Effects of defects on low temperature creep of OFP copper

Pertti Auerkari, Juhani Rantala, Jorma Salonen, Anssi Laukkanen, Stefan Holmström, Tuomo Kinnunen

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    Original languageEnglish
    Title of host publicationProceedings of 2nd ECCC Creep Conference
    Subtitle of host publicationCreep & Fracture in High Temperature Components - Design & Life Assessment Issues
    EditorsI.A. Shibli, S.R. Holdsworth
    PublisherDEStech Publications Inc.
    Pages287-297
    ISBN (Print)978-1-60595-005-1
    Publication statusPublished - 2009
    MoE publication typeA4 Article in a conference publication
    Event2nd ECCC Creep Conference: Creep & fracture in high temperature components: design & life assessment issues - Zurich, Switzerland
    Duration: 21 Apr 200923 Apr 2009

    Conference

    Conference2nd ECCC Creep Conference
    CountrySwitzerland
    CityZurich
    Period21/04/0923/04/09

    Cite this

    Auerkari, P., Rantala, J., Salonen, J., Laukkanen, A., Holmström, S., & Kinnunen, T. (2009). Effects of defects on low temperature creep of OFP copper. In I. A. Shibli, & S. R. Holdsworth (Eds.), Proceedings of 2nd ECCC Creep Conference: Creep & Fracture in High Temperature Components - Design & Life Assessment Issues (pp. 287-297). DEStech Publications Inc..