Design for photonics modules - combining optical geometrical and assembly process tolerance simulation in concept creation

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

Designing cost-effective photonics modules is a challenging task. One of the principal costs underlying photonic components has been the cost of assembly, attachment and packaging. Until recentrly, photonic devices were mainly assembled manually. Passive optical alignment is one solution for automation, mass production and cost reduction. In this article, the authors review the midterm results of ongoing studies carried out jointly by different VTT research institutes, the University of Oulu and inductry. One of the aims is to analyse and simulate photonics module concepts and thus evaluate different solutions, primarily in a bid to find a cost-effective solution. This article presents a design and analysis process for the concept development phase based on a case study. The process utilises optical tolerance analysis and mechanical, geometrical and assembly process tolerance analysis. The process is illustrated with a case study in which a LTCC (Low Temperature Co-fired Ceramics) platform is used to anable passive anlignment in butt coupling of a laser chip and multi-mode optical fibre.
Original languageEnglish
Title of host publicationProceeding of the IPAS 2004 International Precision Assembly Seminar
Pages199-204
Publication statusPublished - 2004
MoE publication typeA4 Article in a conference publication
EventIPAS 2004 International Precision Assembly Seminar - Bad Hofgastein, Salzburg, Austria
Duration: 11 Feb 200413 Feb 2004

Seminar

SeminarIPAS 2004 International Precision Assembly Seminar
CountryAustria
CitySalzburg
Period11/02/0413/02/04

Fingerprint

Photonics
Costs
Photonic devices
Laser modes
Cost reduction
Optical fibers
Packaging
Automation
Lasers
Temperature

Keywords

  • photonics modules
  • optical and geometrical tolerance

Cite this

@inproceedings{e0e0e278b5c94e8e874dce864e0c4868,
title = "Design for photonics modules - combining optical geometrical and assembly process tolerance simulation in concept creation",
abstract = "Designing cost-effective photonics modules is a challenging task. One of the principal costs underlying photonic components has been the cost of assembly, attachment and packaging. Until recentrly, photonic devices were mainly assembled manually. Passive optical alignment is one solution for automation, mass production and cost reduction. In this article, the authors review the midterm results of ongoing studies carried out jointly by different VTT research institutes, the University of Oulu and inductry. One of the aims is to analyse and simulate photonics module concepts and thus evaluate different solutions, primarily in a bid to find a cost-effective solution. This article presents a design and analysis process for the concept development phase based on a case study. The process utilises optical tolerance analysis and mechanical, geometrical and assembly process tolerance analysis. The process is illustrated with a case study in which a LTCC (Low Temperature Co-fired Ceramics) platform is used to anable passive anlignment in butt coupling of a laser chip and multi-mode optical fibre.",
keywords = "photonics modules, optical and geometrical tolerance",
author = "Juhani Heilala and Otso V{\"a}{\"a}t{\"a}inen and Kimmo Ker{\"a}nen and Jukka-Tapani M{\"a}kinen and Kari Kautio and Jyrki Ollila and Jarno Pet{\"a}j{\"a} and Mikko Karppinen and Veli Heikkinen and Pentti Karioja",
note = "Project code: G4SU00322 Project code: G4SU00369",
year = "2004",
language = "English",
pages = "199--204",
booktitle = "Proceeding of the IPAS 2004 International Precision Assembly Seminar",

}

Heilala, J, Väätäinen, O, Keränen, K, Mäkinen, J-T, Kautio, K, Ollila, J, Petäjä, J, Karppinen, M, Heikkinen, V & Karioja, P 2004, Design for photonics modules - combining optical geometrical and assembly process tolerance simulation in concept creation. in Proceeding of the IPAS 2004 International Precision Assembly Seminar. pp. 199-204, IPAS 2004 International Precision Assembly Seminar, Salzburg, Austria, 11/02/04.

Design for photonics modules - combining optical geometrical and assembly process tolerance simulation in concept creation. / Heilala, Juhani; Väätäinen, Otso; Keränen, Kimmo; Mäkinen, Jukka-Tapani; Kautio, Kari; Ollila, Jyrki; Petäjä, Jarno; Karppinen, Mikko; Heikkinen, Veli; Karioja, Pentti.

Proceeding of the IPAS 2004 International Precision Assembly Seminar. 2004. p. 199-204.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

TY - GEN

T1 - Design for photonics modules - combining optical geometrical and assembly process tolerance simulation in concept creation

AU - Heilala, Juhani

AU - Väätäinen, Otso

AU - Keränen, Kimmo

AU - Mäkinen, Jukka-Tapani

AU - Kautio, Kari

AU - Ollila, Jyrki

AU - Petäjä, Jarno

AU - Karppinen, Mikko

AU - Heikkinen, Veli

AU - Karioja, Pentti

N1 - Project code: G4SU00322 Project code: G4SU00369

PY - 2004

Y1 - 2004

N2 - Designing cost-effective photonics modules is a challenging task. One of the principal costs underlying photonic components has been the cost of assembly, attachment and packaging. Until recentrly, photonic devices were mainly assembled manually. Passive optical alignment is one solution for automation, mass production and cost reduction. In this article, the authors review the midterm results of ongoing studies carried out jointly by different VTT research institutes, the University of Oulu and inductry. One of the aims is to analyse and simulate photonics module concepts and thus evaluate different solutions, primarily in a bid to find a cost-effective solution. This article presents a design and analysis process for the concept development phase based on a case study. The process utilises optical tolerance analysis and mechanical, geometrical and assembly process tolerance analysis. The process is illustrated with a case study in which a LTCC (Low Temperature Co-fired Ceramics) platform is used to anable passive anlignment in butt coupling of a laser chip and multi-mode optical fibre.

AB - Designing cost-effective photonics modules is a challenging task. One of the principal costs underlying photonic components has been the cost of assembly, attachment and packaging. Until recentrly, photonic devices were mainly assembled manually. Passive optical alignment is one solution for automation, mass production and cost reduction. In this article, the authors review the midterm results of ongoing studies carried out jointly by different VTT research institutes, the University of Oulu and inductry. One of the aims is to analyse and simulate photonics module concepts and thus evaluate different solutions, primarily in a bid to find a cost-effective solution. This article presents a design and analysis process for the concept development phase based on a case study. The process utilises optical tolerance analysis and mechanical, geometrical and assembly process tolerance analysis. The process is illustrated with a case study in which a LTCC (Low Temperature Co-fired Ceramics) platform is used to anable passive anlignment in butt coupling of a laser chip and multi-mode optical fibre.

KW - photonics modules

KW - optical and geometrical tolerance

M3 - Conference article in proceedings

SP - 199

EP - 204

BT - Proceeding of the IPAS 2004 International Precision Assembly Seminar

ER -