Effects of surface treatment on the adhesion of copper to a hybrid polymer material

J. Ge (Corresponding Author), M.P.K. Turunen, Maja Kusevic, J.K. Kivilahti

Research output: Contribution to journalArticleScientificpeer-review

21 Citations (Scopus)

Abstract

The effects of various surface pretreatments on the adhesion of electroless and sputter-deposited copper metallizations to a hybrid polymer material were investigated. Without pretreatment, the adhesion between copper and the polymer was virtually zero. The adhesion of electroless copper to the polymer was poor regardless of the pretreatment used. However, the wet-chemical pretreatment of the polymer surface markedly increased the adhesion of sputtered copper to the polymer. It preferentially removed the inorganic part of the polymer and formed micropores on the surface. The plasma and reactive ion etching pretreatments, in turn, selectively etched away the organic part of the polymer and noticeably increased the hydrophilicity. Although this resulted in even higher increase in the surface free energy than was achieved with the chemical treatment, the granular surfaces became mechanically brittle. With the help of x-ray photoelectron spectroscopy, scanning electron microscopy, atomic force microscopy, and contact-angle measurements and with the recently developed pull test, the physicochemical changes of the wet-chemically pretreated polymer surfaces were demonstrated to have significant effects on the adhesion.
Original languageEnglish
Pages (from-to)2697-2707
Number of pages11
JournalJournal of Materials Research
Volume18
Issue number11
DOIs
Publication statusPublished - 2003
MoE publication typeA1 Journal article-refereed

Fingerprint

surface treatment
Surface treatment
Copper
Polymers
adhesion
Adhesion
copper
pretreatment
polymers
Reactive ion etching
Hydrophilicity
Angle measurement
Photoelectron spectroscopy
Metallizing
x ray spectroscopy
Free energy
Contact angle
Atomic force microscopy
free energy
etching

Cite this

Ge, J. ; Turunen, M.P.K. ; Kusevic, Maja ; Kivilahti, J.K. / Effects of surface treatment on the adhesion of copper to a hybrid polymer material. In: Journal of Materials Research. 2003 ; Vol. 18, No. 11. pp. 2697-2707.
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abstract = "The effects of various surface pretreatments on the adhesion of electroless and sputter-deposited copper metallizations to a hybrid polymer material were investigated. Without pretreatment, the adhesion between copper and the polymer was virtually zero. The adhesion of electroless copper to the polymer was poor regardless of the pretreatment used. However, the wet-chemical pretreatment of the polymer surface markedly increased the adhesion of sputtered copper to the polymer. It preferentially removed the inorganic part of the polymer and formed micropores on the surface. The plasma and reactive ion etching pretreatments, in turn, selectively etched away the organic part of the polymer and noticeably increased the hydrophilicity. Although this resulted in even higher increase in the surface free energy than was achieved with the chemical treatment, the granular surfaces became mechanically brittle. With the help of x-ray photoelectron spectroscopy, scanning electron microscopy, atomic force microscopy, and contact-angle measurements and with the recently developed pull test, the physicochemical changes of the wet-chemically pretreated polymer surfaces were demonstrated to have significant effects on the adhesion.",
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Effects of surface treatment on the adhesion of copper to a hybrid polymer material. / Ge, J. (Corresponding Author); Turunen, M.P.K.; Kusevic, Maja; Kivilahti, J.K.

In: Journal of Materials Research, Vol. 18, No. 11, 2003, p. 2697-2707.

Research output: Contribution to journalArticleScientificpeer-review

TY - JOUR

T1 - Effects of surface treatment on the adhesion of copper to a hybrid polymer material

AU - Ge, J.

AU - Turunen, M.P.K.

AU - Kusevic, Maja

AU - Kivilahti, J.K.

PY - 2003

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AB - The effects of various surface pretreatments on the adhesion of electroless and sputter-deposited copper metallizations to a hybrid polymer material were investigated. Without pretreatment, the adhesion between copper and the polymer was virtually zero. The adhesion of electroless copper to the polymer was poor regardless of the pretreatment used. However, the wet-chemical pretreatment of the polymer surface markedly increased the adhesion of sputtered copper to the polymer. It preferentially removed the inorganic part of the polymer and formed micropores on the surface. The plasma and reactive ion etching pretreatments, in turn, selectively etched away the organic part of the polymer and noticeably increased the hydrophilicity. Although this resulted in even higher increase in the surface free energy than was achieved with the chemical treatment, the granular surfaces became mechanically brittle. With the help of x-ray photoelectron spectroscopy, scanning electron microscopy, atomic force microscopy, and contact-angle measurements and with the recently developed pull test, the physicochemical changes of the wet-chemically pretreated polymer surfaces were demonstrated to have significant effects on the adhesion.

U2 - 10.1557/JMR.2003.0376

DO - 10.1557/JMR.2003.0376

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JO - Journal of Materials Research

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SN - 0884-2914

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ER -