Design and validation of a novel master-making process chain for organic and large area electronics on flexible substrates

V. Velkova (Corresponding Author), G. Lalev, H. Hirshy, S. Scholz, Johanna Hiitola-Keinänen, Herbert Gold, Anja Haase, Jukka Hast, Barbara Stadlober, S. Dimov

    Research output: Contribution to journalArticlepeer-review

    16 Citations (Scopus)

    Abstract

    This paper presents a novel process chain for fabrication of replication masters for serial manufacture. The proposed process chain is validated for serial fabrication of (large area) organic electronic devices on flexible substrates. The advantages and limitations of the component technologies in the proposed manufacturing route are discussed and their interdependencies in a process chain for producing both 2.5D and 3D nano- and micro-structures are analysed. The proposed master-making route relies on using different technologies for micro-structuring and sub-micron and nano patterning that are applied to the fabrication of Ni shims incorporating different length scale features. In particular, the capabilities of photolithography as a micro-structuring technology were combined with those of FIB machining to add sub-micron and nano-features on micro patterned fused silica templates. Then, by applying UV nanoimprint lithography such templates were validated and their nano and micro-structures were consistently replicated in one step. Finally, the feature transfer of such imprints onto Ni shims was also successfully accomplished with only minor deviations from the target dimensions.
    Original languageEnglish
    Pages (from-to)2139-2145
    Number of pages7
    JournalMicroelectronic Engineering
    Volume87
    Issue number11
    DOIs
    Publication statusPublished - 2010
    MoE publication typeA1 Journal article-refereed

    Keywords

    • FIB
    • UV-NIL
    • Electroforming
    • R2R
    • Process chain
    • Tool manufacture
    • Organic electronics
    • OTFT

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