Abstract
The paper aims to asses and describe the optimal
fabrication of organic thin film transistors (OTFTs) with
commercially available materials. Several types of
thermal treatments and substrate treatments are
discussed. The speed and direction of the thermal
treatment for solvent evaporation and polymerization of
the dielectric and the semiconductor influences the final
electrical parameters of the devices. Also, substrate
treatments have an effect onto the uniformity and
alignment of the coated materials. Transistors with
various channel lengths are fabricated and their
electrical parameters are assessed taking into account
the effect of the processing steps and their geometry.
| Original language | English |
|---|---|
| Title of host publication | Proceedings |
| Subtitle of host publication | IEEE 18th International symposium for design and technology of electronics packages, SIITME 2012 |
| Publisher | IEEE Institute of Electrical and Electronic Engineers |
| Pages | 73-76 |
| ISBN (Electronic) | 978-1-4673-4757-0 |
| ISBN (Print) | 978-1-4673-4760-0 |
| DOIs | |
| Publication status | Published - 2012 |
| MoE publication type | Not Eligible |
| Event | IEEE 18th International Symposium for Design and Technology in Electronic Packaging, SIITME 2012 - Alba Iulia, Romania Duration: 25 Oct 2012 → 28 Oct 2012 |
Conference
| Conference | IEEE 18th International Symposium for Design and Technology in Electronic Packaging, SIITME 2012 |
|---|---|
| Abbreviated title | SIITME 2012 |
| Country/Territory | Romania |
| City | Alba Iulia |
| Period | 25/10/12 → 28/10/12 |
Keywords
- OTFTs
- plasma introduction
- SAM
- thermal treatments