Effects of thermal aging on the characteristic breakdown behavior of nano-SiO2-BOPP and BOPP films

Mikael Ritamäki; Ilkka Rytöluoto; Kari Lahti; Mikko Karttunen

doi:10.1109/ICPADM.2015.7295293

Effects of thermal aging on the characteristic breakdown behavior of nano-SiO2-BOPP and BOPP films

Mikael Ritamäki, Ilkka Rytöluoto, Kari Lahti, Mikko Karttunen

Tampere University of Technology (TUT)

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

8 Citations (Scopus)

Abstract

The effects of thermal stress on the breakdown behavior of biaxially oriented PP-silica nanocomposite thin film and commercial BOPP film was evaluated with a step stress experiment in the temperature range of 50...110 °C. Weak spots were measured in thermally aged un-filled BOPP films but not in the PP-silica, which in turn displayed increasing scatter of the breakdown voltages and the scattering seemingly settled to a certain level. No weak spots were measured in un-filled BOPP films removed after highest temperatures. The behavior of un-filled films is speculated to result from either actual polymer aging in addition to the statistical nature of breakdown phenomena or from thermally-activated processes possibly involving antioxidants. The different behavior in the nanocomposite was speculated to result from polymer-nanoparticle interactions possibly countering the effects of antioxidants and hindering weak spot formation. The results demonstrate the different behavior of polymer-nanocomposites and traditional BOPP films under thermal stress and highlight the importance of evaluating the aging behavior of new materials.

Original language	English
Title of host publication	Properties and Applications of Dielectric Materials (ICPADM), 2015 IEEE 11th International Conference on the
Publisher	IEEE Institute of Electrical and Electronic Engineers
Pages	400-403
ISBN (Electronic)	978-1-4799-8903-4, 978-1-4799-8902-7
DOIs	https://doi.org/10.1109/ICPADM.2015.7295293
Publication status	Published - 15 Oct 2015
MoE publication type	A4 Article in a conference publication
Event	IEEE 11th International Conference on the Properties and Applications of Dielectric Materials, ICPADM 2015 - Sydney, Australia Duration: 19 Jul 2015 → 22 Jul 2015 Conference number: 11

Conference

Conference	IEEE 11th International Conference on the Properties and Applications of Dielectric Materials, ICPADM 2015
Abbreviated title	ICPADM 2015
Country/Territory	Australia
City	Sydney
Period	19/07/15 → 22/07/15

Keywords

BOPP film
thermal stress
breakdown

Access to Document

10.1109/ICPADM.2015.7295293

Cite this

Ritamäki, M., Rytöluoto, I., Lahti, K., & Karttunen, M. (2015). Effects of thermal aging on the characteristic breakdown behavior of nano-SiO2-BOPP and BOPP films. In Properties and Applications of Dielectric Materials (ICPADM), 2015 IEEE 11th International Conference on the (pp. 400-403). IEEE Institute of Electrical and Electronic Engineers. https://doi.org/10.1109/ICPADM.2015.7295293

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abstract = "The effects of thermal stress on the breakdown behavior of biaxially oriented PP-silica nanocomposite thin film and commercial BOPP film was evaluated with a step stress experiment in the temperature range of 50...110 °C. Weak spots were measured in thermally aged un-filled BOPP films but not in the PP-silica, which in turn displayed increasing scatter of the breakdown voltages and the scattering seemingly settled to a certain level. No weak spots were measured in un-filled BOPP films removed after highest temperatures. The behavior of un-filled films is speculated to result from either actual polymer aging in addition to the statistical nature of breakdown phenomena or from thermally-activated processes possibly involving antioxidants. The different behavior in the nanocomposite was speculated to result from polymer-nanoparticle interactions possibly countering the effects of antioxidants and hindering weak spot formation. The results demonstrate the different behavior of polymer-nanocomposites and traditional BOPP films under thermal stress and highlight the importance of evaluating the aging behavior of new materials.",

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author = "Mikael Ritam{\"a}ki and Ilkka Ryt{\"o}luoto and Kari Lahti and Mikko Karttunen",

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Ritamäki, M, Rytöluoto, I, Lahti, K & Karttunen, M 2015, Effects of thermal aging on the characteristic breakdown behavior of nano-SiO2-BOPP and BOPP films. in Properties and Applications of Dielectric Materials (ICPADM), 2015 IEEE 11th International Conference on the. IEEE Institute of Electrical and Electronic Engineers, pp. 400-403, IEEE 11th International Conference on the Properties and Applications of Dielectric Materials, ICPADM 2015, Sydney, Tasmania, Australia, 19/07/15. https://doi.org/10.1109/ICPADM.2015.7295293

Effects of thermal aging on the characteristic breakdown behavior of nano-SiO2-BOPP and BOPP films. / Ritamäki, Mikael; Rytöluoto, Ilkka; Lahti, Kari et al.
Properties and Applications of Dielectric Materials (ICPADM), 2015 IEEE 11th International Conference on the. IEEE Institute of Electrical and Electronic Engineers, 2015. p. 400-403.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

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AU - Ritamäki, Mikael

AU - Rytöluoto, Ilkka

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AU - Karttunen, Mikko

N1 - Conference code: 11

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N2 - The effects of thermal stress on the breakdown behavior of biaxially oriented PP-silica nanocomposite thin film and commercial BOPP film was evaluated with a step stress experiment in the temperature range of 50...110 °C. Weak spots were measured in thermally aged un-filled BOPP films but not in the PP-silica, which in turn displayed increasing scatter of the breakdown voltages and the scattering seemingly settled to a certain level. No weak spots were measured in un-filled BOPP films removed after highest temperatures. The behavior of un-filled films is speculated to result from either actual polymer aging in addition to the statistical nature of breakdown phenomena or from thermally-activated processes possibly involving antioxidants. The different behavior in the nanocomposite was speculated to result from polymer-nanoparticle interactions possibly countering the effects of antioxidants and hindering weak spot formation. The results demonstrate the different behavior of polymer-nanocomposites and traditional BOPP films under thermal stress and highlight the importance of evaluating the aging behavior of new materials.

AB - The effects of thermal stress on the breakdown behavior of biaxially oriented PP-silica nanocomposite thin film and commercial BOPP film was evaluated with a step stress experiment in the temperature range of 50...110 °C. Weak spots were measured in thermally aged un-filled BOPP films but not in the PP-silica, which in turn displayed increasing scatter of the breakdown voltages and the scattering seemingly settled to a certain level. No weak spots were measured in un-filled BOPP films removed after highest temperatures. The behavior of un-filled films is speculated to result from either actual polymer aging in addition to the statistical nature of breakdown phenomena or from thermally-activated processes possibly involving antioxidants. The different behavior in the nanocomposite was speculated to result from polymer-nanoparticle interactions possibly countering the effects of antioxidants and hindering weak spot formation. The results demonstrate the different behavior of polymer-nanocomposites and traditional BOPP films under thermal stress and highlight the importance of evaluating the aging behavior of new materials.

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ER -

Effects of thermal aging on the characteristic breakdown behavior of nano-SiO2-BOPP and BOPP films

Abstract

Conference

Keywords

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