Effects of defects on low temperature creep of OFP copper

Pertti Auerkari, Juhani Rantala, Jorma Salonen, Anssi Laukkanen, Stefan Holmström, Tuomo Kinnunen

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Original languageEnglish
Title of host publicationProceedings of 2nd ECCC Creep Conference
Subtitle of host publicationCreep & Fracture in High Temperature Components - Design & Life Assessment Issues
EditorsI.A. Shibli, S.R. Holdsworth
Pages287-297
Publication statusPublished - 2009
MoE publication typeA4 Article in a conference publication
Event2nd ECCC Creep Conference: Creep & fracture in high temperature components: design & life assessment issues - Zurich, Switzerland
Duration: 21 Apr 200923 Apr 2009

Conference

Conference2nd ECCC Creep Conference
CountrySwitzerland
CityZurich
Period21/04/0923/04/09

Cite this

Auerkari, P., Rantala, J., Salonen, J., Laukkanen, A., Holmström, S., & Kinnunen, T. (2009). Effects of defects on low temperature creep of OFP copper. In I. A. Shibli, & S. R. Holdsworth (Eds.), Proceedings of 2nd ECCC Creep Conference: Creep & Fracture in High Temperature Components - Design & Life Assessment Issues (pp. 287-297)
Auerkari, Pertti ; Rantala, Juhani ; Salonen, Jorma ; Laukkanen, Anssi ; Holmström, Stefan ; Kinnunen, Tuomo. / Effects of defects on low temperature creep of OFP copper. Proceedings of 2nd ECCC Creep Conference: Creep & Fracture in High Temperature Components - Design & Life Assessment Issues. editor / I.A. Shibli ; S.R. Holdsworth. 2009. pp. 287-297
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title = "Effects of defects on low temperature creep of OFP copper",
author = "Pertti Auerkari and Juhani Rantala and Jorma Salonen and Anssi Laukkanen and Stefan Holmstr{\"o}m and Tuomo Kinnunen",
year = "2009",
language = "English",
isbn = "978-1-60595-005-1",
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Auerkari, P, Rantala, J, Salonen, J, Laukkanen, A, Holmström, S & Kinnunen, T 2009, Effects of defects on low temperature creep of OFP copper. in IA Shibli & SR Holdsworth (eds), Proceedings of 2nd ECCC Creep Conference: Creep & Fracture in High Temperature Components - Design & Life Assessment Issues. pp. 287-297, 2nd ECCC Creep Conference, Zurich, Switzerland, 21/04/09.

Effects of defects on low temperature creep of OFP copper. / Auerkari, Pertti; Rantala, Juhani; Salonen, Jorma; Laukkanen, Anssi; Holmström, Stefan; Kinnunen, Tuomo.

Proceedings of 2nd ECCC Creep Conference: Creep & Fracture in High Temperature Components - Design & Life Assessment Issues. ed. / I.A. Shibli; S.R. Holdsworth. 2009. p. 287-297.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

TY - GEN

T1 - Effects of defects on low temperature creep of OFP copper

AU - Auerkari, Pertti

AU - Rantala, Juhani

AU - Salonen, Jorma

AU - Laukkanen, Anssi

AU - Holmström, Stefan

AU - Kinnunen, Tuomo

PY - 2009

Y1 - 2009

M3 - Conference article in proceedings

SN - 978-1-60595-005-1

SP - 287

EP - 297

BT - Proceedings of 2nd ECCC Creep Conference

A2 - Shibli, I.A.

A2 - Holdsworth, S.R.

ER -

Auerkari P, Rantala J, Salonen J, Laukkanen A, Holmström S, Kinnunen T. Effects of defects on low temperature creep of OFP copper. In Shibli IA, Holdsworth SR, editors, Proceedings of 2nd ECCC Creep Conference: Creep & Fracture in High Temperature Components - Design & Life Assessment Issues. 2009. p. 287-297