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Development of a full roll-to-roll manufacturing process of through-substrate vias with stretchable substrates enabling double-sided wearable electronics

  • Elina Jansson*
  • , Arttu Korhonen
  • , Mikko Hietala
  • , Terho Kololuoma
  • *Corresponding author for this work

Research output: Contribution to journalArticleScientificpeer-review

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