Effect of sulfide on de-passivation and re-passivation of copper in borate buffer solution

Martin Bojinov; Tiina Ikäläinen; Zaiqing Que; Timo Saario

doi:10.1016/j.corsci.2023.111201

Effect of sulfide on de-passivation and re-passivation of copper in borate buffer solution

Martin Bojinov^* (Corresponding Author), Tiina Ikäläinen, Zaiqing Que, Timo Saario

^*Corresponding author for this work

BA4509 Advanced materials for nuclear energy

University of Chemical Technology and Metallurgy

Research output: Contribution to journal › Article › Scientific › peer-review

2 Citations (Scopus)

Abstract

The interaction of copper with sulfide-containing borate buffer solution either via direct immersion or by de-passivation following oxide film formation, is studied by electrochemical techniques (voltammetry, current-time transients and electrochemical impedance spectroscopy, EIS) complemented with surface and cross-sectional microscopic observations and energy dispersive spectroscopic analyses. Both experimental findings and quantitative interpretation of EIS data using newly developed and previously published kinetic models indicate that no continuous adherent barrier-type layer is formed on Cu in sulfide solutions, thus precluding the possibility of the development of localized corrosion modes.

Original language	English
Article number	111201
Number of pages	13
Journal	Corrosion Science
Volume	218
DOIs	https://doi.org/10.1016/j.corsci.2023.111201
Publication status	Published - 1 Jul 2023
MoE publication type	A1 Journal article-refereed

Keywords

Copper
Electrochemical impedance spectroscopy
Kinetic model
Re-passivation
Sulfide solution

Access to Document

10.1016/j.corsci.2023.111201

Cite this

@article{c2c6d916a2fa4a9590a87458df5e87fb,

title = "Effect of sulfide on de-passivation and re-passivation of copper in borate buffer solution",

abstract = "The interaction of copper with sulfide-containing borate buffer solution either via direct immersion or by de-passivation following oxide film formation, is studied by electrochemical techniques (voltammetry, current-time transients and electrochemical impedance spectroscopy, EIS) complemented with surface and cross-sectional microscopic observations and energy dispersive spectroscopic analyses. Both experimental findings and quantitative interpretation of EIS data using newly developed and previously published kinetic models indicate that no continuous adherent barrier-type layer is formed on Cu in sulfide solutions, thus precluding the possibility of the development of localized corrosion modes.",

keywords = "Copper, Electrochemical impedance spectroscopy, Kinetic model, Re-passivation, Sulfide solution",

author = "Martin Bojinov and Tiina Ik{\"a}l{\"a}inen and Zaiqing Que and Timo Saario",

note = "Funding Information: The financial support of this work by the 129074/SUCCESS project within the frames of the Finnish Research Program on Nuclear Waste Management ( KYT 2022 ) is gratefully acknowledged. Publisher Copyright: {\textcopyright} 2023 Elsevier Ltd",

year = "2023",

month = jul,

day = "1",

doi = "10.1016/j.corsci.2023.111201",

language = "English",

volume = "218",

journal = "Corrosion Science",

issn = "0010-938X",

publisher = "Elsevier",

}

TY - JOUR

T1 - Effect of sulfide on de-passivation and re-passivation of copper in borate buffer solution

AU - Bojinov, Martin

AU - Ikäläinen, Tiina

AU - Que, Zaiqing

AU - Saario, Timo

N1 - Funding Information: The financial support of this work by the 129074/SUCCESS project within the frames of the Finnish Research Program on Nuclear Waste Management ( KYT 2022 ) is gratefully acknowledged. Publisher Copyright: © 2023 Elsevier Ltd

PY - 2023/7/1

Y1 - 2023/7/1

N2 - The interaction of copper with sulfide-containing borate buffer solution either via direct immersion or by de-passivation following oxide film formation, is studied by electrochemical techniques (voltammetry, current-time transients and electrochemical impedance spectroscopy, EIS) complemented with surface and cross-sectional microscopic observations and energy dispersive spectroscopic analyses. Both experimental findings and quantitative interpretation of EIS data using newly developed and previously published kinetic models indicate that no continuous adherent barrier-type layer is formed on Cu in sulfide solutions, thus precluding the possibility of the development of localized corrosion modes.

AB - The interaction of copper with sulfide-containing borate buffer solution either via direct immersion or by de-passivation following oxide film formation, is studied by electrochemical techniques (voltammetry, current-time transients and electrochemical impedance spectroscopy, EIS) complemented with surface and cross-sectional microscopic observations and energy dispersive spectroscopic analyses. Both experimental findings and quantitative interpretation of EIS data using newly developed and previously published kinetic models indicate that no continuous adherent barrier-type layer is formed on Cu in sulfide solutions, thus precluding the possibility of the development of localized corrosion modes.

KW - Copper

KW - Electrochemical impedance spectroscopy

KW - Kinetic model

KW - Re-passivation

KW - Sulfide solution

UR - http://www.scopus.com/inward/record.url?scp=85153483703&partnerID=8YFLogxK

U2 - 10.1016/j.corsci.2023.111201

DO - 10.1016/j.corsci.2023.111201

M3 - Article

AN - SCOPUS:85153483703

SN - 0010-938X

VL - 218

JO - Corrosion Science

JF - Corrosion Science

M1 - 111201

ER -

Effect of sulfide on de-passivation and re-passivation of copper in borate buffer solution

Abstract

Keywords

Access to Document

Other files and links

Fingerprint

Cite this