Effect of ENIG deposition on the failure mechanisms of thermomechanically loaded lead-free 2nd level interconnections in LTCC/PWB assemblies

O. Nousiainen (Corresponding Author), T. Kangasvieri, Kari Kautio, R. Rautioaho, J. Vähä-Kangas

    Research output: Contribution to journal › Article › Scientific › peer-review

    4 Citations (Scopus)

    Fingerprint

    Dive into the research topics of 'Effect of ENIG deposition on the failure mechanisms of thermomechanically loaded lead-free 2nd level interconnections in LTCC/PWB assemblies'. Together they form a unique fingerprint.

    Keyphrases

    INIS

    Engineering

    Material Science