Design, packaging and reliability aspects of RF MEMS circuits fabricated using a GaAs MMIC foundry process technology

C. Malmqvist; C. Samuelsson; W. Simon; Pekka Rantakari; D. Smith; Manu Lahdes; Markku Lahti; Tauno Vähä-Heikkilä; Jussi Varis; R. Baggen

doi:10.23919/EUMC.2010.5616523

Design, packaging and reliability aspects of RF MEMS circuits fabricated using a GaAs MMIC foundry process technology

C. Malmqvist, C. Samuelsson, W. Simon, Pekka Rantakari, D. Smith, Manu Lahdes, Markku Lahti, Tauno Vähä-Heikkilä, Jussi Varis, R. Baggen

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

20 Citations (Scopus)

Abstract

In this paper, we report on recent results obtained within a pan-European research effort aiming at a successful integration of RF MEMS switches in a GaAs MMIC foundry process technology. Testing and characterization of GaAs based MEMS switches and RF circuits show promising results with respect to switch cycling tests, micro-seconds switching times and the relatively low losses demonstrated up to millimetre-wave frequencies. Compact GaAs RF MEMS based phase shifters together with a possible packaging solution are also presented.

Original language	English
Title of host publication	The 40th European Microwave Conference
Publisher	IEEE Institute of Electrical and Electronic Engineers
Pages	85-88
ISBN (Electronic)	978-2-87487-016-3
ISBN (Print)	978-1-4244-7232-1
DOIs	https://doi.org/10.23919/EUMC.2010.5616523
Publication status	Published - 2010
MoE publication type	A4 Article in a conference publication
Event	40th European Microwave Conference, EuMC 2010 - Paris, France Duration: 28 Sept 2010 → 30 Sept 2010 Conference number: 40

Conference

Conference	40th European Microwave Conference, EuMC 2010
Abbreviated title	EuMC 2010
Country/Territory	France
City	Paris
Period	28/09/10 → 30/09/10

Keywords

MMICs, phase shifters, radio frequency, microelectromechanical systems (RF MEMS), switches

Access to Document

10.23919/EUMC.2010.5616523

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Malmqvist, C., Samuelsson, C., Simon, W., Rantakari, P., Smith, D., Lahdes, M., Lahti, M., Vähä-Heikkilä, T., Varis, J., & Baggen, R. (2010). Design, packaging and reliability aspects of RF MEMS circuits fabricated using a GaAs MMIC foundry process technology. In The 40th European Microwave Conference (pp. 85-88). IEEE Institute of Electrical and Electronic Engineers. https://doi.org/10.23919/EUMC.2010.5616523

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title = "Design, packaging and reliability aspects of RF MEMS circuits fabricated using a GaAs MMIC foundry process technology",

abstract = "In this paper, we report on recent results obtained within a pan-European research effort aiming at a successful integration of RF MEMS switches in a GaAs MMIC foundry process technology. Testing and characterization of GaAs based MEMS switches and RF circuits show promising results with respect to switch cycling tests, micro-seconds switching times and the relatively low losses demonstrated up to millimetre-wave frequencies. Compact GaAs RF MEMS based phase shifters together with a possible packaging solution are also presented.",

keywords = "MMICs, phase shifters, radio frequency, microelectromechanical systems (RF MEMS), switches",

author = "C. Malmqvist and C. Samuelsson and W. Simon and Pekka Rantakari and D. Smith and Manu Lahdes and Markku Lahti and Tauno V{\"a}h{\"a}-Heikkil{\"a} and Jussi Varis and R. Baggen",

note = "Project code: 20392; 40th European Microwave Conference, EuMC 2010, EuMC 2010 ; Conference date: 28-09-2010 Through 30-09-2010",

year = "2010",

doi = "10.23919/EUMC.2010.5616523",

language = "English",

isbn = "978-1-4244-7232-1",

pages = "85--88",

booktitle = "The 40th European Microwave Conference",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

address = "United States",

}

Malmqvist, C, Samuelsson, C, Simon, W, Rantakari, P, Smith, D, Lahdes, M , Lahti, M , Vähä-Heikkilä, T , Varis, J & Baggen, R 2010, Design, packaging and reliability aspects of RF MEMS circuits fabricated using a GaAs MMIC foundry process technology. in The 40th European Microwave Conference. IEEE Institute of Electrical and Electronic Engineers, pp. 85-88, 40th European Microwave Conference, EuMC 2010, Paris, France, 28/09/10. https://doi.org/10.23919/EUMC.2010.5616523

Design, packaging and reliability aspects of RF MEMS circuits fabricated using a GaAs MMIC foundry process technology. / Malmqvist, C.; Samuelsson, C.; Simon, W. et al.
The 40th European Microwave Conference. IEEE Institute of Electrical and Electronic Engineers, 2010. p. 85-88.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Design, packaging and reliability aspects of RF MEMS circuits fabricated using a GaAs MMIC foundry process technology

AU - Malmqvist, C.

AU - Samuelsson, C.

AU - Simon, W.

AU - Rantakari, Pekka

AU - Smith, D.

AU - Lahdes, Manu

AU - Lahti, Markku

AU - Vähä-Heikkilä, Tauno

AU - Varis, Jussi

AU - Baggen, R.

N1 - Conference code: 40

PY - 2010

Y1 - 2010

N2 - In this paper, we report on recent results obtained within a pan-European research effort aiming at a successful integration of RF MEMS switches in a GaAs MMIC foundry process technology. Testing and characterization of GaAs based MEMS switches and RF circuits show promising results with respect to switch cycling tests, micro-seconds switching times and the relatively low losses demonstrated up to millimetre-wave frequencies. Compact GaAs RF MEMS based phase shifters together with a possible packaging solution are also presented.

AB - In this paper, we report on recent results obtained within a pan-European research effort aiming at a successful integration of RF MEMS switches in a GaAs MMIC foundry process technology. Testing and characterization of GaAs based MEMS switches and RF circuits show promising results with respect to switch cycling tests, micro-seconds switching times and the relatively low losses demonstrated up to millimetre-wave frequencies. Compact GaAs RF MEMS based phase shifters together with a possible packaging solution are also presented.

KW - MMICs, phase shifters, radio frequency, microelectromechanical systems (RF MEMS), switches

U2 - 10.23919/EUMC.2010.5616523

DO - 10.23919/EUMC.2010.5616523

M3 - Conference article in proceedings

SN - 978-1-4244-7232-1

SP - 85

EP - 88

BT - The 40th European Microwave Conference

PB - IEEE Institute of Electrical and Electronic Engineers

T2 - 40th European Microwave Conference, EuMC 2010

Y2 - 28 September 2010 through 30 September 2010

ER -

Design, packaging and reliability aspects of RF MEMS circuits fabricated using a GaAs MMIC foundry process technology

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