Digest of Technical Papers: Microwave amplification with nanomechanical resonators

Francesco Massel, Tero T. Heikkilä, Juha-Matti Pirkkalainen, Sung-Un Cho, Heini Saloniemi, Pertti J. Hakonen, Mika A. Sillanpää

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    Abstract

    There is strong interest at present in nanoelectromechanical systems (NEMS) in IC technology. On one hand, the interest arises from the need to have integrated oscillators to replace quartz devices and, on the other hand, from the wish to have tunable filters for cognitive radios in mobile communications. In addition, there are lots of opportunities in quantum information processing, where coherence properties are crucial, and where mechanical systems at low temperatures are notoriously suitable as their harmonic character and low loss can provide exceedingly long relaxation times.
    Original languageEnglish
    Title of host publication2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers
    PublisherIEEE Institute of Electrical and Electronic Engineers
    Pages198 - 199
    Volume56
    ISBN (Print)978-146734513-2
    DOIs
    Publication statusPublished - 2013
    MoE publication typeA4 Article in a conference publication
    Event60th IEEE International Solid-State Circuits Conference, ISSCC 2013 - San Francisco, CA, United States
    Duration: 17 Feb 201321 Feb 2013

    Conference

    Conference60th IEEE International Solid-State Circuits Conference, ISSCC 2013
    Abbreviated titleISSCC 2013
    CountryUnited States
    CitySan Francisco, CA
    Period17/02/1321/02/13

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  • Cite this

    Massel, F., Heikkilä, T. T., Pirkkalainen, J-M., Cho, S-U., Saloniemi, H., Hakonen, P. J., & Sillanpää, M. A. (2013). Digest of Technical Papers: Microwave amplification with nanomechanical resonators. In 2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers (Vol. 56, pp. 198 - 199). [ 6487698] IEEE Institute of Electrical and Electronic Engineers. https://doi.org/10.1109/ISSCC.2013.6487698