Dual-facet coupling of SOA array on 4-μm silicon-on-insulator implementing a hybrid integrated SOA-MZI wavelength converter

T. Alexoudi, D. Fitsios, G. T. Kanellos, N. Pleros, T. Tekin, Matteo Cherchi, Sami Ylinen, Mikko Harjanne, Markku Kapulainen, Timo Aalto

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

1 Citation (Scopus)

Abstract

Hybrid integration on Silicon-on-Insulator (SOI) has emerged as a practical solution for compact and high-performance Photonic Integrated Circuits (PICs). It aims at combining the cost-effectiveness and CMOS-compatibility benefits of the low-loss SOI waveguide platform with the versatile active optical functions that can be realized by III-V photonic materials. The utilization of SOI, as an integration board, with μm-scale dimensions allows for an excellent optical mode matching between silicon rib waveguides and active chips, allowing for minimal-loss coupling of the pre-fabricated IIIV components. While dual-facet coupling as well as III-V multi-element array bonding should be employed to enable enhanced active on-chip functions, so far only single side SOA bonding has been reported. In the present communication, we present a novel integration scheme that flip-chip bonds a 6-SOA array on 4-μm thick SOI technology by coupling both lateral SOA facets to the waveguides, and report on the experimental results of wavelength conversion operation of a dual-element Semiconductor Optical Amplifier – Mach Zehnder Interferometer (SOA-MZI) circuit. Thermocompression bonding was applied to integrate the pre-fabricated SOAs on SOI, with vertical and horizontal alignment performed successfully at both SOA facets. The demonstrated device has a footprint of 8.2mm x 0.3mm and experimental evaluation revealed a 12Gb/s wavelength conversion operation capability with only 0.8dB power penalty for the first SOA-MZI-on-SOI circuit and a 10Gb/s wavelength conversion operation capability with 2 dB power penalty for the second SOA-MZI circuit. Our experiments show how dual facet integration can significantly increase the level of optical functionalities achievable by flip-chip hybrid technology and pave the way for more advanced and more densely PICs.
Original languageEnglish
Title of host publicationSilicon Photonics IX
EditorsJoel Kubby, Graham T. Reed
PublisherInternational Society for Optics and Photonics SPIE
ISBN (Print)978-0-8194-9903-5
DOIs
Publication statusPublished - 2014
MoE publication typeA4 Article in a conference publication
EventSilicon Photonics IX - San Francisco, United States
Duration: 3 Feb 20145 Feb 2014

Publication series

SeriesProceedings of SPIE
Volume8990
ISSN0277-786X

Conference

ConferenceSilicon Photonics IX
CountryUnited States
CitySan Francisco
Period3/02/145/02/14

Fingerprint

Mach-Zehnder interferometers
light amplifiers
converters
flat surfaces
insulators
silicon
wavelengths
chips
photonics
waveguides
penalties
integrated circuits
cost effectiveness
footprints
compatibility
CMOS
platforms
communication
alignment
evaluation

Keywords

  • dual-facet coupling
  • hybrid integration
  • Mach-Zehnder interferometer
  • semiconductor optical amplifiers
  • thermocompression bonding
  • wavelength conversion

Cite this

Alexoudi, T., Fitsios, D., Kanellos, G. T., Pleros, N., Tekin, T., Cherchi, M., ... Aalto, T. (2014). Dual-facet coupling of SOA array on 4-μm silicon-on-insulator implementing a hybrid integrated SOA-MZI wavelength converter. In J. Kubby, & G. T. Reed (Eds.), Silicon Photonics IX [89900N] International Society for Optics and Photonics SPIE. Proceedings of SPIE, Vol.. 8990 https://doi.org/10.1117/12.2037874
Alexoudi, T. ; Fitsios, D. ; Kanellos, G. T. ; Pleros, N. ; Tekin, T. ; Cherchi, Matteo ; Ylinen, Sami ; Harjanne, Mikko ; Kapulainen, Markku ; Aalto, Timo. / Dual-facet coupling of SOA array on 4-μm silicon-on-insulator implementing a hybrid integrated SOA-MZI wavelength converter. Silicon Photonics IX. editor / Joel Kubby ; Graham T. Reed. International Society for Optics and Photonics SPIE, 2014. (Proceedings of SPIE, Vol. 8990).
@inproceedings{24c8fd0496794cceab53c2eccecf2122,
title = "Dual-facet coupling of SOA array on 4-μm silicon-on-insulator implementing a hybrid integrated SOA-MZI wavelength converter",
abstract = "Hybrid integration on Silicon-on-Insulator (SOI) has emerged as a practical solution for compact and high-performance Photonic Integrated Circuits (PICs). It aims at combining the cost-effectiveness and CMOS-compatibility benefits of the low-loss SOI waveguide platform with the versatile active optical functions that can be realized by III-V photonic materials. The utilization of SOI, as an integration board, with μm-scale dimensions allows for an excellent optical mode matching between silicon rib waveguides and active chips, allowing for minimal-loss coupling of the pre-fabricated IIIV components. While dual-facet coupling as well as III-V multi-element array bonding should be employed to enable enhanced active on-chip functions, so far only single side SOA bonding has been reported. In the present communication, we present a novel integration scheme that flip-chip bonds a 6-SOA array on 4-μm thick SOI technology by coupling both lateral SOA facets to the waveguides, and report on the experimental results of wavelength conversion operation of a dual-element Semiconductor Optical Amplifier – Mach Zehnder Interferometer (SOA-MZI) circuit. Thermocompression bonding was applied to integrate the pre-fabricated SOAs on SOI, with vertical and horizontal alignment performed successfully at both SOA facets. The demonstrated device has a footprint of 8.2mm x 0.3mm and experimental evaluation revealed a 12Gb/s wavelength conversion operation capability with only 0.8dB power penalty for the first SOA-MZI-on-SOI circuit and a 10Gb/s wavelength conversion operation capability with 2 dB power penalty for the second SOA-MZI circuit. Our experiments show how dual facet integration can significantly increase the level of optical functionalities achievable by flip-chip hybrid technology and pave the way for more advanced and more densely PICs.",
keywords = "dual-facet coupling, hybrid integration, Mach-Zehnder interferometer, semiconductor optical amplifiers, thermocompression bonding, wavelength conversion",
author = "T. Alexoudi and D. Fitsios and Kanellos, {G. T.} and N. Pleros and T. Tekin and Matteo Cherchi and Sami Ylinen and Mikko Harjanne and Markku Kapulainen and Timo Aalto",
year = "2014",
doi = "10.1117/12.2037874",
language = "English",
isbn = "978-0-8194-9903-5",
series = "Proceedings of SPIE",
publisher = "International Society for Optics and Photonics SPIE",
editor = "Joel Kubby and Reed, {Graham T.}",
booktitle = "Silicon Photonics IX",
address = "United States",

}

Alexoudi, T, Fitsios, D, Kanellos, GT, Pleros, N, Tekin, T, Cherchi, M, Ylinen, S, Harjanne, M, Kapulainen, M & Aalto, T 2014, Dual-facet coupling of SOA array on 4-μm silicon-on-insulator implementing a hybrid integrated SOA-MZI wavelength converter. in J Kubby & GT Reed (eds), Silicon Photonics IX., 89900N, International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 8990, Silicon Photonics IX, San Francisco, United States, 3/02/14. https://doi.org/10.1117/12.2037874

Dual-facet coupling of SOA array on 4-μm silicon-on-insulator implementing a hybrid integrated SOA-MZI wavelength converter. / Alexoudi, T.; Fitsios, D.; Kanellos, G. T.; Pleros, N.; Tekin, T.; Cherchi, Matteo; Ylinen, Sami; Harjanne, Mikko; Kapulainen, Markku; Aalto, Timo.

Silicon Photonics IX. ed. / Joel Kubby; Graham T. Reed. International Society for Optics and Photonics SPIE, 2014. 89900N (Proceedings of SPIE, Vol. 8990).

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

TY - GEN

T1 - Dual-facet coupling of SOA array on 4-μm silicon-on-insulator implementing a hybrid integrated SOA-MZI wavelength converter

AU - Alexoudi, T.

AU - Fitsios, D.

AU - Kanellos, G. T.

AU - Pleros, N.

AU - Tekin, T.

AU - Cherchi, Matteo

AU - Ylinen, Sami

AU - Harjanne, Mikko

AU - Kapulainen, Markku

AU - Aalto, Timo

PY - 2014

Y1 - 2014

N2 - Hybrid integration on Silicon-on-Insulator (SOI) has emerged as a practical solution for compact and high-performance Photonic Integrated Circuits (PICs). It aims at combining the cost-effectiveness and CMOS-compatibility benefits of the low-loss SOI waveguide platform with the versatile active optical functions that can be realized by III-V photonic materials. The utilization of SOI, as an integration board, with μm-scale dimensions allows for an excellent optical mode matching between silicon rib waveguides and active chips, allowing for minimal-loss coupling of the pre-fabricated IIIV components. While dual-facet coupling as well as III-V multi-element array bonding should be employed to enable enhanced active on-chip functions, so far only single side SOA bonding has been reported. In the present communication, we present a novel integration scheme that flip-chip bonds a 6-SOA array on 4-μm thick SOI technology by coupling both lateral SOA facets to the waveguides, and report on the experimental results of wavelength conversion operation of a dual-element Semiconductor Optical Amplifier – Mach Zehnder Interferometer (SOA-MZI) circuit. Thermocompression bonding was applied to integrate the pre-fabricated SOAs on SOI, with vertical and horizontal alignment performed successfully at both SOA facets. The demonstrated device has a footprint of 8.2mm x 0.3mm and experimental evaluation revealed a 12Gb/s wavelength conversion operation capability with only 0.8dB power penalty for the first SOA-MZI-on-SOI circuit and a 10Gb/s wavelength conversion operation capability with 2 dB power penalty for the second SOA-MZI circuit. Our experiments show how dual facet integration can significantly increase the level of optical functionalities achievable by flip-chip hybrid technology and pave the way for more advanced and more densely PICs.

AB - Hybrid integration on Silicon-on-Insulator (SOI) has emerged as a practical solution for compact and high-performance Photonic Integrated Circuits (PICs). It aims at combining the cost-effectiveness and CMOS-compatibility benefits of the low-loss SOI waveguide platform with the versatile active optical functions that can be realized by III-V photonic materials. The utilization of SOI, as an integration board, with μm-scale dimensions allows for an excellent optical mode matching between silicon rib waveguides and active chips, allowing for minimal-loss coupling of the pre-fabricated IIIV components. While dual-facet coupling as well as III-V multi-element array bonding should be employed to enable enhanced active on-chip functions, so far only single side SOA bonding has been reported. In the present communication, we present a novel integration scheme that flip-chip bonds a 6-SOA array on 4-μm thick SOI technology by coupling both lateral SOA facets to the waveguides, and report on the experimental results of wavelength conversion operation of a dual-element Semiconductor Optical Amplifier – Mach Zehnder Interferometer (SOA-MZI) circuit. Thermocompression bonding was applied to integrate the pre-fabricated SOAs on SOI, with vertical and horizontal alignment performed successfully at both SOA facets. The demonstrated device has a footprint of 8.2mm x 0.3mm and experimental evaluation revealed a 12Gb/s wavelength conversion operation capability with only 0.8dB power penalty for the first SOA-MZI-on-SOI circuit and a 10Gb/s wavelength conversion operation capability with 2 dB power penalty for the second SOA-MZI circuit. Our experiments show how dual facet integration can significantly increase the level of optical functionalities achievable by flip-chip hybrid technology and pave the way for more advanced and more densely PICs.

KW - dual-facet coupling

KW - hybrid integration

KW - Mach-Zehnder interferometer

KW - semiconductor optical amplifiers

KW - thermocompression bonding

KW - wavelength conversion

U2 - 10.1117/12.2037874

DO - 10.1117/12.2037874

M3 - Conference article in proceedings

SN - 978-0-8194-9903-5

T3 - Proceedings of SPIE

BT - Silicon Photonics IX

A2 - Kubby, Joel

A2 - Reed, Graham T.

PB - International Society for Optics and Photonics SPIE

ER -

Alexoudi T, Fitsios D, Kanellos GT, Pleros N, Tekin T, Cherchi M et al. Dual-facet coupling of SOA array on 4-μm silicon-on-insulator implementing a hybrid integrated SOA-MZI wavelength converter. In Kubby J, Reed GT, editors, Silicon Photonics IX. International Society for Optics and Photonics SPIE. 2014. 89900N. (Proceedings of SPIE, Vol. 8990). https://doi.org/10.1117/12.2037874