Design and validation of a novel master-making process chain for organic and large area electronics on flexible substrates

V. Velkova (Corresponding Author), G. Lalev, H. Hirshy, S. Scholz, Johanna Hiitola-Keinänen, Herbert Gold, Anja Haase, Jukka Hast, Barbara Stadlober, S. Dimov

Research output: Contribution to journalArticleScientificpeer-review

15 Citations (Scopus)

Abstract

This paper presents a novel process chain for fabrication of replication masters for serial manufacture. The proposed process chain is validated for serial fabrication of (large area) organic electronic devices on flexible substrates. The advantages and limitations of the component technologies in the proposed manufacturing route are discussed and their interdependencies in a process chain for producing both 2.5D and 3D nano- and micro-structures are analysed. The proposed master-making route relies on using different technologies for micro-structuring and sub-micron and nano patterning that are applied to the fabrication of Ni shims incorporating different length scale features. In particular, the capabilities of photolithography as a micro-structuring technology were combined with those of FIB machining to add sub-micron and nano-features on micro patterned fused silica templates. Then, by applying UV nanoimprint lithography such templates were validated and their nano and micro-structures were consistently replicated in one step. Finally, the feature transfer of such imprints onto Ni shims was also successfully accomplished with only minor deviations from the target dimensions.
Original languageEnglish
Pages (from-to)2139-2145
Number of pages7
JournalMicroelectronic Engineering
Volume87
Issue number11
DOIs
Publication statusPublished - 2010
MoE publication typeA1 Journal article-refereed

Fingerprint

Shims
Electronic equipment
Fabrication
fabrication
Substrates
templates
routes
electronics
Nanoimprint lithography
microstructure
Microstructure
Photolithography
Fused silica
photolithography
machining
Machining
lithography
manufacturing
silicon dioxide
deviation

Keywords

  • FIB
  • UV-NIL
  • Electroforming
  • R2R
  • Process chain
  • Tool manufacture
  • Organic electronics
  • OTFT

Cite this

Velkova, V. ; Lalev, G. ; Hirshy, H. ; Scholz, S. ; Hiitola-Keinänen, Johanna ; Gold, Herbert ; Haase, Anja ; Hast, Jukka ; Stadlober, Barbara ; Dimov, S. / Design and validation of a novel master-making process chain for organic and large area electronics on flexible substrates. In: Microelectronic Engineering. 2010 ; Vol. 87, No. 11. pp. 2139-2145.
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abstract = "This paper presents a novel process chain for fabrication of replication masters for serial manufacture. The proposed process chain is validated for serial fabrication of (large area) organic electronic devices on flexible substrates. The advantages and limitations of the component technologies in the proposed manufacturing route are discussed and their interdependencies in a process chain for producing both 2.5D and 3D nano- and micro-structures are analysed. The proposed master-making route relies on using different technologies for micro-structuring and sub-micron and nano patterning that are applied to the fabrication of Ni shims incorporating different length scale features. In particular, the capabilities of photolithography as a micro-structuring technology were combined with those of FIB machining to add sub-micron and nano-features on micro patterned fused silica templates. Then, by applying UV nanoimprint lithography such templates were validated and their nano and micro-structures were consistently replicated in one step. Finally, the feature transfer of such imprints onto Ni shims was also successfully accomplished with only minor deviations from the target dimensions.",
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Design and validation of a novel master-making process chain for organic and large area electronics on flexible substrates. / Velkova, V. (Corresponding Author); Lalev, G.; Hirshy, H.; Scholz, S.; Hiitola-Keinänen, Johanna; Gold, Herbert; Haase, Anja; Hast, Jukka; Stadlober, Barbara; Dimov, S.

In: Microelectronic Engineering, Vol. 87, No. 11, 2010, p. 2139-2145.

Research output: Contribution to journalArticleScientificpeer-review

TY - JOUR

T1 - Design and validation of a novel master-making process chain for organic and large area electronics on flexible substrates

AU - Velkova, V.

AU - Lalev, G.

AU - Hirshy, H.

AU - Scholz, S.

AU - Hiitola-Keinänen, Johanna

AU - Gold, Herbert

AU - Haase, Anja

AU - Hast, Jukka

AU - Stadlober, Barbara

AU - Dimov, S.

N1 - Project code: 19813

PY - 2010

Y1 - 2010

N2 - This paper presents a novel process chain for fabrication of replication masters for serial manufacture. The proposed process chain is validated for serial fabrication of (large area) organic electronic devices on flexible substrates. The advantages and limitations of the component technologies in the proposed manufacturing route are discussed and their interdependencies in a process chain for producing both 2.5D and 3D nano- and micro-structures are analysed. The proposed master-making route relies on using different technologies for micro-structuring and sub-micron and nano patterning that are applied to the fabrication of Ni shims incorporating different length scale features. In particular, the capabilities of photolithography as a micro-structuring technology were combined with those of FIB machining to add sub-micron and nano-features on micro patterned fused silica templates. Then, by applying UV nanoimprint lithography such templates were validated and their nano and micro-structures were consistently replicated in one step. Finally, the feature transfer of such imprints onto Ni shims was also successfully accomplished with only minor deviations from the target dimensions.

AB - This paper presents a novel process chain for fabrication of replication masters for serial manufacture. The proposed process chain is validated for serial fabrication of (large area) organic electronic devices on flexible substrates. The advantages and limitations of the component technologies in the proposed manufacturing route are discussed and their interdependencies in a process chain for producing both 2.5D and 3D nano- and micro-structures are analysed. The proposed master-making route relies on using different technologies for micro-structuring and sub-micron and nano patterning that are applied to the fabrication of Ni shims incorporating different length scale features. In particular, the capabilities of photolithography as a micro-structuring technology were combined with those of FIB machining to add sub-micron and nano-features on micro patterned fused silica templates. Then, by applying UV nanoimprint lithography such templates were validated and their nano and micro-structures were consistently replicated in one step. Finally, the feature transfer of such imprints onto Ni shims was also successfully accomplished with only minor deviations from the target dimensions.

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KW - Electroforming

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KW - OTFT

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DO - 10.1016/j.mee.2010.01.015

M3 - Article

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