Development of a Vertically Configured MEMS Heat Flux Sensor

Antti Immonen, Saku Levikari, Feng Gao, Pertti Silventoinen, Mikko Kuisma

Research output: Contribution to journalArticleScientificpeer-review

Abstract

Heat flux sensors (HFSs) have potential in enabling applications that require direct and instantaneous tracking of thermal energy transfer. To facilitate the widespread use of the sensors, the sensors have to be robust and feasible to implement, while maintaining high sensitivity, fast response time, and low thermal obtrusiveness. However, most of the currently available HFSs are either challenging to manufacture or ill-suited for surface heat flux measurement because of their mechanical or thermal characteristics. In this article, the design of a novel microelectromechanical systems (MEMS) HFS structure intended for surface heat flux measurements is presented. A prototype batch is manufactured and the electrical performance of the prototype sensors is compared with commercially available HFSs. Results show that sensors with similar sensitivity as commercial sensors can be made by using MEMS methods.

Original languageEnglish
Article number9245523
JournalIEEE Transactions on Instrumentation and Measurement
Volume70
Early online date30 Oct 2020
DOIs
Publication statusPublished - 2021
MoE publication typeA1 Journal article-refereed

Keywords

  • 3-D
  • heat flux
  • microelectromechanical systems (MEMS)
  • sensor
  • thermopile

Fingerprint Dive into the research topics of 'Development of a Vertically Configured MEMS Heat Flux Sensor'. Together they form a unique fingerprint.

Cite this