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Keyphrases
Residual Stress
100%
TiO2 Film
100%
Precursor Chemistry
100%
ALD Al2O3
100%
Al2O3 Film
100%
Deposition Process
25%
Intrinsic Stress
25%
Metal Precursor
25%
Oxygen Source
25%
Scanning Electron Microscopy
12%
Impurities
12%
Deposition Temperature
12%
Film Thickness
12%
TiO2-Al2O3
12%
Rutile
12%
Aluminum Oxide
12%
Titanium Tetrachloride
12%
Methanol
12%
Hybrid Materials
12%
X Ray Diffraction
12%
Thermal Stress
12%
Phase Transformation
12%
Time-of-flight Elastic Recoil Detection Analysis
12%
Annealing Temperature
12%
Coefficient of Thermal Expansion
12%
Post-deposition Annealing
12%
Si Wafer
12%
Characterization Data
12%
Delamination
12%
Stress Measurement
12%
Aluminum Chloride
12%
Amorphous Films
12%
Film Characterization
12%
Compositional Properties
12%
Grain Coalescence
12%
Morphological Properties
12%
Polycrystalline Films
12%
Deposited Film
12%
Crystalline Transformation
12%
INIS
precursor
100%
chemistry
100%
residual stresses
100%
titanium oxides
100%
films
100%
deposition
36%
thickness
18%
metals
18%
oxygen
18%
data
9%
hybrids
9%
morphology
9%
substrates
9%
scanning electron microscopy
9%
detection
9%
coalescence
9%
impurities
9%
cracking
9%
annealing
9%
thin films
9%
methanol
9%
voids
9%
x-ray diffraction
9%
thermal expansion
9%
time-of-flight method
9%
recoils
9%
crystallization
9%
phase transformations
9%
thermal stresses
9%
polycrystals
9%
buckling
9%
Material Science
Residual Stress
100%
Film
100%
Titanium Dioxide
100%
Aluminum Oxide
100%
Film Thickness
11%
Hybrid Material
11%
Delamination
11%
Annealing
11%
Stress Measurement
11%
Scanning Electron Microscopy
11%
Thermal Stress
11%
X-Ray Diffraction
11%
Amorphous Film
11%
Thermal Expansion
11%
Morphology
11%
Thin Films
11%
Engineering
Residual Stress
100%
Deposited Film
25%
Oxygen Source
25%
Intrinsic Stress
25%
Metal Precursor
25%
Deposition Process
25%
Deposition Temperature
12%
Tensiles
12%
Time-of-Flight
12%
Annealing Temperature
12%
Extreme Case
12%
Si Wafer
12%
Expansion Coefficient
12%
Delamination
12%
Thermal Stress
12%
Ray Diffraction
12%
Thin Films
12%
Polycrystalline
12%