Electrically conductive polyaniline adhesive

Mikko Pietilä, Tapio Mäkelä, K. Levon, Jorma Kivilahti, Heikki Isotalo

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

2 Citations (Scopus)

Abstract

Electrically conductive adhesives were prepared using commercial dodecylbenzenesulfonic acid (DBSA) doped polyaniline (PANI) as the conducting material. The adhesives investigated were based on commercial methacrylate/acrylate monomers and UV-initiator. Conductivity, tensile strength and thermal properties of adhesives containing different amounts of PANI/DBSA are reported. Conductivity values up to 1 S/cm were measured. Monomer/PANI/DBSA-systems formed highly transparent films when cured.
Original languageEnglish
Title of host publication4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing (Adhesives in Electronics 2000)
Subtitle of host publicationEspoo, Finland, 18-21 June 2000
PublisherIEEE Institute of Electrical and Electronic Engineers
Pages118-120
ISBN (Print)0-7803-6460-0
DOIs
Publication statusPublished - 2000
MoE publication typeA4 Article in a conference publication

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    Pietilä, M., Mäkelä, T., Levon, K., Kivilahti, J., & Isotalo, H. (2000). Electrically conductive polyaniline adhesive. In 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing (Adhesives in Electronics 2000): Espoo, Finland, 18-21 June 2000 (pp. 118-120). IEEE Institute of Electrical and Electronic Engineers. https://doi.org/10.1109/ADHES.2000.860584