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Direct wafer bonding of atomic layer deposited TiO2 and Al 2O3 thin films

  • R. L. Puurunen*
  • , T. Suni
  • , O. Ylivaara
  • , H. Kondo
  • , M. Ammar
  • , T. Ishida
  • , H. Fujita
  • , A. Bosseboeuf
  • , S. Zaima
  • , H. Kattelus
    • *Corresponding author for this work
    • Nagoya University
    • University of Paris-Saclay
    • University of Tokyo

    Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

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