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Effect of Process Gases on Fabricating Tapered Through-Silicon vias by Continuous SF6/O2/Ar Plasma Etching

  • Pradeep Dixit*
  • , Sami Vähänen
  • , Jaakko Salonen
  • , Philippe Monnoyer
    • *Corresponding author for this work

    Research output: Contribution to journal › Article › Scientific › peer-review

    26   Link opens in a new tab Citations (Scopus)

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