Effect of ENIG deposition on the failure mechanisms of thermomechanically loaded lead-free 2nd level interconnections in LTCC/PWB assemblies

  • O. Nousiainen*
  • , T. Kangasvieri
  • , Kari Kautio
  • , R. Rautioaho
  • , J. Vähä-Kangas
    • *Corresponding author for this work

    Research output: Contribution to journal › Article › Scientific › peer-review

    4 Citations (Scopus)

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    INIS

    Engineering

    Material Science