Dense photonics integration on a micron-scale SOI waveguide platform

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    4 Citations (Scopus)

    Abstract

    Feasibility of micron-scale SOI waveguides for dense photonics integration is demonstrated. Compact circuits are obtained by applying multiple etching steps on 3-12 μm thick SOI layers. Optoelectronics is integrated on SOI using thermo compression bonding.
    Original languageEnglish
    Title of host publicationIEEE International Conference on Group IV Photonics GFP
    PublisherIEEE Institute of Electrical and Electronic Engineers
    Pages107-108
    Number of pages2
    ISBN (Electronic)978-1-4673-5804-0, 978-1-4673-5803-3
    DOIs
    Publication statusPublished - 2013
    MoE publication typeA4 Article in a conference publication
    Event10th International Conference on Group IV Photonics, GFP 2013 - Seoul, Korea, Democratic People's Republic of
    Duration: 28 Aug 201330 Aug 2013

    Conference

    Conference10th International Conference on Group IV Photonics, GFP 2013
    Abbreviated titleGFP 2013
    CountryKorea, Democratic People's Republic of
    CitySeoul
    Period28/08/1330/08/13

    Keywords

    • Hybrid integration
    • photonic integrated circuit
    • silicon photonics
    • silicon-on-insulator
    • waveguide

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