Dense photonics integration on a micron-scale SOI waveguide platform

Timo Aalto; Matteo Cherchi; Mikko Harjanne; Markku Kapulainen; Sami Ylinen

doi:10.1109/Group4.2013.6644452

Dense photonics integration on a micron-scale SOI waveguide platform

Timo Aalto, Matteo Cherchi, Mikko Harjanne, Markku Kapulainen, Sami Ylinen

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

4 Citations (Scopus)

Abstract

Feasibility of micron-scale SOI waveguides for dense photonics integration is demonstrated. Compact circuits are obtained by applying multiple etching steps on 3-12 μm thick SOI layers. Optoelectronics is integrated on SOI using thermo compression bonding.

Original language	English
Title of host publication	IEEE International Conference on Group IV Photonics GFP
Publisher	IEEE Institute of Electrical and Electronic Engineers
Pages	107-108
ISBN (Electronic)	978-1-4673-5804-0, 978-1-4673-5803-3
DOIs	https://doi.org/10.1109/Group4.2013.6644452
Publication status	Published - 2013
MoE publication type	A4 Article in a conference publication
Event	10th International Conference on Group IV Photonics, GFP 2013 - Seoul, Korea, Democratic People's Republic of Duration: 28 Aug 2013 → 30 Aug 2013

Conference

Conference	10th International Conference on Group IV Photonics, GFP 2013
Abbreviated title	GFP 2013
Country/Territory	Korea, Democratic People's Republic of
City	Seoul
Period	28/08/13 → 30/08/13

Keywords

Hybrid integration
photonic integrated circuit
silicon photonics
silicon-on-insulator
waveguide

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10.1109/Group4.2013.6644452

Cite this

@inproceedings{2348bb499168415f918207d3ed56014d,

title = "Dense photonics integration on a micron-scale SOI waveguide platform",

abstract = "Feasibility of micron-scale SOI waveguides for dense photonics integration is demonstrated. Compact circuits are obtained by applying multiple etching steps on 3-12 μm thick SOI layers. Optoelectronics is integrated on SOI using thermo compression bonding.",

keywords = "Hybrid integration, photonic integrated circuit, silicon photonics, silicon-on-insulator, waveguide",

author = "Timo Aalto and Matteo Cherchi and Mikko Harjanne and Markku Kapulainen and Sami Ylinen",

year = "2013",

doi = "10.1109/Group4.2013.6644452",

language = "English",

pages = "107--108",

booktitle = "IEEE International Conference on Group IV Photonics GFP",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

address = "United States",

note = "10th International Conference on Group IV Photonics, GFP 2013, GFP 2013 ; Conference date: 28-08-2013 Through 30-08-2013",

}

Aalto, T, Cherchi, M, Harjanne, M , Kapulainen, M & Ylinen, S 2013, Dense photonics integration on a micron-scale SOI waveguide platform. in IEEE International Conference on Group IV Photonics GFP. IEEE Institute of Electrical and Electronic Engineers, pp. 107-108, 10th International Conference on Group IV Photonics, GFP 2013, Seoul, Korea, Democratic People's Republic of, 28/08/13. https://doi.org/10.1109/Group4.2013.6644452

Dense photonics integration on a micron-scale SOI waveguide platform. / Aalto, Timo; Cherchi, Matteo; Harjanne, Mikko et al.
IEEE International Conference on Group IV Photonics GFP. IEEE Institute of Electrical and Electronic Engineers, 2013. p. 107-108.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Dense photonics integration on a micron-scale SOI waveguide platform

AU - Aalto, Timo

AU - Cherchi, Matteo

AU - Harjanne, Mikko

AU - Kapulainen, Markku

AU - Ylinen, Sami

PY - 2013

Y1 - 2013

N2 - Feasibility of micron-scale SOI waveguides for dense photonics integration is demonstrated. Compact circuits are obtained by applying multiple etching steps on 3-12 μm thick SOI layers. Optoelectronics is integrated on SOI using thermo compression bonding.

AB - Feasibility of micron-scale SOI waveguides for dense photonics integration is demonstrated. Compact circuits are obtained by applying multiple etching steps on 3-12 μm thick SOI layers. Optoelectronics is integrated on SOI using thermo compression bonding.

KW - Hybrid integration

KW - photonic integrated circuit

KW - silicon photonics

KW - silicon-on-insulator

KW - waveguide

U2 - 10.1109/Group4.2013.6644452

DO - 10.1109/Group4.2013.6644452

M3 - Conference article in proceedings

SP - 107

EP - 108

BT - IEEE International Conference on Group IV Photonics GFP

PB - IEEE Institute of Electrical and Electronic Engineers

T2 - 10th International Conference on Group IV Photonics, GFP 2013

Y2 - 28 August 2013 through 30 August 2013

ER -

Dense photonics integration on a micron-scale SOI waveguide platform

Abstract

Conference

Keywords

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