Development of a reliable LTCC-BGA module platform for RF/microwave telecommunication applications

Tero Kangasvieri, Olli Nousiainen, Jouko Vähäkangas, Kari Kautio, Markku Lahti

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

5 Citations (Scopus)

Original language	English
Title of host publication	Proceedings
Subtitle of host publication	16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007
Publisher	Curran Associates Inc.
Pages	693-698
ISBN (Print)	978-1-6227-6466-2
Publication status	Published - 2007
MoE publication type	A4 Article in a conference publication
Event	16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007 - Oulu, Finland Duration: 17 Jun 2007 → 20 Jun 2007

Conference	16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007
Country	Finland
City	Oulu
Period	17/06/07 → 20/06/07

Cite this

Kangasvieri, T., Nousiainen, O., Vähäkangas, J., Kautio, K., & Lahti, M. (2007). Development of a reliable LTCC-BGA module platform for RF/microwave telecommunication applications. In Proceedings: 16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007 (pp. 693-698). Curran Associates Inc..

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title = "Development of a reliable LTCC-BGA module platform for RF/microwave telecommunication applications",

author = "Tero Kangasvieri and Olli Nousiainen and Jouko V{\"a}h{\"a}kangas and Kari Kautio and Markku Lahti",

year = "2007",

language = "English",

isbn = "978-1-6227-6466-2",

pages = "693--698",

booktitle = "Proceedings",

publisher = "Curran Associates Inc.",

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Kangasvieri, T, Nousiainen, O, Vähäkangas, J, Kautio, K & Lahti, M 2007, Development of a reliable LTCC-BGA module platform for RF/microwave telecommunication applications. in Proceedings: 16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007. Curran Associates Inc., pp. 693-698, 16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007, Oulu, Finland, 17/06/07.

Proceedings: 16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007. Curran Associates Inc., 2007. p. 693-698.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Development of a reliable LTCC-BGA module platform for RF/microwave telecommunication applications

AU - Kangasvieri, Tero

AU - Nousiainen, Olli

AU - Vähäkangas, Jouko

AU - Kautio, Kari

AU - Lahti, Markku

PY - 2007

Y1 - 2007

M3 - Conference article in proceedings

SN - 978-1-6227-6466-2

SP - 693

EP - 698

BT - Proceedings

PB - Curran Associates Inc.

T2 - 16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007

Y2 - 17 June 2007 through 20 June 2007

ER -