Projects per year
Abstract
VTT's well-proven 3 μm SOI (Silicon Over Insulator) photonic integration platform is particularly suitable for passive optical functionalities such as Multiplexers, De-Multiplexers, Power Splitters, Delay Lines, Mach-Zehnder Interferometers (MZI), also for active operations such as phase tuning through Thermo-optic Switches and optical power monitoring or high-speed detection with integrated Ge Photo-Detectors (Ge-PD) etc. In combination with integrated up-reflecting mirrors and solder coated cavities it's enabling heterogeneous integration of III-V active devices; both Wafer Level Packaging (WLP) and E/O Wafer Level Tests can be fully exploited, scaling up in volume manufacturing while dramatically reducing assembly costs. Here heterogeneous integration of 40 Vertical Cavity Surface Emitting Lasers (VCSELs) and a SOI 40:1 multiplexer Photonic Integrated Circuit (PIC) is exploited with flip-chip techniques, coupling VCSEL emitting spots on top of respective up-reflective mirrors. VCSELs can be directly modulated up to 50 Gb/s reaching a 2 T/ls full transmission capacity. Additional 40 linear VCSEL drivers are flip-chip bonded onto a suitable Land Grid Array (LGA) interposer designed to provide interconnection and thermal decoupling capabilities to the Si-PIC, realizing a very compact, thermally efficient packaging solution. The exit waveguide from the PIC is also terminated with an up-reflective mirror and furthermore coupled with a 90 deg. tilting fiber optic pigtail designed to minimize the form-factor impact, improving mechanical reliability of the overall transmitter module.
Original language | English |
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Title of host publication | 22nd International Conference on Transparent Optical Networks (ICTON 2020) |
Publisher | IEEE Institute of Electrical and Electronic Engineers |
Number of pages | 5 |
ISBN (Electronic) | 978-1-7281-8423-4 |
DOIs | |
Publication status | Published - 2020 |
MoE publication type | A4 Article in a conference publication |
Event | 22nd International Conference on Transparent Optical Networks, ICTON 2020 - Bari, Italy Duration: 19 Jul 2020 → 23 Jul 2020 |
Publication series
Series | International Conference on Transparent Optical Networks |
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Volume | 22 |
ISSN | 2162-7339 |
Conference
Conference | 22nd International Conference on Transparent Optical Networks, ICTON 2020 |
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Country/Territory | Italy |
City | Bari |
Period | 19/07/20 → 23/07/20 |
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Dive into the research topics of 'Development and scalability of a 2 Tb/s data transmission module based on a3 μm SOI silicon photonics platform'. Together they form a unique fingerprint.Projects
- 1 Finished
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Photonic technologies for progrAmmable transmission and switching modular systems based on Scalable Spectrum/space aggregation for future agIle high capacity metrO Networks
Delrosso, G. (Manager), Bhat, S. (Participant) & Aalto, T. (Owner)
1/12/17 → 31/05/21
Project: EU project