Abstract
The effect of oxygen on the reactions in the Si/Ta/Cu and Si/TaC/Cu metallization systems was investigated by utilizing the assessed Ta–O binary and the evaluated ternary Ta–C–O phase diagrams together with detailed transmission electron microscopy (TEM) and secondary ion mass spectrometry analyses (SIMS).
The presence of some form of amorphous tantalum oxide at the Ta/Cu and TaC/Cu interfaces was experimentally verified. The formation of the interfacial layers was explained with the help of the assessed phase diagrams as well as with the available kinetic data.
The presence of some form of amorphous tantalum oxide at the Ta/Cu and TaC/Cu interfaces was experimentally verified. The formation of the interfacial layers was explained with the help of the assessed phase diagrams as well as with the available kinetic data.
Original language | English |
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Pages (from-to) | 279-287 |
Journal | Microelectronic Engineering |
Volume | 64 |
Issue number | 1-4 |
DOIs | |
Publication status | Published - 2002 |
MoE publication type | A1 Journal article-refereed |
Keywords
- phase diagrams
- diffusion barriers
- copper metallisation
- tantalum
- tantalum carbide