Abstract
Heat flux sensors (HFSs) have potential in enabling applications that require direct and instantaneous tracking of thermal energy transfer. To facilitate the widespread use of the sensors, the sensors have to be robust and feasible to implement, while maintaining high sensitivity, fast response time, and low thermal obtrusiveness. However, most of the currently available HFSs are either challenging to manufacture or ill-suited for surface heat flux measurement because of their mechanical or thermal characteristics. In this article, the design of a novel microelectromechanical systems (MEMS) HFS structure intended for surface heat flux measurements is presented. A prototype batch is manufactured and the electrical performance of the prototype sensors is compared with commercially available HFSs. Results show that sensors with similar sensitivity as commercial sensors can be made by using MEMS methods.
Original language | English |
---|---|
Article number | 9245523 |
Journal | IEEE Transactions on Instrumentation and Measurement |
Volume | 70 |
Early online date | 30 Oct 2020 |
DOIs | |
Publication status | Published - 2021 |
MoE publication type | A1 Journal article-refereed |
Keywords
- 3-D
- heat flux
- microelectromechanical systems (MEMS)
- sensor
- thermopile