Effect of thermal stresses along crack surface on ultrasonic response

I. Virkkunen; M. Kemppainen; Jorma Pitkänen; Hannu Hänninen

doi:10.1063/1.1711757

Effect of thermal stresses along crack surface on ultrasonic response

I. Virkkunen, M. Kemppainen, Jorma Pitkänen, Hannu Hänninen

VTT Technical Research Centre of Finland

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific

Abstract

Artificial flaws can be manufactured by controlled thermal fatigue loading. The produced cracks can be introduced to a wide variety of materials. This technology gives also a unique opportunity to monitor the ultrasonic response of a crack during thermal loading.
This paper reports studies on the effects of different thermal load cycles on the ultrasonic response. The loads are analyzed with FEM. Two cracked samples were loaded with different thermal load cycles.

Original language	English
Title of host publication	Quantitative Nondestructive Evaluation
Publisher	American Institute of Physics (AIP)
Pages	1224-1231
Volume	23
ISBN (Print)	0-7354-0173-X
DOIs	https://doi.org/10.1063/1.1711757
Publication status	Published - 2004
MoE publication type	B3 Non-refereed article in conference proceedings
Event	Review of Progress in Quantitative Nondestructive Evaluation Conference, QNDE - Green Bay, United States Duration: 27 Jul 2003 → 1 Aug 2003

Publication series

Series	AIP Conference Proceedings
Volume	700
ISSN	0094-243X

Conference

Conference	Review of Progress in Quantitative Nondestructive Evaluation Conference, QNDE
Country	United States
City	Green Bay
Period	27/07/03 → 1/08/03

Access to Document

10.1063/1.1711757

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title = "Effect of thermal stresses along crack surface on ultrasonic response",

abstract = "Artificial flaws can be manufactured by controlled thermal fatigue loading. The produced cracks can be introduced to a wide variety of materials. This technology gives also a unique opportunity to monitor the ultrasonic response of a crack during thermal loading.This paper reports studies on the effects of different thermal load cycles on the ultrasonic response. The loads are analyzed with FEM. Two cracked samples were loaded with different thermal load cycles.",

author = "I. Virkkunen and M. Kemppainen and Jorma Pitk{\"a}nen and Hannu H{\"a}nninen",

year = "2004",

doi = "10.1063/1.1711757",

language = "English",

isbn = "0-7354-0173-X",

volume = "23",

series = "AIP Conference Proceedings",

publisher = "American Institute of Physics (AIP)",

pages = "1224--1231",

booktitle = "Quantitative Nondestructive Evaluation",

address = "United States",

note = "Review of Progress in Quantitative Nondestructive Evaluation Conference, QNDE ; Conference date: 27-07-2003 Through 01-08-2003",

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Virkkunen, I, Kemppainen, M, Pitkänen, J & Hänninen, H 2004, Effect of thermal stresses along crack surface on ultrasonic response. in Quantitative Nondestructive Evaluation . vol. 23, American Institute of Physics (AIP), AIP Conference Proceedings, vol. 700, pp. 1224-1231, Review of Progress in Quantitative Nondestructive Evaluation Conference, QNDE, Green Bay, United States, 27/07/03. https://doi.org/10.1063/1.1711757

Effect of thermal stresses along crack surface on ultrasonic response. / Virkkunen, I.; Kemppainen, M.; Pitkänen, Jorma; Hänninen, Hannu.

Quantitative Nondestructive Evaluation . Vol. 23 American Institute of Physics (AIP), 2004. p. 1224-1231 (AIP Conference Proceedings, Vol. 700).

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific

TY - GEN

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PY - 2004

Y1 - 2004

N2 - Artificial flaws can be manufactured by controlled thermal fatigue loading. The produced cracks can be introduced to a wide variety of materials. This technology gives also a unique opportunity to monitor the ultrasonic response of a crack during thermal loading.This paper reports studies on the effects of different thermal load cycles on the ultrasonic response. The loads are analyzed with FEM. Two cracked samples were loaded with different thermal load cycles.

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U2 - 10.1063/1.1711757

DO - 10.1063/1.1711757

M3 - Conference article in proceedings

SN - 0-7354-0173-X

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T3 - AIP Conference Proceedings

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PB - American Institute of Physics (AIP)

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