Development and Characterization of PMUTs using Enchanced C-SOI Wafers

Cyril Karuthedath; T.S. Abhilash; Teuvo Sillanpää; Juha Larismaa; Katja  Parkkinen

doi:10.1109/UFFC-JS60046.2024.10794038

Development and Characterization of PMUTs using Enchanced C-SOI Wafers

Cyril Karuthedath, T.S. Abhilash, Teuvo Sillanpää, Juha Larismaa, Katja Parkkinen

BA6201 RF microsystems

Okmetic Oy

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific

Abstract

This project/study is partially performed in the RM4Health project and funded by the local funding authorities of the participating countries under the EUREKA program ”ITEA” (https://rm4health.eu/). The fabrication of EC-SOI and C-SOI wafers was completed within the Moore4Medical project (https://moore4medical.eu/).
Moore4Medical has received funding within the Electronic Components and Systems for European Leadership Joint Undertaking (ECSEL JU) in collaboration with the European Union’s H2020 Framework Programme (H2020/2014-2020) and National Authorities, under grant agreement H2020-ECSEL-2019-IA-876190)

Original language	English
Title of host publication	2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium (UFFC-JS)
Publisher	IEEE Institute of Electrical and Electronic Engineers
ISBN (Electronic)	979-8-3503-7190-1
ISBN (Print)	979-8-3503-7191-8
DOIs	https://doi.org/10.1109/UFFC-JS60046.2024.10794038
Publication status	Published - 2024
MoE publication type	B3 Non-refereed article in conference proceedings
Event	2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium (UFFC-JS) - Taipei, Taiwan, Province of China Duration: 22 Sept 2024 → 26 Sept 2024

Publication series

Series	IEEE International Symposium on Applications of Ferroelectrics (ISAF)
ISSN	2375-0448

Conference

Conference	2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium (UFFC-JS)
Country/Territory	Taiwan, Province of China
City	Taipei
Period	22/09/24 → 26/09/24

Funding

This project/study is partially performed in the RM4Health project and funded by the local funding authorities of the participating countries under the EUREKA program \"ITEA\" (https://rm4health.eu/). The fabrication of EC-SOI and C-SOI wafers was completed within the Moore4Medical project (https://moore4medical.eu/). Moore4Medical has received funding within the Electronic Components and Systems for European Leadership Joint Undertaking (ECSEL JU) in collaboration with the European Union's H2020 Framework Programme (H2020/2014-2020) and National Authorities, under grant agreement H2020-ECSEL-2019-IA-876190). The authors acknowledge Kirsi J\u00E4rvi (VTT) for the help in fabricating the PMUTs, and Paula Holmlund (VTT) for helping with the bonding process.

Keywords

Acoustic characterization
Cavity Silicon-on-Insulator (C-SOI)
Enhanced CSOI (EC-SOI)
Frequency uniformity
PMUT

Access to Document

10.1109/UFFC-JS60046.2024.10794038

Cite this

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title = "Development and Characterization of PMUTs using Enchanced C-SOI Wafers",

abstract = "This project/study is partially performed in the RM4Health project and funded by the local funding authorities of the participating countries under the EUREKA program ”ITEA” (https://rm4health.eu/). The fabrication of EC-SOI and C-SOI wafers was completed within the Moore4Medical project (https://moore4medical.eu/). Moore4Medical has received funding within the Electronic Components and Systems for European Leadership Joint Undertaking (ECSEL JU) in collaboration with the European Union{\textquoteright}s H2020 Framework Programme (H2020/2014-2020) and National Authorities, under grant agreement H2020-ECSEL-2019-IA-876190)",

keywords = "Acoustic characterization, Cavity Silicon-on-Insulator (C-SOI), Enhanced CSOI (EC-SOI), Frequency uniformity, PMUT",

author = "Cyril Karuthedath and T.S. Abhilash and Teuvo Sillanp{\"a}{\"a} and Juha Larismaa and Katja Parkkinen",

year = "2024",

doi = "10.1109/UFFC-JS60046.2024.10794038",

language = "English",

isbn = "979-8-3503-7191-8",

series = "IEEE International Symposium on Applications of Ferroelectrics (ISAF)",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

booktitle = "2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium (UFFC-JS)",

address = "United States",

note = "2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium (UFFC-JS) ; Conference date: 22-09-2024 Through 26-09-2024",

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Karuthedath, C , Abhilash, TS , Sillanpää, T, Larismaa, J & Parkkinen, K 2024, Development and Characterization of PMUTs using Enchanced C-SOI Wafers. in 2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium (UFFC-JS). IEEE Institute of Electrical and Electronic Engineers, IEEE International Symposium on Applications of Ferroelectrics (ISAF), 2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium (UFFC-JS), Taipei, Taiwan, Province of China, 22/09/24. https://doi.org/10.1109/UFFC-JS60046.2024.10794038

Development and Characterization of PMUTs using Enchanced C-SOI Wafers. / Karuthedath, Cyril ; Abhilash, T.S.; Sillanpää, Teuvo et al.
2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium (UFFC-JS). IEEE Institute of Electrical and Electronic Engineers, 2024. (IEEE International Symposium on Applications of Ferroelectrics (ISAF)).

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific

TY - GEN

T1 - Development and Characterization of PMUTs using Enchanced C-SOI Wafers

AU - Karuthedath, Cyril

AU - Abhilash, T.S.

AU - Sillanpää, Teuvo

AU - Larismaa, Juha

AU - Parkkinen, Katja

PY - 2024

Y1 - 2024

N2 - This project/study is partially performed in the RM4Health project and funded by the local funding authorities of the participating countries under the EUREKA program ”ITEA” (https://rm4health.eu/). The fabrication of EC-SOI and C-SOI wafers was completed within the Moore4Medical project (https://moore4medical.eu/). Moore4Medical has received funding within the Electronic Components and Systems for European Leadership Joint Undertaking (ECSEL JU) in collaboration with the European Union’s H2020 Framework Programme (H2020/2014-2020) and National Authorities, under grant agreement H2020-ECSEL-2019-IA-876190)

AB - This project/study is partially performed in the RM4Health project and funded by the local funding authorities of the participating countries under the EUREKA program ”ITEA” (https://rm4health.eu/). The fabrication of EC-SOI and C-SOI wafers was completed within the Moore4Medical project (https://moore4medical.eu/). Moore4Medical has received funding within the Electronic Components and Systems for European Leadership Joint Undertaking (ECSEL JU) in collaboration with the European Union’s H2020 Framework Programme (H2020/2014-2020) and National Authorities, under grant agreement H2020-ECSEL-2019-IA-876190)

KW - Acoustic characterization

KW - Cavity Silicon-on-Insulator (C-SOI)

KW - Enhanced CSOI (EC-SOI)

KW - Frequency uniformity

KW - PMUT

UR - https://www.scopus.com/pages/publications/85216448603

U2 - 10.1109/UFFC-JS60046.2024.10794038

DO - 10.1109/UFFC-JS60046.2024.10794038

M3 - Conference article in proceedings

SN - 979-8-3503-7191-8

T3 - IEEE International Symposium on Applications of Ferroelectrics (ISAF)

BT - 2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium (UFFC-JS)

PB - IEEE Institute of Electrical and Electronic Engineers

T2 - 2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium (UFFC-JS)

Y2 - 22 September 2024 through 26 September 2024

ER -

Karuthedath C , Abhilash TS , Sillanpää T, Larismaa J, Parkkinen K. Development and Characterization of PMUTs using Enchanced C-SOI Wafers. In 2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium (UFFC-JS). IEEE Institute of Electrical and Electronic Engineers. 2024. (IEEE International Symposium on Applications of Ferroelectrics (ISAF)). doi: 10.1109/UFFC-JS60046.2024.10794038

Development and Characterization of PMUTs using Enchanced C-SOI Wafers

Abstract

Publication series

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Funding

Keywords

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