Design for photonics modules - combining optical geometrical and assembly process tolerance simulation in concept creation

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

Designing cost-effective photonics modules is a challenging task. One of the principal costs underlying photonic components has been the cost of assembly, attachment and packaging. Until recentrly, photonic devices were mainly assembled manually. Passive optical alignment is one solution for automation, mass production and cost reduction. In this article, the authors review the midterm results of ongoing studies carried out jointly by different VTT research institutes, the University of Oulu and inductry. One of the aims is to analyse and simulate photonics module concepts and thus evaluate different solutions, primarily in a bid to find a cost-effective solution. This article presents a design and analysis process for the concept development phase based on a case study. The process utilises optical tolerance analysis and mechanical, geometrical and assembly process tolerance analysis. The process is illustrated with a case study in which a LTCC (Low Temperature Co-fired Ceramics) platform is used to anable passive anlignment in butt coupling of a laser chip and multi-mode optical fibre.
Original languageEnglish
Title of host publicationProceeding of the IPAS 2004 International Precision Assembly Seminar
Pages199-204
Publication statusPublished - 2004
MoE publication typeA4 Article in a conference publication
Event International Precision Assembly Seminar, IPAS 2004 - Bad Hofgastein, Austria
Duration: 11 Feb 200413 Feb 2004

Seminar

Seminar International Precision Assembly Seminar, IPAS 2004
CountryAustria
CityBad Hofgastein
Period11/02/0413/02/04

Keywords

  • photonics modules
  • optical and geometrical tolerance

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