Design for photonics modules - combining optical geometrical and assembly process tolerance simulation in concept creation

Designing cost-effective photonics modules is a challenging task. One of the principal costs underlying photonic components has been the cost of assembly, attachment and packaging. Until recentrly, photonic devices were mainly assembled manually. Passive optical alignment is one solution for automation, mass production and cost reduction. In this article, the authors review the midterm results of ongoing studies carried out jointly by different VTT research institutes, the University of Oulu and inductry. One of the aims is to analyse and simulate photonics module concepts and thus evaluate different solutions, primarily in a bid to find a cost-effective solution. This article presents a design and analysis process for the concept development phase based on a case study. The process utilises optical tolerance analysis and mechanical, geometrical and assembly process tolerance analysis. The process is illustrated with a case study in which a LTCC (Low Temperature Co-fired Ceramics) platform is used to anable passive anlignment in butt coupling of a laser chip and multi-mode optical fibre.