Dual-facet coupling of SOA array on 4-μm silicon-on-insulator implementing a hybrid integrated SOA-MZI wavelength converter

T. Alexoudi, D. Fitsios, G. T. Kanellos, N. Pleros, T. Tekin, Matteo Cherchi, Sami Ylinen, Mikko Harjanne, Markku Kapulainen, Timo Aalto

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    1 Citation (Scopus)

    Abstract

    Hybrid integration on Silicon-on-Insulator (SOI) has emerged as a practical solution for compact and high-performance Photonic Integrated Circuits (PICs). It aims at combining the cost-effectiveness and CMOS-compatibility benefits of the low-loss SOI waveguide platform with the versatile active optical functions that can be realized by III-V photonic materials. The utilization of SOI, as an integration board, with μm-scale dimensions allows for an excellent optical mode matching between silicon rib waveguides and active chips, allowing for minimal-loss coupling of the pre-fabricated IIIV components. While dual-facet coupling as well as III-V multi-element array bonding should be employed to enable enhanced active on-chip functions, so far only single side SOA bonding has been reported. In the present communication, we present a novel integration scheme that flip-chip bonds a 6-SOA array on 4-μm thick SOI technology by coupling both lateral SOA facets to the waveguides, and report on the experimental results of wavelength conversion operation of a dual-element Semiconductor Optical Amplifier – Mach Zehnder Interferometer (SOA-MZI) circuit. Thermocompression bonding was applied to integrate the pre-fabricated SOAs on SOI, with vertical and horizontal alignment performed successfully at both SOA facets. The demonstrated device has a footprint of 8.2mm x 0.3mm and experimental evaluation revealed a 12Gb/s wavelength conversion operation capability with only 0.8dB power penalty for the first SOA-MZI-on-SOI circuit and a 10Gb/s wavelength conversion operation capability with 2 dB power penalty for the second SOA-MZI circuit. Our experiments show how dual facet integration can significantly increase the level of optical functionalities achievable by flip-chip hybrid technology and pave the way for more advanced and more densely PICs.
    Original languageEnglish
    Title of host publicationSilicon Photonics IX
    EditorsJoel Kubby, Graham T. Reed
    PublisherInternational Society for Optics and Photonics SPIE
    ISBN (Print)978-0-8194-9903-5
    DOIs
    Publication statusPublished - 2014
    MoE publication typeA4 Article in a conference publication
    EventSilicon Photonics IX - San Francisco, United States
    Duration: 3 Feb 20145 Feb 2014

    Publication series

    SeriesProceedings of SPIE
    Volume8990
    ISSN0277-786X

    Conference

    ConferenceSilicon Photonics IX
    CountryUnited States
    CitySan Francisco
    Period3/02/145/02/14

    Fingerprint

    Mach-Zehnder interferometers
    light amplifiers
    converters
    flat surfaces
    insulators
    silicon
    wavelengths
    chips
    photonics
    waveguides
    penalties
    integrated circuits
    cost effectiveness
    footprints
    compatibility
    CMOS
    platforms
    communication
    alignment
    evaluation

    Keywords

    • dual-facet coupling
    • hybrid integration
    • Mach-Zehnder interferometer
    • semiconductor optical amplifiers
    • thermocompression bonding
    • wavelength conversion

    Cite this

    Alexoudi, T., Fitsios, D., Kanellos, G. T., Pleros, N., Tekin, T., Cherchi, M., ... Aalto, T. (2014). Dual-facet coupling of SOA array on 4-μm silicon-on-insulator implementing a hybrid integrated SOA-MZI wavelength converter. In J. Kubby, & G. T. Reed (Eds.), Silicon Photonics IX [89900N] International Society for Optics and Photonics SPIE. Proceedings of SPIE, Vol.. 8990 https://doi.org/10.1117/12.2037874
    Alexoudi, T. ; Fitsios, D. ; Kanellos, G. T. ; Pleros, N. ; Tekin, T. ; Cherchi, Matteo ; Ylinen, Sami ; Harjanne, Mikko ; Kapulainen, Markku ; Aalto, Timo. / Dual-facet coupling of SOA array on 4-μm silicon-on-insulator implementing a hybrid integrated SOA-MZI wavelength converter. Silicon Photonics IX. editor / Joel Kubby ; Graham T. Reed. International Society for Optics and Photonics SPIE, 2014. (Proceedings of SPIE, Vol. 8990).
    @inproceedings{24c8fd0496794cceab53c2eccecf2122,
    title = "Dual-facet coupling of SOA array on 4-μm silicon-on-insulator implementing a hybrid integrated SOA-MZI wavelength converter",
    abstract = "Hybrid integration on Silicon-on-Insulator (SOI) has emerged as a practical solution for compact and high-performance Photonic Integrated Circuits (PICs). It aims at combining the cost-effectiveness and CMOS-compatibility benefits of the low-loss SOI waveguide platform with the versatile active optical functions that can be realized by III-V photonic materials. The utilization of SOI, as an integration board, with μm-scale dimensions allows for an excellent optical mode matching between silicon rib waveguides and active chips, allowing for minimal-loss coupling of the pre-fabricated IIIV components. While dual-facet coupling as well as III-V multi-element array bonding should be employed to enable enhanced active on-chip functions, so far only single side SOA bonding has been reported. In the present communication, we present a novel integration scheme that flip-chip bonds a 6-SOA array on 4-μm thick SOI technology by coupling both lateral SOA facets to the waveguides, and report on the experimental results of wavelength conversion operation of a dual-element Semiconductor Optical Amplifier – Mach Zehnder Interferometer (SOA-MZI) circuit. Thermocompression bonding was applied to integrate the pre-fabricated SOAs on SOI, with vertical and horizontal alignment performed successfully at both SOA facets. The demonstrated device has a footprint of 8.2mm x 0.3mm and experimental evaluation revealed a 12Gb/s wavelength conversion operation capability with only 0.8dB power penalty for the first SOA-MZI-on-SOI circuit and a 10Gb/s wavelength conversion operation capability with 2 dB power penalty for the second SOA-MZI circuit. Our experiments show how dual facet integration can significantly increase the level of optical functionalities achievable by flip-chip hybrid technology and pave the way for more advanced and more densely PICs.",
    keywords = "dual-facet coupling, hybrid integration, Mach-Zehnder interferometer, semiconductor optical amplifiers, thermocompression bonding, wavelength conversion",
    author = "T. Alexoudi and D. Fitsios and Kanellos, {G. T.} and N. Pleros and T. Tekin and Matteo Cherchi and Sami Ylinen and Mikko Harjanne and Markku Kapulainen and Timo Aalto",
    year = "2014",
    doi = "10.1117/12.2037874",
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    series = "Proceedings of SPIE",
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    Alexoudi, T, Fitsios, D, Kanellos, GT, Pleros, N, Tekin, T, Cherchi, M, Ylinen, S, Harjanne, M, Kapulainen, M & Aalto, T 2014, Dual-facet coupling of SOA array on 4-μm silicon-on-insulator implementing a hybrid integrated SOA-MZI wavelength converter. in J Kubby & GT Reed (eds), Silicon Photonics IX., 89900N, International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 8990, Silicon Photonics IX, San Francisco, United States, 3/02/14. https://doi.org/10.1117/12.2037874

    Dual-facet coupling of SOA array on 4-μm silicon-on-insulator implementing a hybrid integrated SOA-MZI wavelength converter. / Alexoudi, T.; Fitsios, D.; Kanellos, G. T.; Pleros, N.; Tekin, T.; Cherchi, Matteo; Ylinen, Sami; Harjanne, Mikko; Kapulainen, Markku; Aalto, Timo.

    Silicon Photonics IX. ed. / Joel Kubby; Graham T. Reed. International Society for Optics and Photonics SPIE, 2014. 89900N (Proceedings of SPIE, Vol. 8990).

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    TY - GEN

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    AU - Fitsios, D.

    AU - Kanellos, G. T.

    AU - Pleros, N.

    AU - Tekin, T.

    AU - Cherchi, Matteo

    AU - Ylinen, Sami

    AU - Harjanne, Mikko

    AU - Kapulainen, Markku

    AU - Aalto, Timo

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    N2 - Hybrid integration on Silicon-on-Insulator (SOI) has emerged as a practical solution for compact and high-performance Photonic Integrated Circuits (PICs). It aims at combining the cost-effectiveness and CMOS-compatibility benefits of the low-loss SOI waveguide platform with the versatile active optical functions that can be realized by III-V photonic materials. The utilization of SOI, as an integration board, with μm-scale dimensions allows for an excellent optical mode matching between silicon rib waveguides and active chips, allowing for minimal-loss coupling of the pre-fabricated IIIV components. While dual-facet coupling as well as III-V multi-element array bonding should be employed to enable enhanced active on-chip functions, so far only single side SOA bonding has been reported. In the present communication, we present a novel integration scheme that flip-chip bonds a 6-SOA array on 4-μm thick SOI technology by coupling both lateral SOA facets to the waveguides, and report on the experimental results of wavelength conversion operation of a dual-element Semiconductor Optical Amplifier – Mach Zehnder Interferometer (SOA-MZI) circuit. Thermocompression bonding was applied to integrate the pre-fabricated SOAs on SOI, with vertical and horizontal alignment performed successfully at both SOA facets. The demonstrated device has a footprint of 8.2mm x 0.3mm and experimental evaluation revealed a 12Gb/s wavelength conversion operation capability with only 0.8dB power penalty for the first SOA-MZI-on-SOI circuit and a 10Gb/s wavelength conversion operation capability with 2 dB power penalty for the second SOA-MZI circuit. Our experiments show how dual facet integration can significantly increase the level of optical functionalities achievable by flip-chip hybrid technology and pave the way for more advanced and more densely PICs.

    AB - Hybrid integration on Silicon-on-Insulator (SOI) has emerged as a practical solution for compact and high-performance Photonic Integrated Circuits (PICs). It aims at combining the cost-effectiveness and CMOS-compatibility benefits of the low-loss SOI waveguide platform with the versatile active optical functions that can be realized by III-V photonic materials. The utilization of SOI, as an integration board, with μm-scale dimensions allows for an excellent optical mode matching between silicon rib waveguides and active chips, allowing for minimal-loss coupling of the pre-fabricated IIIV components. While dual-facet coupling as well as III-V multi-element array bonding should be employed to enable enhanced active on-chip functions, so far only single side SOA bonding has been reported. In the present communication, we present a novel integration scheme that flip-chip bonds a 6-SOA array on 4-μm thick SOI technology by coupling both lateral SOA facets to the waveguides, and report on the experimental results of wavelength conversion operation of a dual-element Semiconductor Optical Amplifier – Mach Zehnder Interferometer (SOA-MZI) circuit. Thermocompression bonding was applied to integrate the pre-fabricated SOAs on SOI, with vertical and horizontal alignment performed successfully at both SOA facets. The demonstrated device has a footprint of 8.2mm x 0.3mm and experimental evaluation revealed a 12Gb/s wavelength conversion operation capability with only 0.8dB power penalty for the first SOA-MZI-on-SOI circuit and a 10Gb/s wavelength conversion operation capability with 2 dB power penalty for the second SOA-MZI circuit. Our experiments show how dual facet integration can significantly increase the level of optical functionalities achievable by flip-chip hybrid technology and pave the way for more advanced and more densely PICs.

    KW - dual-facet coupling

    KW - hybrid integration

    KW - Mach-Zehnder interferometer

    KW - semiconductor optical amplifiers

    KW - thermocompression bonding

    KW - wavelength conversion

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    M3 - Conference article in proceedings

    SN - 978-0-8194-9903-5

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    PB - International Society for Optics and Photonics SPIE

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    Alexoudi T, Fitsios D, Kanellos GT, Pleros N, Tekin T, Cherchi M et al. Dual-facet coupling of SOA array on 4-μm silicon-on-insulator implementing a hybrid integrated SOA-MZI wavelength converter. In Kubby J, Reed GT, editors, Silicon Photonics IX. International Society for Optics and Photonics SPIE. 2014. 89900N. (Proceedings of SPIE, Vol. 8990). https://doi.org/10.1117/12.2037874