Dynamic approach to service level agreement risk

Pirkko Kuusela, Ilkka Norros

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

6 Citations (Scopus)

Abstract

We model the time and network element failure dynamics of network operators' service level agreement (SLA) risks. This involves identification of events interrupting service and stochastic modeling of failure events. The key concepts are modeling how a service builds from simple network components and the approximation of interval availability, when failures are rare and the SLA tracking period is in month/year scale. The dynamic SLA-risk gives rise to a component importance measure, which prioritizes repairs or indicates the importance of operability of a component in terms of SLA-risk in the current network and SLA state. Our work can be used in network planning and OAM.
Original languageEnglish
Title of host publicationProceedings
Subtitle of host publication9th International Conference on the Design of Reliable Communication Networks, DRCN 2013
PublisherIEEE Institute of Electrical and Electronic Engineers
Pages266-273
ISBN (Electronic)978-963-8111-79-1
ISBN (Print)978-1-4799-0049-7
Publication statusPublished - 2013
MoE publication typeA4 Article in a conference publication
Event9th International Conference on Design of Reliable Communication Networks, DRCN 2013, 4 - 7 March 2013, Budapest, Hungary - Budapest, Hungary
Duration: 4 Mar 20137 Mar 2013

Conference

Conference9th International Conference on Design of Reliable Communication Networks, DRCN 2013, 4 - 7 March 2013, Budapest, Hungary
Abbreviated titleDRCN 2013
CountryHungary
CityBudapest
Period4/03/137/03/13

Keywords

  • service level agreement
  • importance measure
  • risk
  • network reliability
  • availability

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  • Cite this

    Kuusela, P., & Norros, I. (2013). Dynamic approach to service level agreement risk. In Proceedings: 9th International Conference on the Design of Reliable Communication Networks, DRCN 2013 (pp. 266-273). IEEE Institute of Electrical and Electronic Engineers. http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6529870