Design and realisation of optoelectronic modules on a silicon-on-insulator platform

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

This paper covers various design and fabrication issues related to optical modules that are realised by hybrid integrating optoelectronic chips on a silicon-on-insulator (SOI) waveguide platform. Discussed topics include single-moded SOI waveguide devices, 10 Gb/s microwave lines, thermo-compression bonded laser and amplifier chips, local hermetic sealing and thermal design.
Original languageEnglish
Title of host publicationProceedings of the 12th International Symposium on Microwave and Optical Technology, ISMOT 2009
Place of PublicationNew Delhi
Pages781-784
Publication statusPublished - 2009
MoE publication typeA4 Article in a conference publication
Event12th International Symposium on Microwave and Optical Technology, ISMOT 2009 - New Delhi, India
Duration: 16 Dec 200919 Dec 2009

Conference

Conference12th International Symposium on Microwave and Optical Technology, ISMOT 2009
Abbreviated titleISMOT 2009
CountryIndia
CityNew Delhi
Period16/12/0919/12/09

Fingerprint

platforms
modules
chips
insulators
waveguides
sealing
silicon
amplifiers
microwaves
fabrication
lasers

Keywords

  • Hybrid integration
  • photonic integrated circuits
  • RF lines
  • silicon-on-insulator
  • SOI waveguides

Cite this

Aalto, T., Harjanne, M., Kapulainen, M., Ylinen, S., Heimala, P., Stuns, I., ... Ollila, J. (2009). Design and realisation of optoelectronic modules on a silicon-on-insulator platform. In Proceedings of the 12th International Symposium on Microwave and Optical Technology, ISMOT 2009 (pp. 781-784). New Delhi.
Aalto, Timo ; Harjanne, Mikko ; Kapulainen, Markku ; Ylinen, Sami ; Heimala, Päivi ; Stuns, Ingmar ; Kovero, Tomi ; Ollila, Jyrki. / Design and realisation of optoelectronic modules on a silicon-on-insulator platform. Proceedings of the 12th International Symposium on Microwave and Optical Technology, ISMOT 2009. New Delhi, 2009. pp. 781-784
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title = "Design and realisation of optoelectronic modules on a silicon-on-insulator platform",
abstract = "This paper covers various design and fabrication issues related to optical modules that are realised by hybrid integrating optoelectronic chips on a silicon-on-insulator (SOI) waveguide platform. Discussed topics include single-moded SOI waveguide devices, 10 Gb/s microwave lines, thermo-compression bonded laser and amplifier chips, local hermetic sealing and thermal design.",
keywords = "Hybrid integration, photonic integrated circuits, RF lines, silicon-on-insulator, SOI waveguides",
author = "Timo Aalto and Mikko Harjanne and Markku Kapulainen and Sami Ylinen and P{\"a}ivi Heimala and Ingmar Stuns and Tomi Kovero and Jyrki Ollila",
year = "2009",
language = "English",
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Aalto, T, Harjanne, M, Kapulainen, M, Ylinen, S, Heimala, P, Stuns, I, Kovero, T & Ollila, J 2009, Design and realisation of optoelectronic modules on a silicon-on-insulator platform. in Proceedings of the 12th International Symposium on Microwave and Optical Technology, ISMOT 2009. New Delhi, pp. 781-784, 12th International Symposium on Microwave and Optical Technology, ISMOT 2009, New Delhi, India, 16/12/09.

Design and realisation of optoelectronic modules on a silicon-on-insulator platform. / Aalto, Timo; Harjanne, Mikko; Kapulainen, Markku; Ylinen, Sami; Heimala, Päivi; Stuns, Ingmar; Kovero, Tomi; Ollila, Jyrki.

Proceedings of the 12th International Symposium on Microwave and Optical Technology, ISMOT 2009. New Delhi, 2009. p. 781-784.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

TY - GEN

T1 - Design and realisation of optoelectronic modules on a silicon-on-insulator platform

AU - Aalto, Timo

AU - Harjanne, Mikko

AU - Kapulainen, Markku

AU - Ylinen, Sami

AU - Heimala, Päivi

AU - Stuns, Ingmar

AU - Kovero, Tomi

AU - Ollila, Jyrki

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N2 - This paper covers various design and fabrication issues related to optical modules that are realised by hybrid integrating optoelectronic chips on a silicon-on-insulator (SOI) waveguide platform. Discussed topics include single-moded SOI waveguide devices, 10 Gb/s microwave lines, thermo-compression bonded laser and amplifier chips, local hermetic sealing and thermal design.

AB - This paper covers various design and fabrication issues related to optical modules that are realised by hybrid integrating optoelectronic chips on a silicon-on-insulator (SOI) waveguide platform. Discussed topics include single-moded SOI waveguide devices, 10 Gb/s microwave lines, thermo-compression bonded laser and amplifier chips, local hermetic sealing and thermal design.

KW - Hybrid integration

KW - photonic integrated circuits

KW - RF lines

KW - silicon-on-insulator

KW - SOI waveguides

M3 - Conference article in proceedings

SN - 0230-32846-6

SP - 781

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BT - Proceedings of the 12th International Symposium on Microwave and Optical Technology, ISMOT 2009

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Aalto T, Harjanne M, Kapulainen M, Ylinen S, Heimala P, Stuns I et al. Design and realisation of optoelectronic modules on a silicon-on-insulator platform. In Proceedings of the 12th International Symposium on Microwave and Optical Technology, ISMOT 2009. New Delhi. 2009. p. 781-784