Electrically conductive polyaniline adhesive

Mikko Pietilä, Tapio Mäkelä, K. Levon, Jorma Kivilahti, Heikki Isotalo

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    2 Citations (Scopus)

    Abstract

    Electrically conductive adhesives were prepared using commercial dodecylbenzenesulfonic acid (DBSA) doped polyaniline (PANI) as the conducting material. The adhesives investigated were based on commercial methacrylate/acrylate monomers and UV-initiator. Conductivity, tensile strength and thermal properties of adhesives containing different amounts of PANI/DBSA are reported. Conductivity values up to 1 S/cm were measured. Monomer/PANI/DBSA-systems formed highly transparent films when cured.
    Original languageEnglish
    Title of host publication4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing (Adhesives in Electronics 2000)
    Subtitle of host publicationEspoo, Finland, 18-21 June 2000
    PublisherIEEE Institute of Electrical and Electronic Engineers
    Pages118-120
    ISBN (Print)0-7803-6460-0
    DOIs
    Publication statusPublished - 2000
    MoE publication typeA4 Article in a conference publication

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