Effects of defects on low temperature creep of OFP copper

Pertti Auerkari; Juhani Rantala; Jorma Salonen; Anssi Laukkanen; Stefan Holmström; Tuomo Kinnunen

Effects of defects on low temperature creep of OFP copper

Pertti Auerkari, Juhani Rantala, Jorma Salonen, Anssi Laukkanen, Stefan Holmström, Tuomo Kinnunen

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

Original language	English
Title of host publication	Proceedings of 2nd ECCC Creep Conference
Subtitle of host publication	Creep & Fracture in High Temperature Components - Design & Life Assessment Issues
Editors	I.A. Shibli, S.R. Holdsworth
Publisher	DEStech Publications Inc.
Pages	287-297
ISBN (Print)	978-1-60595-005-1
Publication status	Published - 2009
MoE publication type	A4 Article in a conference publication
Event	2nd ECCC Creep Conference: Creep & fracture in high temperature components: design & life assessment issues - Zurich, Switzerland Duration: 21 Apr 2009 → 23 Apr 2009

Conference

Conference	2nd ECCC Creep Conference
Country/Territory	Switzerland
City	Zurich
Period	21/04/09 → 23/04/09

Cite this

@inproceedings{2eed6aede662437c9b21e2822384d77b,

title = "Effects of defects on low temperature creep of OFP copper",

author = "Pertti Auerkari and Juhani Rantala and Jorma Salonen and Anssi Laukkanen and Stefan Holmstr{\"o}m and Tuomo Kinnunen",

year = "2009",

language = "English",

isbn = "978-1-60595-005-1",

pages = "287--297",

editor = "I.A. Shibli and S.R. Holdsworth",

booktitle = "Proceedings of 2nd ECCC Creep Conference",

publisher = "DEStech Publications Inc.",

address = "United States",

note = "2nd ECCC Creep Conference : Creep & fracture in high temperature components: design & life assessment issues ; Conference date: 21-04-2009 Through 23-04-2009",

}

Auerkari, P, Rantala, J, Salonen, J, Laukkanen, A, Holmström, S & Kinnunen, T 2009, Effects of defects on low temperature creep of OFP copper. in IA Shibli & SR Holdsworth (eds), Proceedings of 2nd ECCC Creep Conference: Creep & Fracture in High Temperature Components - Design & Life Assessment Issues. DEStech Publications Inc., pp. 287-297, 2nd ECCC Creep Conference, Zurich, Switzerland, 21/04/09.

Effects of defects on low temperature creep of OFP copper. / Auerkari, Pertti; Rantala, Juhani; Salonen, Jorma et al.
Proceedings of 2nd ECCC Creep Conference: Creep & Fracture in High Temperature Components - Design & Life Assessment Issues. ed. / I.A. Shibli; S.R. Holdsworth. DEStech Publications Inc., 2009. p. 287-297.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Effects of defects on low temperature creep of OFP copper

AU - Auerkari, Pertti

AU - Rantala, Juhani

AU - Salonen, Jorma

AU - Laukkanen, Anssi

AU - Holmström, Stefan

AU - Kinnunen, Tuomo

PY - 2009

Y1 - 2009

M3 - Conference article in proceedings

SN - 978-1-60595-005-1

SP - 287

EP - 297

BT - Proceedings of 2nd ECCC Creep Conference

A2 - Shibli, I.A.

A2 - Holdsworth, S.R.

PB - DEStech Publications Inc.

T2 - 2nd ECCC Creep Conference

Y2 - 21 April 2009 through 23 April 2009

ER -