Development of a reliable LTCC-BGA module platform for RF/microwave telecommunication applications

Tero Kangasvieri, Olli Nousiainen, Jouko Vähäkangas, Kari Kautio, Markku Lahti

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

5 Citations (Scopus)
Original languageEnglish
Title of host publicationProceedings
Subtitle of host publication16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007
PublisherCurran Associates Inc.
Pages693-698
ISBN (Print)978-1-6227-6466-2
Publication statusPublished - 2007
MoE publication typeA4 Article in a conference publication
Event16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007 - Oulu, Finland
Duration: 17 Jun 200720 Jun 2007

Conference

Conference16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007
CountryFinland
CityOulu
Period17/06/0720/06/07

Cite this

Kangasvieri, T., Nousiainen, O., Vähäkangas, J., Kautio, K., & Lahti, M. (2007). Development of a reliable LTCC-BGA module platform for RF/microwave telecommunication applications. In Proceedings: 16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007 (pp. 693-698). Curran Associates Inc..