Abstract
The interaction of copper with sulfide-containing simulated saline groundwater is studied by electrochemical techniques (voltammetry, current-time transients, and electrochemical impedance spectroscopy, EIS) complemented with surface and cross-sectional microscopic observations and energy dispersive spectroscopic analyses. Both experimental findings and quantitative interpretation of EIS data using previously published kinetic models indicate that no continuous adherent barrier-type layer is formed on Cu in sulfide-containing groundwater, thus precluding the possibility of the development of localized corrosion modes.
| Original language | English |
|---|---|
| Article number | 041505 |
| Number of pages | 12 |
| Journal | Journal of the Electrochemical Society |
| Volume | 171 |
| Issue number | 4 |
| DOIs | |
| Publication status | Published - 29 Apr 2024 |
| MoE publication type | A1 Journal article-refereed |
Funding
The financial support of this work by DEHYDSU project\u2014\u201CDefects, hydrogen and susceptibility of Cu-OFP to stress corrosion cracking in sulfide containing environment\u201D - within the frames of the Finnish National Nuclear Safety and Waste Management Research Program (SAFER 2028) is gratefully acknowledged. M.B. acknowledges funding from the National Recovery and Resilience Plan of the Republic of Bulgaria (Grant No. BG-RRP-2.004\u20130002 \u201CBiOrgaMCT\u201D).
Keywords
- copper
- corrosion modeling
- localized corrosion
- passivity
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