Dense photonics integration on a micron-scale SOI waveguide platform

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    4 Citations (Scopus)

    Abstract

    Feasibility of micron-scale SOI waveguides for dense photonics integration is demonstrated. Compact circuits are obtained by applying multiple etching steps on 3-12 μm thick SOI layers. Optoelectronics is integrated on SOI using thermo compression bonding.
    Original languageEnglish
    Title of host publicationIEEE International Conference on Group IV Photonics GFP
    PublisherIEEE Institute of Electrical and Electronic Engineers
    Pages107-108
    Number of pages2
    ISBN (Electronic)978-1-4673-5804-0, 978-1-4673-5803-3
    DOIs
    Publication statusPublished - 2013
    MoE publication typeA4 Article in a conference publication
    Event10th International Conference on Group IV Photonics, GFP 2013 - Seoul, Korea, Democratic People's Republic of
    Duration: 28 Aug 201330 Aug 2013

    Conference

    Conference10th International Conference on Group IV Photonics, GFP 2013
    Abbreviated titleGFP 2013
    CountryKorea, Democratic People's Republic of
    CitySeoul
    Period28/08/1330/08/13

    Fingerprint

    SOI (semiconductors)
    platforms
    photonics
    waveguides
    etching

    Keywords

    • Hybrid integration
    • photonic integrated circuit
    • silicon photonics
    • silicon-on-insulator
    • waveguide

    Cite this

    Aalto, T., Cherchi, M., Harjanne, M., Kapulainen, M., & Ylinen, S. (2013). Dense photonics integration on a micron-scale SOI waveguide platform. In IEEE International Conference on Group IV Photonics GFP (pp. 107-108). IEEE Institute of Electrical and Electronic Engineers . https://doi.org/10.1109/Group4.2013.6644452
    Aalto, Timo ; Cherchi, Matteo ; Harjanne, Mikko ; Kapulainen, Markku ; Ylinen, Sami. / Dense photonics integration on a micron-scale SOI waveguide platform. IEEE International Conference on Group IV Photonics GFP. IEEE Institute of Electrical and Electronic Engineers , 2013. pp. 107-108
    @inproceedings{2348bb499168415f918207d3ed56014d,
    title = "Dense photonics integration on a micron-scale SOI waveguide platform",
    abstract = "Feasibility of micron-scale SOI waveguides for dense photonics integration is demonstrated. Compact circuits are obtained by applying multiple etching steps on 3-12 μm thick SOI layers. Optoelectronics is integrated on SOI using thermo compression bonding.",
    keywords = "Hybrid integration, photonic integrated circuit, silicon photonics, silicon-on-insulator, waveguide",
    author = "Timo Aalto and Matteo Cherchi and Mikko Harjanne and Markku Kapulainen and Sami Ylinen",
    year = "2013",
    doi = "10.1109/Group4.2013.6644452",
    language = "English",
    pages = "107--108",
    booktitle = "IEEE International Conference on Group IV Photonics GFP",
    publisher = "IEEE Institute of Electrical and Electronic Engineers",
    address = "United States",

    }

    Aalto, T, Cherchi, M, Harjanne, M, Kapulainen, M & Ylinen, S 2013, Dense photonics integration on a micron-scale SOI waveguide platform. in IEEE International Conference on Group IV Photonics GFP. IEEE Institute of Electrical and Electronic Engineers , pp. 107-108, 10th International Conference on Group IV Photonics, GFP 2013, Seoul, Korea, Democratic People's Republic of, 28/08/13. https://doi.org/10.1109/Group4.2013.6644452

    Dense photonics integration on a micron-scale SOI waveguide platform. / Aalto, Timo; Cherchi, Matteo; Harjanne, Mikko; Kapulainen, Markku; Ylinen, Sami.

    IEEE International Conference on Group IV Photonics GFP. IEEE Institute of Electrical and Electronic Engineers , 2013. p. 107-108.

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    TY - GEN

    T1 - Dense photonics integration on a micron-scale SOI waveguide platform

    AU - Aalto, Timo

    AU - Cherchi, Matteo

    AU - Harjanne, Mikko

    AU - Kapulainen, Markku

    AU - Ylinen, Sami

    PY - 2013

    Y1 - 2013

    N2 - Feasibility of micron-scale SOI waveguides for dense photonics integration is demonstrated. Compact circuits are obtained by applying multiple etching steps on 3-12 μm thick SOI layers. Optoelectronics is integrated on SOI using thermo compression bonding.

    AB - Feasibility of micron-scale SOI waveguides for dense photonics integration is demonstrated. Compact circuits are obtained by applying multiple etching steps on 3-12 μm thick SOI layers. Optoelectronics is integrated on SOI using thermo compression bonding.

    KW - Hybrid integration

    KW - photonic integrated circuit

    KW - silicon photonics

    KW - silicon-on-insulator

    KW - waveguide

    U2 - 10.1109/Group4.2013.6644452

    DO - 10.1109/Group4.2013.6644452

    M3 - Conference article in proceedings

    SP - 107

    EP - 108

    BT - IEEE International Conference on Group IV Photonics GFP

    PB - IEEE Institute of Electrical and Electronic Engineers

    ER -

    Aalto T, Cherchi M, Harjanne M, Kapulainen M, Ylinen S. Dense photonics integration on a micron-scale SOI waveguide platform. In IEEE International Conference on Group IV Photonics GFP. IEEE Institute of Electrical and Electronic Engineers . 2013. p. 107-108 https://doi.org/10.1109/Group4.2013.6644452