Direct wafer bonding of atomic layer deposited TiO2 and Al 2O3 thin films

R. L. Puurunen, T. Suni, O. Ylivaara, H. Kondo, M. Ammar, T. Ishida, H. Fujita, A. Bosseboeuf, S. Zaima, H. Kattelus

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    5 Citations (Scopus)

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    Engineering & Materials Science