Development, design and fabrication of a measurement chip for thermal material characterization based on the 3-omega method

Corinna Grosse, Mohamad Abo Ras, Aapo Varpula, Kestutis Grigoras, Daniel May, Mika Prunnila, Bernhard Wunderle, Séverine Gomès

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

The knowledge of thermal properties of materials is important for many fields of technology such as thermal management for microelectronics, for the selection of interface or filler materials as well as for thermal simulations. We developed, designed and fabricated a characterization chip for the measurement of the thermal conductivity and diffusivity of, e.g., pastes, gels, fluids, polymers and bulk samples. The measurement principle is based on an extension of the 3-omega method. For the traditional 3-omega method a thin metal heater line must be deposited on top of the sample, which is often impractical and even impossible for non-solid samples or samples with rough surfaces. We are using an extension of the 3-omega method, which also allows to measure the thermal properties of such materials for which the traditional 3-omega method is not applicable. In our measurement system, the sample can be simply put onto a chip in which the 3-omega heater is already integrated. Due to the use of through-glass vias, the complete top side of the chip is available for the sample deposition. In this work, the design and fabrication of the chips and measurements of the thermal properties of reference samples are presented.
Original languageEnglish
Title of host publicationTHERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems
PublisherIEEE Institute of Electrical and Electronic Engineers
Pages1-5
Number of pages5
ISBN (Electronic)978-1-5386-1928-5
ISBN (Print)978-1-5386-1929-2
DOIs
Publication statusPublished - 21 Dec 2017
MoE publication typeA4 Article in a conference publication
Event23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017 - Amsterdam, Netherlands
Duration: 27 Sep 201729 Sep 2017
Conference number: 23

Workshop

Workshop23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017
Abbreviated titleTHERMINIC
CountryNetherlands
CityAmsterdam
Period27/09/1729/09/17

Fingerprint

Material Characterization
Fabrication
Chip
Thermodynamic properties
Thermal Properties
Thermal diffusivity
Microelectronics
Fillers
Thermal conductivity
Gels
Thermal Management
Thermal Diffusivity
Rough Surface
Glass
Fluids
Design
Hot Temperature
Thermal Conductivity
Measurement System
Polymers

Keywords

  • thermal conductivity
  • heating systems
  • conductivity
  • semiconductor device measurement
  • temperature measurement
  • substrates
  • passivation

Cite this

Grosse, C., Ras, M. A., Varpula, A., Grigoras, K., May, D., Prunnila, M., ... Gomès, S. (2017). Development, design and fabrication of a measurement chip for thermal material characterization based on the 3-omega method. In THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems (pp. 1-5). IEEE Institute of Electrical and Electronic Engineers . https://doi.org/10.1109/THERMINIC.2017.8233807
Grosse, Corinna ; Ras, Mohamad Abo ; Varpula, Aapo ; Grigoras, Kestutis ; May, Daniel ; Prunnila, Mika ; Wunderle, Bernhard ; Gomès, Séverine. / Development, design and fabrication of a measurement chip for thermal material characterization based on the 3-omega method. THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems. IEEE Institute of Electrical and Electronic Engineers , 2017. pp. 1-5
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title = "Development, design and fabrication of a measurement chip for thermal material characterization based on the 3-omega method",
abstract = "The knowledge of thermal properties of materials is important for many fields of technology such as thermal management for microelectronics, for the selection of interface or filler materials as well as for thermal simulations. We developed, designed and fabricated a characterization chip for the measurement of the thermal conductivity and diffusivity of, e.g., pastes, gels, fluids, polymers and bulk samples. The measurement principle is based on an extension of the 3-omega method. For the traditional 3-omega method a thin metal heater line must be deposited on top of the sample, which is often impractical and even impossible for non-solid samples or samples with rough surfaces. We are using an extension of the 3-omega method, which also allows to measure the thermal properties of such materials for which the traditional 3-omega method is not applicable. In our measurement system, the sample can be simply put onto a chip in which the 3-omega heater is already integrated. Due to the use of through-glass vias, the complete top side of the chip is available for the sample deposition. In this work, the design and fabrication of the chips and measurements of the thermal properties of reference samples are presented.",
keywords = "thermal conductivity, heating systems, conductivity, semiconductor device measurement, temperature measurement, substrates, passivation",
author = "Corinna Grosse and Ras, {Mohamad Abo} and Aapo Varpula and Kestutis Grigoras and Daniel May and Mika Prunnila and Bernhard Wunderle and S{\'e}verine Gom{\`e}s",
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Grosse, C, Ras, MA, Varpula, A, Grigoras, K, May, D, Prunnila, M, Wunderle, B & Gomès, S 2017, Development, design and fabrication of a measurement chip for thermal material characterization based on the 3-omega method. in THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems. IEEE Institute of Electrical and Electronic Engineers , pp. 1-5, 23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017, Amsterdam, Netherlands, 27/09/17. https://doi.org/10.1109/THERMINIC.2017.8233807

Development, design and fabrication of a measurement chip for thermal material characterization based on the 3-omega method. / Grosse, Corinna; Ras, Mohamad Abo; Varpula, Aapo; Grigoras, Kestutis; May, Daniel; Prunnila, Mika; Wunderle, Bernhard; Gomès, Séverine.

THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems. IEEE Institute of Electrical and Electronic Engineers , 2017. p. 1-5.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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AU - Grosse, Corinna

AU - Ras, Mohamad Abo

AU - Varpula, Aapo

AU - Grigoras, Kestutis

AU - May, Daniel

AU - Prunnila, Mika

AU - Wunderle, Bernhard

AU - Gomès, Séverine

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PY - 2017/12/21

Y1 - 2017/12/21

N2 - The knowledge of thermal properties of materials is important for many fields of technology such as thermal management for microelectronics, for the selection of interface or filler materials as well as for thermal simulations. We developed, designed and fabricated a characterization chip for the measurement of the thermal conductivity and diffusivity of, e.g., pastes, gels, fluids, polymers and bulk samples. The measurement principle is based on an extension of the 3-omega method. For the traditional 3-omega method a thin metal heater line must be deposited on top of the sample, which is often impractical and even impossible for non-solid samples or samples with rough surfaces. We are using an extension of the 3-omega method, which also allows to measure the thermal properties of such materials for which the traditional 3-omega method is not applicable. In our measurement system, the sample can be simply put onto a chip in which the 3-omega heater is already integrated. Due to the use of through-glass vias, the complete top side of the chip is available for the sample deposition. In this work, the design and fabrication of the chips and measurements of the thermal properties of reference samples are presented.

AB - The knowledge of thermal properties of materials is important for many fields of technology such as thermal management for microelectronics, for the selection of interface or filler materials as well as for thermal simulations. We developed, designed and fabricated a characterization chip for the measurement of the thermal conductivity and diffusivity of, e.g., pastes, gels, fluids, polymers and bulk samples. The measurement principle is based on an extension of the 3-omega method. For the traditional 3-omega method a thin metal heater line must be deposited on top of the sample, which is often impractical and even impossible for non-solid samples or samples with rough surfaces. We are using an extension of the 3-omega method, which also allows to measure the thermal properties of such materials for which the traditional 3-omega method is not applicable. In our measurement system, the sample can be simply put onto a chip in which the 3-omega heater is already integrated. Due to the use of through-glass vias, the complete top side of the chip is available for the sample deposition. In this work, the design and fabrication of the chips and measurements of the thermal properties of reference samples are presented.

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KW - conductivity

KW - semiconductor device measurement

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DO - 10.1109/THERMINIC.2017.8233807

M3 - Conference article in proceedings

SN - 978-1-5386-1929-2

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BT - THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems

PB - IEEE Institute of Electrical and Electronic Engineers

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Grosse C, Ras MA, Varpula A, Grigoras K, May D, Prunnila M et al. Development, design and fabrication of a measurement chip for thermal material characterization based on the 3-omega method. In THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems. IEEE Institute of Electrical and Electronic Engineers . 2017. p. 1-5 https://doi.org/10.1109/THERMINIC.2017.8233807