Electrical sintering of nanoparticle structures

M.L. Allen, M. Aronniemi, T. Mattila, A. Alastalo, K. Ojanperä, M. Suhonen, H. Seppä

Research output: Contribution to journalArticleScientificpeer-review

226 Citations (Scopus)

Abstract

A method for sintering nanoparticles by applying voltage is presented. This electrical sintering method is demonstrated using silver nanoparticle structures ink-jet-printed onto temperature-sensitive photopaper. The conductivity of the printed nanoparticle layer increases by more than five orders of magnitude during the sintering process, with the final conductivity reaching 3.7 × 107 S m−1 at best. Due to a strong positive feedback induced by the voltage boundary condition, the process is very rapid—the major transition occurs within 2 µs. The best obtained conductivity is two orders of magnitude better than for the equivalent structures oven-sintered at the maximum tolerable temperature of the substrate. Additional key advantages of the method include the feasibility for patterning, systematic control of the final conductivity and in situ process monitoring. The method offers a generic tool for electrical functionalization of nanoparticle structures.
Original languageEnglish
Article number175201
Number of pages4
JournalNanotechnology
Volume19
Issue number17
DOIs
Publication statusPublished - 2008
MoE publication typeA1 Journal article-refereed

Fingerprint

Sintering
Nanoparticles
Process monitoring
Electric potential
Ovens
Silver
Ink
Boundary conditions
Feedback
Temperature
Substrates

Keywords

  • sintering
  • electrical sintering
  • nanoparticles
  • printed electronics
  • printed circuits

Cite this

@article{6d2140373530475f8ec6c1fe38017c9e,
title = "Electrical sintering of nanoparticle structures",
abstract = "A method for sintering nanoparticles by applying voltage is presented. This electrical sintering method is demonstrated using silver nanoparticle structures ink-jet-printed onto temperature-sensitive photopaper. The conductivity of the printed nanoparticle layer increases by more than five orders of magnitude during the sintering process, with the final conductivity reaching 3.7 × 107 S m−1 at best. Due to a strong positive feedback induced by the voltage boundary condition, the process is very rapid—the major transition occurs within 2 µs. The best obtained conductivity is two orders of magnitude better than for the equivalent structures oven-sintered at the maximum tolerable temperature of the substrate. Additional key advantages of the method include the feasibility for patterning, systematic control of the final conductivity and in situ process monitoring. The method offers a generic tool for electrical functionalization of nanoparticle structures.",
keywords = "sintering, electrical sintering, nanoparticles, printed electronics, printed circuits",
author = "M.L. Allen and M. Aronniemi and T. Mattila and A. Alastalo and K. Ojanper{\"a} and M. Suhonen and H. Sepp{\"a}",
year = "2008",
doi = "10.1088/0957-4484/19/17/175201",
language = "English",
volume = "19",
journal = "Nanotechnology",
issn = "0957-4484",
publisher = "Institute of Physics IOP",
number = "17",

}

Electrical sintering of nanoparticle structures. / Allen, M.L.; Aronniemi, M.; Mattila, T.; Alastalo, A.; Ojanperä, K.; Suhonen, M.; Seppä, H.

In: Nanotechnology, Vol. 19, No. 17, 175201, 2008.

Research output: Contribution to journalArticleScientificpeer-review

TY - JOUR

T1 - Electrical sintering of nanoparticle structures

AU - Allen, M.L.

AU - Aronniemi, M.

AU - Mattila, T.

AU - Alastalo, A.

AU - Ojanperä, K.

AU - Suhonen, M.

AU - Seppä, H.

PY - 2008

Y1 - 2008

N2 - A method for sintering nanoparticles by applying voltage is presented. This electrical sintering method is demonstrated using silver nanoparticle structures ink-jet-printed onto temperature-sensitive photopaper. The conductivity of the printed nanoparticle layer increases by more than five orders of magnitude during the sintering process, with the final conductivity reaching 3.7 × 107 S m−1 at best. Due to a strong positive feedback induced by the voltage boundary condition, the process is very rapid—the major transition occurs within 2 µs. The best obtained conductivity is two orders of magnitude better than for the equivalent structures oven-sintered at the maximum tolerable temperature of the substrate. Additional key advantages of the method include the feasibility for patterning, systematic control of the final conductivity and in situ process monitoring. The method offers a generic tool for electrical functionalization of nanoparticle structures.

AB - A method for sintering nanoparticles by applying voltage is presented. This electrical sintering method is demonstrated using silver nanoparticle structures ink-jet-printed onto temperature-sensitive photopaper. The conductivity of the printed nanoparticle layer increases by more than five orders of magnitude during the sintering process, with the final conductivity reaching 3.7 × 107 S m−1 at best. Due to a strong positive feedback induced by the voltage boundary condition, the process is very rapid—the major transition occurs within 2 µs. The best obtained conductivity is two orders of magnitude better than for the equivalent structures oven-sintered at the maximum tolerable temperature of the substrate. Additional key advantages of the method include the feasibility for patterning, systematic control of the final conductivity and in situ process monitoring. The method offers a generic tool for electrical functionalization of nanoparticle structures.

KW - sintering

KW - electrical sintering

KW - nanoparticles

KW - printed electronics

KW - printed circuits

U2 - 10.1088/0957-4484/19/17/175201

DO - 10.1088/0957-4484/19/17/175201

M3 - Article

VL - 19

JO - Nanotechnology

JF - Nanotechnology

SN - 0957-4484

IS - 17

M1 - 175201

ER -