Effects of thermal aging on the characteristic breakdown behavior of nano-SiO2-BOPP and BOPP films

Mikael Ritamäki, Ilkka Rytöluoto, Kari Lahti, Mikko Karttunen

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    6 Citations (Scopus)

    Abstract

    The effects of thermal stress on the breakdown behavior of biaxially oriented PP-silica nanocomposite thin film and commercial BOPP film was evaluated with a step stress experiment in the temperature range of 50...110 °C. Weak spots were measured in thermally aged un-filled BOPP films but not in the PP-silica, which in turn displayed increasing scatter of the breakdown voltages and the scattering seemingly settled to a certain level. No weak spots were measured in un-filled BOPP films removed after highest temperatures. The behavior of un-filled films is speculated to result from either actual polymer aging in addition to the statistical nature of breakdown phenomena or from thermally-activated processes possibly involving antioxidants. The different behavior in the nanocomposite was speculated to result from polymer-nanoparticle interactions possibly countering the effects of antioxidants and hindering weak spot formation. The results demonstrate the different behavior of polymer-nanocomposites and traditional BOPP films under thermal stress and highlight the importance of evaluating the aging behavior of new materials.
    Original languageEnglish
    Title of host publicationProperties and Applications of Dielectric Materials (ICPADM), 2015 IEEE 11th International Conference on the
    PublisherIEEE Institute of Electrical and Electronic Engineers
    Pages400-403
    ISBN (Electronic)978-1-4799-8903-4, 978-1-4799-8902-7
    DOIs
    Publication statusPublished - 15 Oct 2015
    MoE publication typeA4 Article in a conference publication
    EventIEEE 11th International Conference on the Properties and Applications of Dielectric Materials, ICPADM 2015 - Sydney, Australia
    Duration: 19 Jul 201522 Jul 2015
    Conference number: 11

    Conference

    ConferenceIEEE 11th International Conference on the Properties and Applications of Dielectric Materials, ICPADM 2015
    Abbreviated titleICPADM 2015
    CountryAustralia
    CitySydney
    Period19/07/1522/07/15

    Keywords

    • BOPP film
    • thermal stress
    • breakdown

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