Effects of plasma activation on hydrophilic bonding of Si and Si02

Keyphrases

• Si Wafer 100%
• Wafer 100%
• Plasma Treatment 100%
• Bond Strength 100%
• Plasma Activation 100%
• Hydrophilic Bonding 100%
• Si02 100%
• Low Temperature 50%
• Plasma Exposure 50%
• Surface Structure 50%
• Reactive Ion Etching 50%
• Thermal Oxide 50%
• Deionized Water 50%
• O2 Plasma 50%
• Bonded Interface 50%
• Bonding Process 50%
• Native Oxide 50%
• Plasma Gases 50%
• Cleaning Methods 50%
• Oxide Surfaces 50%
• Low-temperature Bonding 50%
• Ar Plasma 50%
• Si Oxide 50%
• Surface OH Groups 50%
• Disordered Surface 50%
• Etching Mode 50%

INIS

• bonding 100%
• plasma 100%
• surfaces 42%
• oxides 42%
• cleaning 42%
• water 28%
• low temperature 28%
• solutions 14%
• interfaces 14%
• diffusion 14%
• air 14%
• gases 14%
• oxygen 14%
• ions 14%
• etching 14%

Material Science

• Oxide Compound 100%
• Oxide Surface 50%
• Reactive Ion Etching 50%
• Surface (Surface Science) 50%
• Surface Structure 50%