Design and realisation of optoelectronic modules on a silicon-on-insulator platform

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    Abstract

    This paper covers various design and fabrication issues related to optical modules that are realised by hybrid integrating optoelectronic chips on a silicon-on-insulator (SOI) waveguide platform. Discussed topics include single-moded SOI waveguide devices, 10 Gb/s microwave lines, thermo-compression bonded laser and amplifier chips, local hermetic sealing and thermal design.
    Original languageEnglish
    Title of host publicationProceedings of the 12th International Symposium on Microwave and Optical Technology, ISMOT 2009
    Place of PublicationNew Delhi
    Pages781-784
    Publication statusPublished - 2009
    MoE publication typeA4 Article in a conference publication
    Event12th International Symposium on Microwave and Optical Technology, ISMOT 2009 - New Delhi, India
    Duration: 16 Dec 200919 Dec 2009

    Conference

    Conference12th International Symposium on Microwave and Optical Technology, ISMOT 2009
    Abbreviated titleISMOT 2009
    CountryIndia
    CityNew Delhi
    Period16/12/0919/12/09

    Keywords

    • Hybrid integration
    • photonic integrated circuits
    • RF lines
    • silicon-on-insulator
    • SOI waveguides

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  • Cite this

    Aalto, T., Harjanne, M., Kapulainen, M., Ylinen, S., Heimala, P., Stuns, I., Kovero, T., & Ollila, J. (2009). Design and realisation of optoelectronic modules on a silicon-on-insulator platform. In Proceedings of the 12th International Symposium on Microwave and Optical Technology, ISMOT 2009 (pp. 781-784).