Abstract
We report on the simultaneous wavelength conversion operation of a dual-element semiconductor optical amplifier-Mach-Zehnder interferometer (SOA-MZI) array hybridly integrated on a 4-μm silicon-on-insulator (SOI) waveguide platform through thermocompression bonding. The SOAs are part of a six-element SOA array with both facets coupled on SOI through vertical and horizontal alignments. The device achieves almost two orders of magnitude reduction in footprint compared with state-of-the-art hybridly integrated SOA-MZI structures. We present for the first time experimental proof of the successful operation of a dual-element SOA-MZI device based on III-V technology on SoI that serves as a wavelength converter, with one SOA-MZI yielding error-free performance with a 0.8-dB power penalty at 12.5 Gb/s and the second SOA-MZI operating error-free at 10 Gb/s with a 2-dB power penalty. © 2014 IEEE.
Original language | English |
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Pages (from-to) | 560-563 |
Number of pages | 4 |
Journal | IEEE Photonics Technology Letters |
Volume | 26 |
Issue number | 6 |
DOIs | |
Publication status | Published - 15 Mar 2014 |
MoE publication type | Not Eligible |
Keywords
- Dual-facet coupling
- Hybrid integration
- Mach-Zehnder interferometer
- Semiconductor optical amplifier
- Thermocompression bonding
- Wavelength conversion