| Original language | English |
|---|---|
| Title of host publication | Proceedings |
| Subtitle of host publication | 16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007 |
| Publisher | Curran Associates Inc. |
| Pages | 467-472 |
| ISBN (Print) | 978-1-6227-6466-2 |
| Publication status | Published - 2007 |
| MoE publication type | A4 Article in a conference publication |
| Event | 16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007 - Oulu, Finland Duration: 17 Jun 2007 → 20 Jun 2007 |
Conference
| Conference | 16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007 |
|---|---|
| Country/Territory | Finland |
| City | Oulu |
| Period | 17/06/07 → 20/06/07 |
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
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SDG 9 Industry, Innovation, and Infrastructure
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