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Deep plasma etching of glass with a silicon shadow mask
Kai Kolari
VTT Technical Research Centre of Finland
Research output
:
Contribution to journal
›
Article
›
Scientific
›
peer-review
53
Citations (Scopus)
Overview
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Dive into the research topics of 'Deep plasma etching of glass with a silicon shadow mask'. Together they form a unique fingerprint.
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Keyphrases
Silicon Wafer
100%
Plasma Etching
100%
Shadow Mask
100%
Gas Composition
50%
Aspect Ratio
50%
Nonbonded
50%
Silica
50%
Gas Pressure
50%
Wafer
50%
Power Source
50%
Processing Stages
50%
Silica Glass
50%
Plasma Etching Process
50%
Deep Etching
50%
Etching Conditions
50%
Inductively Coupled Plasma Reactive Ion Etching
50%
Optimize the Etching Process
50%
Bias Power
50%
Engineering
Etching Process
100%
Shadow Mask
100%
Silicon Wafer
100%
Processing Step
50%
Inductively Coupled Plasma
50%
Gas Composition
50%
Gas Pressure
50%
Aspect Ratio
50%
Silicon Dioxide
50%
Fused Silica
50%
INIS
silicon
100%
plasma
100%
glass
100%
masks
100%
etching
100%
silica
28%
performance
14%
aspect ratio
14%
processing
14%
power
14%
gases
14%
ions
14%
tuning
14%
Material Science
Plasma Etching
100%
Silicon
100%
Silicon Wafer
50%
Silicon Dioxide
50%
Reactive Ion Etching
25%