• Reactive Ion Etching 50%
• SU-8 50%
• Vertical Structure 50%
• Etching Mask 50%
• Pyrex 50%
• Atmospheric Pressure Chemical Ionization 50%
• Fused Silica Substrate 50%
• Etch Characteristics 50%

INIS

• silicon 100%
• plasma 100%
• glass 100%
• masks 100%
• etching 100%
• fluidic devices 100%
• ions 66%
• substrates 33%
• atmospheric pressure 33%
• cavities 33%
• silica 33%
• ionization 33%
• pyrex 33%

Material Science

• Plasma Etching 100%
• Reactive Ion Etching 100%
• Fluidics 100%
• Silicon Wafer 50%
• Chemical Ionization 50%
• Silicon 50%
• Silicon Dioxide 50%
• Amorphous Silicon 50%