Design and realisation of optoelectronic modules on a silicon-on-insulator platform

Timo Aalto; Mikko Harjanne; Markku Kapulainen; Sami Ylinen; Päivi Heimala; Ingmar Stuns; Tomi Kovero; Jyrki Ollila

Design and realisation of optoelectronic modules on a silicon-on-insulator platform

Timo Aalto, Mikko Harjanne, Markku Kapulainen, Sami Ylinen, Päivi Heimala, Ingmar Stuns, Tomi Kovero, Jyrki Ollila

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

Abstract

This paper covers various design and fabrication issues related to optical modules that are realised by hybrid integrating optoelectronic chips on a silicon-on-insulator (SOI) waveguide platform. Discussed topics include single-moded SOI waveguide devices, 10 Gb/s microwave lines, thermo-compression bonded laser and amplifier chips, local hermetic sealing and thermal design.

Original language	English
Title of host publication	Proceedings of the 12th International Symposium on Microwave and Optical Technology, ISMOT 2009
Place of Publication	New Delhi
Pages	781-784
Publication status	Published - 2009
MoE publication type	A4 Article in a conference publication
Event	12th International Symposium on Microwave and Optical Technology, ISMOT 2009 - New Delhi, India Duration: 16 Dec 2009 → 19 Dec 2009

Conference

Conference	12th International Symposium on Microwave and Optical Technology, ISMOT 2009
Abbreviated title	ISMOT 2009
Country/Territory	India
City	New Delhi
Period	16/12/09 → 19/12/09

Keywords

Hybrid integration
photonic integrated circuits
RF lines
silicon-on-insulator
SOI waveguides

Cite this

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title = "Design and realisation of optoelectronic modules on a silicon-on-insulator platform",

abstract = "This paper covers various design and fabrication issues related to optical modules that are realised by hybrid integrating optoelectronic chips on a silicon-on-insulator (SOI) waveguide platform. Discussed topics include single-moded SOI waveguide devices, 10 Gb/s microwave lines, thermo-compression bonded laser and amplifier chips, local hermetic sealing and thermal design.",

keywords = "Hybrid integration, photonic integrated circuits, RF lines, silicon-on-insulator, SOI waveguides",

author = "Timo Aalto and Mikko Harjanne and Markku Kapulainen and Sami Ylinen and P{\"a}ivi Heimala and Ingmar Stuns and Tomi Kovero and Jyrki Ollila",

year = "2009",

language = "English",

isbn = "0230-32846-6",

pages = "781--784",

booktitle = "Proceedings of the 12th International Symposium on Microwave and Optical Technology, ISMOT 2009",

note = "12th International Symposium on Microwave and Optical Technology, ISMOT 2009, ISMOT 2009 ; Conference date: 16-12-2009 Through 19-12-2009",

}

Aalto, T , Harjanne, M , Kapulainen, M , Ylinen, S , Heimala, P , Stuns, I, Kovero, T & Ollila, J 2009, Design and realisation of optoelectronic modules on a silicon-on-insulator platform. in Proceedings of the 12th International Symposium on Microwave and Optical Technology, ISMOT 2009. New Delhi, pp. 781-784, 12th International Symposium on Microwave and Optical Technology, ISMOT 2009, New Delhi, India, 16/12/09.

Design and realisation of optoelectronic modules on a silicon-on-insulator platform. / Aalto, Timo ; Harjanne, Mikko ; Kapulainen, Markku et al.
Proceedings of the 12th International Symposium on Microwave and Optical Technology, ISMOT 2009. New Delhi, 2009. p. 781-784.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Design and realisation of optoelectronic modules on a silicon-on-insulator platform

AU - Aalto, Timo

AU - Harjanne, Mikko

AU - Kapulainen, Markku

AU - Ylinen, Sami

AU - Heimala, Päivi

AU - Stuns, Ingmar

AU - Kovero, Tomi

AU - Ollila, Jyrki

PY - 2009

Y1 - 2009

N2 - This paper covers various design and fabrication issues related to optical modules that are realised by hybrid integrating optoelectronic chips on a silicon-on-insulator (SOI) waveguide platform. Discussed topics include single-moded SOI waveguide devices, 10 Gb/s microwave lines, thermo-compression bonded laser and amplifier chips, local hermetic sealing and thermal design.

AB - This paper covers various design and fabrication issues related to optical modules that are realised by hybrid integrating optoelectronic chips on a silicon-on-insulator (SOI) waveguide platform. Discussed topics include single-moded SOI waveguide devices, 10 Gb/s microwave lines, thermo-compression bonded laser and amplifier chips, local hermetic sealing and thermal design.

KW - Hybrid integration

KW - photonic integrated circuits

KW - RF lines

KW - silicon-on-insulator

KW - SOI waveguides

M3 - Conference article in proceedings

SN - 0230-32846-6

SP - 781

EP - 784

BT - Proceedings of the 12th International Symposium on Microwave and Optical Technology, ISMOT 2009

CY - New Delhi

T2 - 12th International Symposium on Microwave and Optical Technology, ISMOT 2009

Y2 - 16 December 2009 through 19 December 2009

ER -

Design and realisation of optoelectronic modules on a silicon-on-insulator platform

Abstract

Conference

Keywords

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