Development, design and fabrication of a measurement chip for thermal material characterization based on the 3-omega method

Corinna Grosse, Mohamad Abo Ras, Aapo Varpula, Kestutis Grigoras, Daniel May, Mika Prunnila, Bernhard Wunderle, Séverine Gomès

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    Abstract

    The knowledge of thermal properties of materials is important for many fields of technology such as thermal management for microelectronics, for the selection of interface or filler materials as well as for thermal simulations. We developed, designed and fabricated a characterization chip for the measurement of the thermal conductivity and diffusivity of, e.g., pastes, gels, fluids, polymers and bulk samples. The measurement principle is based on an extension of the 3-omega method. For the traditional 3-omega method a thin metal heater line must be deposited on top of the sample, which is often impractical and even impossible for non-solid samples or samples with rough surfaces. We are using an extension of the 3-omega method, which also allows to measure the thermal properties of such materials for which the traditional 3-omega method is not applicable. In our measurement system, the sample can be simply put onto a chip in which the 3-omega heater is already integrated. Due to the use of through-glass vias, the complete top side of the chip is available for the sample deposition. In this work, the design and fabrication of the chips and measurements of the thermal properties of reference samples are presented.
    Original languageEnglish
    Title of host publicationTHERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems
    PublisherIEEE Institute of Electrical and Electronic Engineers
    Pages1-5
    Number of pages5
    ISBN (Electronic)978-1-5386-1928-5
    ISBN (Print)978-1-5386-1929-2
    DOIs
    Publication statusPublished - 21 Dec 2017
    MoE publication typeA4 Article in a conference publication
    Event23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017 - Amsterdam, Netherlands
    Duration: 27 Sep 201729 Sep 2017
    Conference number: 23

    Workshop

    Workshop23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017
    Abbreviated titleTHERMINIC
    CountryNetherlands
    CityAmsterdam
    Period27/09/1729/09/17

    Fingerprint

    Material Characterization
    Fabrication
    Chip
    Thermodynamic properties
    Thermal Properties
    Thermal diffusivity
    Microelectronics
    Fillers
    Thermal conductivity
    Gels
    Thermal Management
    Thermal Diffusivity
    Rough Surface
    Glass
    Fluids
    Design
    Hot Temperature
    Thermal Conductivity
    Measurement System
    Polymers

    Keywords

    • thermal conductivity
    • heating systems
    • conductivity
    • semiconductor device measurement
    • temperature measurement
    • substrates
    • passivation

    Cite this

    Grosse, C., Ras, M. A., Varpula, A., Grigoras, K., May, D., Prunnila, M., ... Gomès, S. (2017). Development, design and fabrication of a measurement chip for thermal material characterization based on the 3-omega method. In THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems (pp. 1-5). IEEE Institute of Electrical and Electronic Engineers . https://doi.org/10.1109/THERMINIC.2017.8233807
    Grosse, Corinna ; Ras, Mohamad Abo ; Varpula, Aapo ; Grigoras, Kestutis ; May, Daniel ; Prunnila, Mika ; Wunderle, Bernhard ; Gomès, Séverine. / Development, design and fabrication of a measurement chip for thermal material characterization based on the 3-omega method. THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems. IEEE Institute of Electrical and Electronic Engineers , 2017. pp. 1-5
    @inproceedings{77eaa81d6c534ea79dcf328a06658d78,
    title = "Development, design and fabrication of a measurement chip for thermal material characterization based on the 3-omega method",
    abstract = "The knowledge of thermal properties of materials is important for many fields of technology such as thermal management for microelectronics, for the selection of interface or filler materials as well as for thermal simulations. We developed, designed and fabricated a characterization chip for the measurement of the thermal conductivity and diffusivity of, e.g., pastes, gels, fluids, polymers and bulk samples. The measurement principle is based on an extension of the 3-omega method. For the traditional 3-omega method a thin metal heater line must be deposited on top of the sample, which is often impractical and even impossible for non-solid samples or samples with rough surfaces. We are using an extension of the 3-omega method, which also allows to measure the thermal properties of such materials for which the traditional 3-omega method is not applicable. In our measurement system, the sample can be simply put onto a chip in which the 3-omega heater is already integrated. Due to the use of through-glass vias, the complete top side of the chip is available for the sample deposition. In this work, the design and fabrication of the chips and measurements of the thermal properties of reference samples are presented.",
    keywords = "thermal conductivity, heating systems, conductivity, semiconductor device measurement, temperature measurement, substrates, passivation",
    author = "Corinna Grosse and Ras, {Mohamad Abo} and Aapo Varpula and Kestutis Grigoras and Daniel May and Mika Prunnila and Bernhard Wunderle and S{\'e}verine Gom{\`e}s",
    note = "Project: 100846 Project: 108104",
    year = "2017",
    month = "12",
    day = "21",
    doi = "10.1109/THERMINIC.2017.8233807",
    language = "English",
    isbn = "978-1-5386-1929-2",
    pages = "1--5",
    booktitle = "THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems",
    publisher = "IEEE Institute of Electrical and Electronic Engineers",
    address = "United States",

    }

    Grosse, C, Ras, MA, Varpula, A, Grigoras, K, May, D, Prunnila, M, Wunderle, B & Gomès, S 2017, Development, design and fabrication of a measurement chip for thermal material characterization based on the 3-omega method. in THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems. IEEE Institute of Electrical and Electronic Engineers , pp. 1-5, 23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017, Amsterdam, Netherlands, 27/09/17. https://doi.org/10.1109/THERMINIC.2017.8233807

    Development, design and fabrication of a measurement chip for thermal material characterization based on the 3-omega method. / Grosse, Corinna; Ras, Mohamad Abo; Varpula, Aapo; Grigoras, Kestutis; May, Daniel; Prunnila, Mika; Wunderle, Bernhard; Gomès, Séverine.

    THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems. IEEE Institute of Electrical and Electronic Engineers , 2017. p. 1-5.

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    TY - GEN

    T1 - Development, design and fabrication of a measurement chip for thermal material characterization based on the 3-omega method

    AU - Grosse, Corinna

    AU - Ras, Mohamad Abo

    AU - Varpula, Aapo

    AU - Grigoras, Kestutis

    AU - May, Daniel

    AU - Prunnila, Mika

    AU - Wunderle, Bernhard

    AU - Gomès, Séverine

    N1 - Project: 100846 Project: 108104

    PY - 2017/12/21

    Y1 - 2017/12/21

    N2 - The knowledge of thermal properties of materials is important for many fields of technology such as thermal management for microelectronics, for the selection of interface or filler materials as well as for thermal simulations. We developed, designed and fabricated a characterization chip for the measurement of the thermal conductivity and diffusivity of, e.g., pastes, gels, fluids, polymers and bulk samples. The measurement principle is based on an extension of the 3-omega method. For the traditional 3-omega method a thin metal heater line must be deposited on top of the sample, which is often impractical and even impossible for non-solid samples or samples with rough surfaces. We are using an extension of the 3-omega method, which also allows to measure the thermal properties of such materials for which the traditional 3-omega method is not applicable. In our measurement system, the sample can be simply put onto a chip in which the 3-omega heater is already integrated. Due to the use of through-glass vias, the complete top side of the chip is available for the sample deposition. In this work, the design and fabrication of the chips and measurements of the thermal properties of reference samples are presented.

    AB - The knowledge of thermal properties of materials is important for many fields of technology such as thermal management for microelectronics, for the selection of interface or filler materials as well as for thermal simulations. We developed, designed and fabricated a characterization chip for the measurement of the thermal conductivity and diffusivity of, e.g., pastes, gels, fluids, polymers and bulk samples. The measurement principle is based on an extension of the 3-omega method. For the traditional 3-omega method a thin metal heater line must be deposited on top of the sample, which is often impractical and even impossible for non-solid samples or samples with rough surfaces. We are using an extension of the 3-omega method, which also allows to measure the thermal properties of such materials for which the traditional 3-omega method is not applicable. In our measurement system, the sample can be simply put onto a chip in which the 3-omega heater is already integrated. Due to the use of through-glass vias, the complete top side of the chip is available for the sample deposition. In this work, the design and fabrication of the chips and measurements of the thermal properties of reference samples are presented.

    KW - thermal conductivity

    KW - heating systems

    KW - conductivity

    KW - semiconductor device measurement

    KW - temperature measurement

    KW - substrates

    KW - passivation

    UR - http://www.scopus.com/inward/record.url?scp=85045843401&partnerID=8YFLogxK

    U2 - 10.1109/THERMINIC.2017.8233807

    DO - 10.1109/THERMINIC.2017.8233807

    M3 - Conference article in proceedings

    SN - 978-1-5386-1929-2

    SP - 1

    EP - 5

    BT - THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems

    PB - IEEE Institute of Electrical and Electronic Engineers

    ER -

    Grosse C, Ras MA, Varpula A, Grigoras K, May D, Prunnila M et al. Development, design and fabrication of a measurement chip for thermal material characterization based on the 3-omega method. In THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems. IEEE Institute of Electrical and Electronic Engineers . 2017. p. 1-5 https://doi.org/10.1109/THERMINIC.2017.8233807