Development, design and fabrication of a measurement chip for thermal material characterization based on the 3-omega method

Corinna Grosse; Mohamad Abo Ras; Aapo Varpula; Kestutis Grigoras; Daniel May; Mika Prunnila; Bernhard Wunderle; Séverine Gomès

doi:10.1109/THERMINIC.2017.8233807

Development, design and fabrication of a measurement chip for thermal material characterization based on the 3-omega method

Corinna Grosse, Mohamad Abo Ras, Aapo Varpula, Kestutis Grigoras, Daniel May, Mika Prunnila, Bernhard Wunderle, Séverine Gomès

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

2 Citations (Scopus)

Abstract

The knowledge of thermal properties of materials is important for many fields of technology such as thermal management for microelectronics, for the selection of interface or filler materials as well as for thermal simulations. We developed, designed and fabricated a characterization chip for the measurement of the thermal conductivity and diffusivity of, e.g., pastes, gels, fluids, polymers and bulk samples. The measurement principle is based on an extension of the 3-omega method. For the traditional 3-omega method a thin metal heater line must be deposited on top of the sample, which is often impractical and even impossible for non-solid samples or samples with rough surfaces. We are using an extension of the 3-omega method, which also allows to measure the thermal properties of such materials for which the traditional 3-omega method is not applicable. In our measurement system, the sample can be simply put onto a chip in which the 3-omega heater is already integrated. Due to the use of through-glass vias, the complete top side of the chip is available for the sample deposition. In this work, the design and fabrication of the chips and measurements of the thermal properties of reference samples are presented.

Original language	English
Title of host publication	THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems
Publisher	IEEE Institute of Electrical and Electronic Engineers
Pages	1-5
Number of pages	5
ISBN (Electronic)	978-1-5386-1928-5
ISBN (Print)	978-1-5386-1929-2
DOIs	https://doi.org/10.1109/THERMINIC.2017.8233807
Publication status	Published - 21 Dec 2017
MoE publication type	A4 Article in a conference publication
Event	23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017 - Amsterdam, Netherlands Duration: 27 Sept 2017 → 29 Sept 2017 Conference number: 23

Workshop

Workshop	23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017
Abbreviated title	THERMINIC
Country/Territory	Netherlands
City	Amsterdam
Period	27/09/17 → 29/09/17

Keywords

thermal conductivity
heating systems
conductivity
semiconductor device measurement
temperature measurement
substrates
passivation
OtaNano

Access to Document

10.1109/THERMINIC.2017.8233807

Cite this

Grosse, C., Ras, M. A., Varpula, A., Grigoras, K., May, D., Prunnila, M., Wunderle, B., & Gomès, S. (2017). Development, design and fabrication of a measurement chip for thermal material characterization based on the 3-omega method. In THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems (pp. 1-5). IEEE Institute of Electrical and Electronic Engineers. https://doi.org/10.1109/THERMINIC.2017.8233807

@inproceedings{77eaa81d6c534ea79dcf328a06658d78,

title = "Development, design and fabrication of a measurement chip for thermal material characterization based on the 3-omega method",

abstract = "The knowledge of thermal properties of materials is important for many fields of technology such as thermal management for microelectronics, for the selection of interface or filler materials as well as for thermal simulations. We developed, designed and fabricated a characterization chip for the measurement of the thermal conductivity and diffusivity of, e.g., pastes, gels, fluids, polymers and bulk samples. The measurement principle is based on an extension of the 3-omega method. For the traditional 3-omega method a thin metal heater line must be deposited on top of the sample, which is often impractical and even impossible for non-solid samples or samples with rough surfaces. We are using an extension of the 3-omega method, which also allows to measure the thermal properties of such materials for which the traditional 3-omega method is not applicable. In our measurement system, the sample can be simply put onto a chip in which the 3-omega heater is already integrated. Due to the use of through-glass vias, the complete top side of the chip is available for the sample deposition. In this work, the design and fabrication of the chips and measurements of the thermal properties of reference samples are presented.",

keywords = "thermal conductivity, heating systems, conductivity, semiconductor device measurement, temperature measurement, substrates, passivation, OtaNano",

author = "Corinna Grosse and Ras, {Mohamad Abo} and Aapo Varpula and Kestutis Grigoras and Daniel May and Mika Prunnila and Bernhard Wunderle and S{\'e}verine Gom{\`e}s",

year = "2017",

month = dec,

day = "21",

doi = "10.1109/THERMINIC.2017.8233807",

language = "English",

isbn = "978-1-5386-1929-2 ",

pages = "1--5",

booktitle = "THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

address = "United States",

note = "23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017, THERMINIC ; Conference date: 27-09-2017 Through 29-09-2017",

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Grosse, C, Ras, MA, Varpula, A , Grigoras, K, May, D, Prunnila, M, Wunderle, B & Gomès, S 2017, Development, design and fabrication of a measurement chip for thermal material characterization based on the 3-omega method. in THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems. IEEE Institute of Electrical and Electronic Engineers, pp. 1-5, 23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017, Amsterdam, Netherlands, 27/09/17. https://doi.org/10.1109/THERMINIC.2017.8233807

Development, design and fabrication of a measurement chip for thermal material characterization based on the 3-omega method. / Grosse, Corinna; Ras, Mohamad Abo; Varpula, Aapo et al.
THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems. IEEE Institute of Electrical and Electronic Engineers, 2017. p. 1-5.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Development, design and fabrication of a measurement chip for thermal material characterization based on the 3-omega method

AU - Grosse, Corinna

AU - Ras, Mohamad Abo

AU - Varpula, Aapo

AU - Grigoras, Kestutis

AU - May, Daniel

AU - Prunnila, Mika

AU - Wunderle, Bernhard

AU - Gomès, Séverine

N1 - Conference code: 23

PY - 2017/12/21

Y1 - 2017/12/21

N2 - The knowledge of thermal properties of materials is important for many fields of technology such as thermal management for microelectronics, for the selection of interface or filler materials as well as for thermal simulations. We developed, designed and fabricated a characterization chip for the measurement of the thermal conductivity and diffusivity of, e.g., pastes, gels, fluids, polymers and bulk samples. The measurement principle is based on an extension of the 3-omega method. For the traditional 3-omega method a thin metal heater line must be deposited on top of the sample, which is often impractical and even impossible for non-solid samples or samples with rough surfaces. We are using an extension of the 3-omega method, which also allows to measure the thermal properties of such materials for which the traditional 3-omega method is not applicable. In our measurement system, the sample can be simply put onto a chip in which the 3-omega heater is already integrated. Due to the use of through-glass vias, the complete top side of the chip is available for the sample deposition. In this work, the design and fabrication of the chips and measurements of the thermal properties of reference samples are presented.

AB - The knowledge of thermal properties of materials is important for many fields of technology such as thermal management for microelectronics, for the selection of interface or filler materials as well as for thermal simulations. We developed, designed and fabricated a characterization chip for the measurement of the thermal conductivity and diffusivity of, e.g., pastes, gels, fluids, polymers and bulk samples. The measurement principle is based on an extension of the 3-omega method. For the traditional 3-omega method a thin metal heater line must be deposited on top of the sample, which is often impractical and even impossible for non-solid samples or samples with rough surfaces. We are using an extension of the 3-omega method, which also allows to measure the thermal properties of such materials for which the traditional 3-omega method is not applicable. In our measurement system, the sample can be simply put onto a chip in which the 3-omega heater is already integrated. Due to the use of through-glass vias, the complete top side of the chip is available for the sample deposition. In this work, the design and fabrication of the chips and measurements of the thermal properties of reference samples are presented.

KW - thermal conductivity

KW - heating systems

KW - conductivity

KW - semiconductor device measurement

KW - temperature measurement

KW - substrates

KW - passivation

KW - OtaNano

UR - http://www.scopus.com/inward/record.url?scp=85045843401&partnerID=8YFLogxK

U2 - 10.1109/THERMINIC.2017.8233807

DO - 10.1109/THERMINIC.2017.8233807

M3 - Conference article in proceedings

SN - 978-1-5386-1929-2

SP - 1

EP - 5

BT - THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems

PB - IEEE Institute of Electrical and Electronic Engineers

T2 - 23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017

Y2 - 27 September 2017 through 29 September 2017

ER -

Grosse C, Ras MA, Varpula A , Grigoras K, May D, Prunnila M et al. Development, design and fabrication of a measurement chip for thermal material characterization based on the 3-omega method. In THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems. IEEE Institute of Electrical and Electronic Engineers. 2017. p. 1-5 doi: 10.1109/THERMINIC.2017.8233807

Development, design and fabrication of a measurement chip for thermal material characterization based on the 3-omega method

Abstract

Workshop

Keywords

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Fingerprint

ALDCoE: Finnish Centre of Excellence in Atomic Layer Deposition

OtaNano

Cite this

Development, design and fabrication of a measurement chip for thermal material characterization based on the 3-omega method

Abstract

Workshop

Keywords

Access to Document

Other files and links

Fingerprint

Projects

ALDCoE: Finnish Centre of Excellence in Atomic Layer Deposition

Equipment

OtaNano

Cite this