Development, design and fabrication of a measurement chip for thermal material characterization based on the 3-omega method

Corinna Grosse, Mohamad Abo Ras, Aapo Varpula, Kestutis Grigoras, Daniel May, Mika Prunnila, Bernhard Wunderle, Séverine Gomès

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    Abstract

    The knowledge of thermal properties of materials is important for many fields of technology such as thermal management for microelectronics, for the selection of interface or filler materials as well as for thermal simulations. We developed, designed and fabricated a characterization chip for the measurement of the thermal conductivity and diffusivity of, e.g., pastes, gels, fluids, polymers and bulk samples. The measurement principle is based on an extension of the 3-omega method. For the traditional 3-omega method a thin metal heater line must be deposited on top of the sample, which is often impractical and even impossible for non-solid samples or samples with rough surfaces. We are using an extension of the 3-omega method, which also allows to measure the thermal properties of such materials for which the traditional 3-omega method is not applicable. In our measurement system, the sample can be simply put onto a chip in which the 3-omega heater is already integrated. Due to the use of through-glass vias, the complete top side of the chip is available for the sample deposition. In this work, the design and fabrication of the chips and measurements of the thermal properties of reference samples are presented.
    Original languageEnglish
    Title of host publicationTHERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems
    PublisherIEEE Institute of Electrical and Electronic Engineers
    Pages1-5
    Number of pages5
    ISBN (Electronic)978-1-5386-1928-5
    ISBN (Print)978-1-5386-1929-2
    DOIs
    Publication statusPublished - 21 Dec 2017
    MoE publication typeA4 Article in a conference publication
    Event23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017 - Amsterdam, Netherlands
    Duration: 27 Sep 201729 Sep 2017
    Conference number: 23

    Workshop

    Workshop23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017
    Abbreviated titleTHERMINIC
    CountryNetherlands
    CityAmsterdam
    Period27/09/1729/09/17

    Keywords

    • thermal conductivity
    • heating systems
    • conductivity
    • semiconductor device measurement
    • temperature measurement
    • substrates
    • passivation
    • OtaNano

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