Development of a reliable LTCC-BGA module platform for RF/microwave telecommunication applications

Tero Kangasvieri, Olli Nousiainen, Jouko Vähäkangas, Kari Kautio, Markku Lahti

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

5 Citations (Scopus)
Original languageEnglish
Title of host publicationProceedings
Subtitle of host publication16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007
PublisherCurran Associates Inc.
Pages693-698
ISBN (Print)978-1-6227-6466-2
Publication statusPublished - 2007
MoE publication typeA4 Article in a conference publication
Event16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007 - Oulu, Finland
Duration: 17 Jun 200720 Jun 2007

Conference

Conference16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007
CountryFinland
CityOulu
Period17/06/0720/06/07

Cite this

Kangasvieri, T., Nousiainen, O., Vähäkangas, J., Kautio, K., & Lahti, M. (2007). Development of a reliable LTCC-BGA module platform for RF/microwave telecommunication applications. In Proceedings: 16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007 (pp. 693-698). Curran Associates Inc..
Kangasvieri, Tero ; Nousiainen, Olli ; Vähäkangas, Jouko ; Kautio, Kari ; Lahti, Markku. / Development of a reliable LTCC-BGA module platform for RF/microwave telecommunication applications. Proceedings: 16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007. Curran Associates Inc., 2007. pp. 693-698
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title = "Development of a reliable LTCC-BGA module platform for RF/microwave telecommunication applications",
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Kangasvieri, T, Nousiainen, O, Vähäkangas, J, Kautio, K & Lahti, M 2007, Development of a reliable LTCC-BGA module platform for RF/microwave telecommunication applications. in Proceedings: 16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007. Curran Associates Inc., pp. 693-698, 16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007, Oulu, Finland, 17/06/07.

Development of a reliable LTCC-BGA module platform for RF/microwave telecommunication applications. / Kangasvieri, Tero; Nousiainen, Olli; Vähäkangas, Jouko; Kautio, Kari; Lahti, Markku.

Proceedings: 16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007. Curran Associates Inc., 2007. p. 693-698.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

TY - GEN

T1 - Development of a reliable LTCC-BGA module platform for RF/microwave telecommunication applications

AU - Kangasvieri, Tero

AU - Nousiainen, Olli

AU - Vähäkangas, Jouko

AU - Kautio, Kari

AU - Lahti, Markku

PY - 2007

Y1 - 2007

M3 - Conference article in proceedings

SN - 978-1-6227-6466-2

SP - 693

EP - 698

BT - Proceedings

PB - Curran Associates Inc.

ER -

Kangasvieri T, Nousiainen O, Vähäkangas J, Kautio K, Lahti M. Development of a reliable LTCC-BGA module platform for RF/microwave telecommunication applications. In Proceedings: 16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007. Curran Associates Inc. 2007. p. 693-698