Development and scalability of a 2 Tb/s data transmission module based on a3 μm SOI silicon photonics platform

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

VTT's well-proven 3 μm SOI (Silicon Over Insulator) photonic integration platform is particularly suitable for passive optical functionalities such as Multiplexers, De-Multiplexers, Power Splitters, Delay Lines, Mach-Zehnder Interferometers (MZI), also for active operations such as phase tuning through Thermo-optic Switches and optical power monitoring or high-speed detection with integrated Ge Photo-Detectors (Ge-PD) etc. In combination with integrated up-reflecting mirrors and solder coated cavities it's enabling heterogeneous integration of III-V active devices; both Wafer Level Packaging (WLP) and E/O Wafer Level Tests can be fully exploited, scaling up in volume manufacturing while dramatically reducing assembly costs. Here heterogeneous integration of 40 Vertical Cavity Surface Emitting Lasers (VCSELs) and a SOI 40:1 multiplexer Photonic Integrated Circuit (PIC) is exploited with flip-chip techniques, coupling VCSEL emitting spots on top of respective up-reflective mirrors. VCSELs can be directly modulated up to 50 Gb/s reaching a 2 T/ls full transmission capacity. Additional 40 linear VCSEL drivers are flip-chip bonded onto a suitable Land Grid Array (LGA) interposer designed to provide interconnection and thermal decoupling capabilities to the Si-PIC, realizing a very compact, thermally efficient packaging solution. The exit waveguide from the PIC is also terminated with an up-reflective mirror and furthermore coupled with a 90 deg. tilting fiber optic pigtail designed to minimize the form-factor impact, improving mechanical reliability of the overall transmitter module.

Original languageEnglish
Title of host publication2020 22nd International Conference on Transparent Optical Networks, ICTON 2020
PublisherIEEE Institute of Electrical and Electronic Engineers
Number of pages5
ISBN (Electronic)978-1-7281-8423-4
DOIs
Publication statusPublished - 2020
MoE publication typeA4 Article in a conference publication
Event22nd International Conference on Transparent Optical Networks, ICTON 2020 - Bari, Italy
Duration: 19 Jul 202023 Jul 2020

Publication series

SeriesInternational Conference on Transparent Optical Networks
Volume22
ISSN2162-7339

Conference

Conference22nd International Conference on Transparent Optical Networks, ICTON 2020
CountryItaly
CityBari
Period19/07/2023/07/20

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