Effect of phosphor encapsulant on the thermal resistance of a high-power COB LED module

Eveliina Juntunen, Olli Tapaninen, Aila Sitomaniemi, Veli Heikkinen

Research output: Contribution to journalArticleScientificpeer-review

22 Citations (Scopus)

Abstract

With their many advantages, such as small size, energy efficiency, and long lifetime, light emitting diodes (LEDs) are conquering the lighting world. Blue LEDs, because of their high efficiency, are commonly used and a phosphor is used to convert blue light into white light. The remote phosphor concept has gained attention since it promises to deliver better efficacy than solutions in which the phosphor is applied directly on the LEDs. In this paper, the effect of phosphor packaging on the thermal performance of a high-power chip-on-board LED module is studied. Both simulations and measurements show that, despite the added thermal load caused by white light conversion losses in the phosphor, the average temperature of the phosphor-coated LEDs matches with that of noncoated LEDs. The phosphor encapsulant generates a parallel heat conduction path which reduces the thermal resistance from the LED chips to ambient and compensates the thermal power increase.
Original languageEnglish
Pages (from-to)1148-1154
Number of pages6
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume3
Issue number7
DOIs
Publication statusPublished - 2013
MoE publication typeA1 Journal article-refereed

Fingerprint

Heat resistance
Phosphors
Light emitting diodes
Thermal load
Heat conduction
Energy efficiency
Packaging
Lighting

Keywords

  • light emitting diodes LEDs
  • multichip modules
  • phosphors
  • thermal analysis

Cite this

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title = "Effect of phosphor encapsulant on the thermal resistance of a high-power COB LED module",
abstract = "With their many advantages, such as small size, energy efficiency, and long lifetime, light emitting diodes (LEDs) are conquering the lighting world. Blue LEDs, because of their high efficiency, are commonly used and a phosphor is used to convert blue light into white light. The remote phosphor concept has gained attention since it promises to deliver better efficacy than solutions in which the phosphor is applied directly on the LEDs. In this paper, the effect of phosphor packaging on the thermal performance of a high-power chip-on-board LED module is studied. Both simulations and measurements show that, despite the added thermal load caused by white light conversion losses in the phosphor, the average temperature of the phosphor-coated LEDs matches with that of noncoated LEDs. The phosphor encapsulant generates a parallel heat conduction path which reduces the thermal resistance from the LED chips to ambient and compensates the thermal power increase.",
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author = "Eveliina Juntunen and Olli Tapaninen and Aila Sitomaniemi and Veli Heikkinen",
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Effect of phosphor encapsulant on the thermal resistance of a high-power COB LED module. / Juntunen, Eveliina; Tapaninen, Olli; Sitomaniemi, Aila; Heikkinen, Veli.

In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 3, No. 7, 2013, p. 1148-1154.

Research output: Contribution to journalArticleScientificpeer-review

TY - JOUR

T1 - Effect of phosphor encapsulant on the thermal resistance of a high-power COB LED module

AU - Juntunen, Eveliina

AU - Tapaninen, Olli

AU - Sitomaniemi, Aila

AU - Heikkinen, Veli

PY - 2013

Y1 - 2013

N2 - With their many advantages, such as small size, energy efficiency, and long lifetime, light emitting diodes (LEDs) are conquering the lighting world. Blue LEDs, because of their high efficiency, are commonly used and a phosphor is used to convert blue light into white light. The remote phosphor concept has gained attention since it promises to deliver better efficacy than solutions in which the phosphor is applied directly on the LEDs. In this paper, the effect of phosphor packaging on the thermal performance of a high-power chip-on-board LED module is studied. Both simulations and measurements show that, despite the added thermal load caused by white light conversion losses in the phosphor, the average temperature of the phosphor-coated LEDs matches with that of noncoated LEDs. The phosphor encapsulant generates a parallel heat conduction path which reduces the thermal resistance from the LED chips to ambient and compensates the thermal power increase.

AB - With their many advantages, such as small size, energy efficiency, and long lifetime, light emitting diodes (LEDs) are conquering the lighting world. Blue LEDs, because of their high efficiency, are commonly used and a phosphor is used to convert blue light into white light. The remote phosphor concept has gained attention since it promises to deliver better efficacy than solutions in which the phosphor is applied directly on the LEDs. In this paper, the effect of phosphor packaging on the thermal performance of a high-power chip-on-board LED module is studied. Both simulations and measurements show that, despite the added thermal load caused by white light conversion losses in the phosphor, the average temperature of the phosphor-coated LEDs matches with that of noncoated LEDs. The phosphor encapsulant generates a parallel heat conduction path which reduces the thermal resistance from the LED chips to ambient and compensates the thermal power increase.

KW - light emitting diodes LEDs

KW - multichip modules

KW - phosphors

KW - thermal analysis

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JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

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