Design, packaging and reliability aspects of RF MEMS circuits fabricated using a GaAs MMIC foundry process technology

C. Malmqvist, C. Samuelsson, W. Simon, Pekka Rantakari, D. Smith, Manu Lahdes, Markku Lahti, Tauno Vähä-Heikkilä, Jussi Varis, R. Baggen

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

19 Citations (Scopus)

Abstract

In this paper, we report on recent results obtained within a pan-European research effort aiming at a successful integration of RF MEMS switches in a GaAs MMIC foundry process technology. Testing and characterization of GaAs based MEMS switches and RF circuits show promising results with respect to switch cycling tests, micro-seconds switching times and the relatively low losses demonstrated up to millimetre-wave frequencies. Compact GaAs RF MEMS based phase shifters together with a possible packaging solution are also presented.
Original languageEnglish
Title of host publicationThe 40th European Microwave Conference
PublisherIEEE Institute of Electrical and Electronic Engineers
Pages85-88
ISBN (Electronic)978-2-87487-016-3
ISBN (Print)978-1-4244-7232-1
DOIs
Publication statusPublished - 2010
MoE publication typeA4 Article in a conference publication
Event40th European Microwave Conference, EuMC 2010 - Paris, France
Duration: 28 Sep 201030 Sep 2010
Conference number: 40

Conference

Conference40th European Microwave Conference, EuMC 2010
Abbreviated titleEuMC 2010
CountryFrance
CityParis
Period28/09/1030/09/10

Fingerprint

Monolithic microwave integrated circuits
Foundries
MEMS
Packaging
Switches
Networks (circuits)
Phase shifters
Millimeter waves
Testing

Keywords

  • MMICs, phase shifters, radio frequency, microelectromechanical systems (RF MEMS), switches

Cite this

Malmqvist, C., Samuelsson, C., Simon, W., Rantakari, P., Smith, D., Lahdes, M., ... Baggen, R. (2010). Design, packaging and reliability aspects of RF MEMS circuits fabricated using a GaAs MMIC foundry process technology. In The 40th European Microwave Conference (pp. 85-88). IEEE Institute of Electrical and Electronic Engineers . https://doi.org/10.23919/EUMC.2010.5616523
Malmqvist, C. ; Samuelsson, C. ; Simon, W. ; Rantakari, Pekka ; Smith, D. ; Lahdes, Manu ; Lahti, Markku ; Vähä-Heikkilä, Tauno ; Varis, Jussi ; Baggen, R. / Design, packaging and reliability aspects of RF MEMS circuits fabricated using a GaAs MMIC foundry process technology. The 40th European Microwave Conference. IEEE Institute of Electrical and Electronic Engineers , 2010. pp. 85-88
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abstract = "In this paper, we report on recent results obtained within a pan-European research effort aiming at a successful integration of RF MEMS switches in a GaAs MMIC foundry process technology. Testing and characterization of GaAs based MEMS switches and RF circuits show promising results with respect to switch cycling tests, micro-seconds switching times and the relatively low losses demonstrated up to millimetre-wave frequencies. Compact GaAs RF MEMS based phase shifters together with a possible packaging solution are also presented.",
keywords = "MMICs, phase shifters, radio frequency, microelectromechanical systems (RF MEMS), switches",
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Malmqvist, C, Samuelsson, C, Simon, W, Rantakari, P, Smith, D, Lahdes, M, Lahti, M, Vähä-Heikkilä, T, Varis, J & Baggen, R 2010, Design, packaging and reliability aspects of RF MEMS circuits fabricated using a GaAs MMIC foundry process technology. in The 40th European Microwave Conference. IEEE Institute of Electrical and Electronic Engineers , pp. 85-88, 40th European Microwave Conference, EuMC 2010, Paris, France, 28/09/10. https://doi.org/10.23919/EUMC.2010.5616523

Design, packaging and reliability aspects of RF MEMS circuits fabricated using a GaAs MMIC foundry process technology. / Malmqvist, C.; Samuelsson, C.; Simon, W.; Rantakari, Pekka; Smith, D.; Lahdes, Manu; Lahti, Markku; Vähä-Heikkilä, Tauno; Varis, Jussi; Baggen, R.

The 40th European Microwave Conference. IEEE Institute of Electrical and Electronic Engineers , 2010. p. 85-88.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

TY - GEN

T1 - Design, packaging and reliability aspects of RF MEMS circuits fabricated using a GaAs MMIC foundry process technology

AU - Malmqvist, C.

AU - Samuelsson, C.

AU - Simon, W.

AU - Rantakari, Pekka

AU - Smith, D.

AU - Lahdes, Manu

AU - Lahti, Markku

AU - Vähä-Heikkilä, Tauno

AU - Varis, Jussi

AU - Baggen, R.

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PY - 2010

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N2 - In this paper, we report on recent results obtained within a pan-European research effort aiming at a successful integration of RF MEMS switches in a GaAs MMIC foundry process technology. Testing and characterization of GaAs based MEMS switches and RF circuits show promising results with respect to switch cycling tests, micro-seconds switching times and the relatively low losses demonstrated up to millimetre-wave frequencies. Compact GaAs RF MEMS based phase shifters together with a possible packaging solution are also presented.

AB - In this paper, we report on recent results obtained within a pan-European research effort aiming at a successful integration of RF MEMS switches in a GaAs MMIC foundry process technology. Testing and characterization of GaAs based MEMS switches and RF circuits show promising results with respect to switch cycling tests, micro-seconds switching times and the relatively low losses demonstrated up to millimetre-wave frequencies. Compact GaAs RF MEMS based phase shifters together with a possible packaging solution are also presented.

KW - MMICs, phase shifters, radio frequency, microelectromechanical systems (RF MEMS), switches

U2 - 10.23919/EUMC.2010.5616523

DO - 10.23919/EUMC.2010.5616523

M3 - Conference article in proceedings

SN - 978-1-4244-7232-1

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BT - The 40th European Microwave Conference

PB - IEEE Institute of Electrical and Electronic Engineers

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Malmqvist C, Samuelsson C, Simon W, Rantakari P, Smith D, Lahdes M et al. Design, packaging and reliability aspects of RF MEMS circuits fabricated using a GaAs MMIC foundry process technology. In The 40th European Microwave Conference. IEEE Institute of Electrical and Electronic Engineers . 2010. p. 85-88 https://doi.org/10.23919/EUMC.2010.5616523