| Original language | English |
|---|---|
| Title of host publication | Proceedings |
| Subtitle of host publication | 16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007 |
| Publisher | Curran Associates Inc. |
| Pages | 693-698 |
| ISBN (Print) | 978-1-6227-6466-2 |
| Publication status | Published - 2007 |
| MoE publication type | A4 Article in a conference publication |
| Event | 16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007 - Oulu, Finland Duration: 17 Jun 2007 → 20 Jun 2007 |
Conference
| Conference | 16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007 |
|---|---|
| Country | Finland |
| City | Oulu |
| Period | 17/06/07 → 20/06/07 |
Cite this
Kangasvieri, T., Nousiainen, O., Vähäkangas, J., Kautio, K., & Lahti, M. (2007). Development of a reliable LTCC-BGA module platform for RF/microwave telecommunication applications. In Proceedings: 16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007 (pp. 693-698). Curran Associates Inc..
@inproceedings{e45fe43e1baa4e7fbce462c4c02614b9,
title = "Development of a reliable LTCC-BGA module platform for RF/microwave telecommunication applications",
author = "Tero Kangasvieri and Olli Nousiainen and Jouko V{\"a}h{\"a}kangas and Kari Kautio and Markku Lahti",
year = "2007",
language = "English",
isbn = "978-1-6227-6466-2",
pages = "693--698",
booktitle = "Proceedings",
publisher = "Curran Associates Inc.",
address = "United States",
}
Kangasvieri, T, Nousiainen, O, Vähäkangas, J, Kautio, K & Lahti, M 2007, Development of a reliable LTCC-BGA module platform for RF/microwave telecommunication applications. in Proceedings: 16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007. Curran Associates Inc., pp. 693-698, 16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007, Oulu, Finland, 17/06/07.
Development of a reliable LTCC-BGA module platform for RF/microwave telecommunication applications. / Kangasvieri, Tero; Nousiainen, Olli; Vähäkangas, Jouko; Kautio, Kari; Lahti, Markku.
Proceedings: 16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007. Curran Associates Inc., 2007. p. 693-698.Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
TY - GEN
T1 - Development of a reliable LTCC-BGA module platform for RF/microwave telecommunication applications
AU - Kangasvieri, Tero
AU - Nousiainen, Olli
AU - Vähäkangas, Jouko
AU - Kautio, Kari
AU - Lahti, Markku
PY - 2007
Y1 - 2007
M3 - Conference article in proceedings
SN - 978-1-6227-6466-2
SP - 693
EP - 698
BT - Proceedings
PB - Curran Associates Inc.
ER -
Kangasvieri T, Nousiainen O, Vähäkangas J, Kautio K, Lahti M. Development of a reliable LTCC-BGA module platform for RF/microwave telecommunication applications. In Proceedings: 16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007. Curran Associates Inc. 2007. p. 693-698