Electrical sintering of nanoparticle structures

M.L. Allen, M. Aronniemi, T. Mattila, A. Alastalo, K. Ojanperä, M. Suhonen, H. Seppä

    Research output: Contribution to journalArticleScientificpeer-review

    249 Citations (Scopus)

    Abstract

    A method for sintering nanoparticles by applying voltage is presented. This electrical sintering method is demonstrated using silver nanoparticle structures ink-jet-printed onto temperature-sensitive photopaper. The conductivity of the printed nanoparticle layer increases by more than five orders of magnitude during the sintering process, with the final conductivity reaching 3.7 × 107 S m−1 at best. Due to a strong positive feedback induced by the voltage boundary condition, the process is very rapid—the major transition occurs within 2 µs. The best obtained conductivity is two orders of magnitude better than for the equivalent structures oven-sintered at the maximum tolerable temperature of the substrate. Additional key advantages of the method include the feasibility for patterning, systematic control of the final conductivity and in situ process monitoring. The method offers a generic tool for electrical functionalization of nanoparticle structures.
    Original languageEnglish
    Article number175201
    Number of pages4
    JournalNanotechnology
    Volume19
    Issue number17
    DOIs
    Publication statusPublished - 2008
    MoE publication typeA1 Journal article-refereed

    Keywords

    • sintering
    • electrical sintering
    • nanoparticles
    • printed electronics
    • printed circuits

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