Dense photonics integration on a micron-scale SOI waveguide platform

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

4 Citations (Scopus)

Abstract

Feasibility of micron-scale SOI waveguides for dense photonics integration is demonstrated. Compact circuits are obtained by applying multiple etching steps on 3-12 μm thick SOI layers. Optoelectronics is integrated on SOI using thermo compression bonding.
Original languageEnglish
Title of host publicationIEEE International Conference on Group IV Photonics GFP
PublisherInstitute of Electrical and Electronic Engineers IEEE
Pages107-108
Number of pages2
ISBN (Electronic)978-1-4673-5804-0, 978-1-4673-5803-3
DOIs
Publication statusPublished - 2013
MoE publication typeA4 Article in a conference publication
Event10th International Conference on Group IV Photonics, GFP 2013 - Seoul, Korea, Democratic People's Republic of
Duration: 28 Aug 201330 Aug 2013

Conference

Conference10th International Conference on Group IV Photonics, GFP 2013
Abbreviated titleGFP 2013
CountryKorea, Democratic People's Republic of
CitySeoul
Period28/08/1330/08/13

Fingerprint

SOI (semiconductors)
platforms
photonics
waveguides
etching

Keywords

  • Hybrid integration
  • photonic integrated circuit
  • silicon photonics
  • silicon-on-insulator
  • waveguide

Cite this

Aalto, T., Cherchi, M., Harjanne, M., Kapulainen, M., & Ylinen, S. (2013). Dense photonics integration on a micron-scale SOI waveguide platform. In IEEE International Conference on Group IV Photonics GFP (pp. 107-108). Institute of Electrical and Electronic Engineers IEEE. https://doi.org/10.1109/Group4.2013.6644452
Aalto, Timo ; Cherchi, Matteo ; Harjanne, Mikko ; Kapulainen, Markku ; Ylinen, Sami. / Dense photonics integration on a micron-scale SOI waveguide platform. IEEE International Conference on Group IV Photonics GFP. Institute of Electrical and Electronic Engineers IEEE, 2013. pp. 107-108
@inproceedings{2348bb499168415f918207d3ed56014d,
title = "Dense photonics integration on a micron-scale SOI waveguide platform",
abstract = "Feasibility of micron-scale SOI waveguides for dense photonics integration is demonstrated. Compact circuits are obtained by applying multiple etching steps on 3-12 μm thick SOI layers. Optoelectronics is integrated on SOI using thermo compression bonding.",
keywords = "Hybrid integration, photonic integrated circuit, silicon photonics, silicon-on-insulator, waveguide",
author = "Timo Aalto and Matteo Cherchi and Mikko Harjanne and Markku Kapulainen and Sami Ylinen",
year = "2013",
doi = "10.1109/Group4.2013.6644452",
language = "English",
pages = "107--108",
booktitle = "IEEE International Conference on Group IV Photonics GFP",
publisher = "Institute of Electrical and Electronic Engineers IEEE",
address = "United States",

}

Aalto, T, Cherchi, M, Harjanne, M, Kapulainen, M & Ylinen, S 2013, Dense photonics integration on a micron-scale SOI waveguide platform. in IEEE International Conference on Group IV Photonics GFP. Institute of Electrical and Electronic Engineers IEEE, pp. 107-108, 10th International Conference on Group IV Photonics, GFP 2013, Seoul, Korea, Democratic People's Republic of, 28/08/13. https://doi.org/10.1109/Group4.2013.6644452

Dense photonics integration on a micron-scale SOI waveguide platform. / Aalto, Timo; Cherchi, Matteo; Harjanne, Mikko; Kapulainen, Markku; Ylinen, Sami.

IEEE International Conference on Group IV Photonics GFP. Institute of Electrical and Electronic Engineers IEEE, 2013. p. 107-108.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

TY - GEN

T1 - Dense photonics integration on a micron-scale SOI waveguide platform

AU - Aalto, Timo

AU - Cherchi, Matteo

AU - Harjanne, Mikko

AU - Kapulainen, Markku

AU - Ylinen, Sami

PY - 2013

Y1 - 2013

N2 - Feasibility of micron-scale SOI waveguides for dense photonics integration is demonstrated. Compact circuits are obtained by applying multiple etching steps on 3-12 μm thick SOI layers. Optoelectronics is integrated on SOI using thermo compression bonding.

AB - Feasibility of micron-scale SOI waveguides for dense photonics integration is demonstrated. Compact circuits are obtained by applying multiple etching steps on 3-12 μm thick SOI layers. Optoelectronics is integrated on SOI using thermo compression bonding.

KW - Hybrid integration

KW - photonic integrated circuit

KW - silicon photonics

KW - silicon-on-insulator

KW - waveguide

U2 - 10.1109/Group4.2013.6644452

DO - 10.1109/Group4.2013.6644452

M3 - Conference article in proceedings

SP - 107

EP - 108

BT - IEEE International Conference on Group IV Photonics GFP

PB - Institute of Electrical and Electronic Engineers IEEE

ER -

Aalto T, Cherchi M, Harjanne M, Kapulainen M, Ylinen S. Dense photonics integration on a micron-scale SOI waveguide platform. In IEEE International Conference on Group IV Photonics GFP. Institute of Electrical and Electronic Engineers IEEE. 2013. p. 107-108 https://doi.org/10.1109/Group4.2013.6644452