Electrically conductive polyaniline adhesive

Mikko Pietilä; Tapio Mäkelä; K. Levon; Jorma Kivilahti; Heikki Isotalo

doi:10.1109/ADHES.2000.860584

Electrically conductive polyaniline adhesive

Mikko Pietilä
, Tapio Mäkelä
, K. Levon
, Jorma Kivilahti
, Heikki Isotalo

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

4 Citations (Scopus)

Abstract

Electrically conductive adhesives were prepared using commercial dodecylbenzenesulfonic acid (DBSA) doped polyaniline (PANI) as the conducting material. The adhesives investigated were based on commercial methacrylate/acrylate monomers and UV-initiator. Conductivity, tensile strength and thermal properties of adhesives containing different amounts of PANI/DBSA are reported. Conductivity values up to 1 S/cm were measured. Monomer/PANI/DBSA-systems formed highly transparent films when cured.

Original language	English
Title of host publication	4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing (Adhesives in Electronics 2000)
Subtitle of host publication	Espoo, Finland, 18-21 June 2000
Publisher	IEEE Institute of Electrical and Electronic Engineers
Pages	118-120
ISBN (Print)	0-7803-6460-0
DOIs	https://doi.org/10.1109/ADHES.2000.860584
Publication status	Published - 2000
MoE publication type	A4 Article in a conference publication

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10.1109/ADHES.2000.860584

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Pietilä, M., Mäkelä, T., Levon, K., Kivilahti, J., & Isotalo, H. (2000). Electrically conductive polyaniline adhesive. In 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing (Adhesives in Electronics 2000): Espoo, Finland, 18-21 June 2000 (pp. 118-120). IEEE Institute of Electrical and Electronic Engineers. https://doi.org/10.1109/ADHES.2000.860584

@inproceedings{e91921c7963e4625af0d0fb1d7fe34ce,

title = "Electrically conductive polyaniline adhesive",

abstract = "Electrically conductive adhesives were prepared using commercial dodecylbenzenesulfonic acid (DBSA) doped polyaniline (PANI) as the conducting material. The adhesives investigated were based on commercial methacrylate/acrylate monomers and UV-initiator. Conductivity, tensile strength and thermal properties of adhesives containing different amounts of PANI/DBSA are reported. Conductivity values up to 1 S/cm were measured. Monomer/PANI/DBSA-systems formed highly transparent films when cured.",

author = "Mikko Pietil{\"a} and Tapio M{\"a}kel{\"a} and K. Levon and Jorma Kivilahti and Heikki Isotalo",

year = "2000",

doi = "10.1109/ADHES.2000.860584",

language = "English",

isbn = "0-7803-6460-0",

pages = "118--120",

booktitle = "4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing (Adhesives in Electronics 2000)",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

address = "United States",

}

Pietilä, M, Mäkelä, T, Levon, K, Kivilahti, J & Isotalo, H 2000, Electrically conductive polyaniline adhesive. in 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing (Adhesives in Electronics 2000): Espoo, Finland, 18-21 June 2000. IEEE Institute of Electrical and Electronic Engineers, pp. 118-120. https://doi.org/10.1109/ADHES.2000.860584

Electrically conductive polyaniline adhesive. / Pietilä, Mikko; Mäkelä, Tapio; Levon, K. et al.
4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing (Adhesives in Electronics 2000): Espoo, Finland, 18-21 June 2000. IEEE Institute of Electrical and Electronic Engineers, 2000. p. 118-120.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Electrically conductive polyaniline adhesive

AU - Pietilä, Mikko

AU - Mäkelä, Tapio

AU - Levon, K.

AU - Kivilahti, Jorma

AU - Isotalo, Heikki

PY - 2000

Y1 - 2000

N2 - Electrically conductive adhesives were prepared using commercial dodecylbenzenesulfonic acid (DBSA) doped polyaniline (PANI) as the conducting material. The adhesives investigated were based on commercial methacrylate/acrylate monomers and UV-initiator. Conductivity, tensile strength and thermal properties of adhesives containing different amounts of PANI/DBSA are reported. Conductivity values up to 1 S/cm were measured. Monomer/PANI/DBSA-systems formed highly transparent films when cured.

AB - Electrically conductive adhesives were prepared using commercial dodecylbenzenesulfonic acid (DBSA) doped polyaniline (PANI) as the conducting material. The adhesives investigated were based on commercial methacrylate/acrylate monomers and UV-initiator. Conductivity, tensile strength and thermal properties of adhesives containing different amounts of PANI/DBSA are reported. Conductivity values up to 1 S/cm were measured. Monomer/PANI/DBSA-systems formed highly transparent films when cured.

U2 - 10.1109/ADHES.2000.860584

DO - 10.1109/ADHES.2000.860584

M3 - Conference article in proceedings

SN - 0-7803-6460-0

SP - 118

EP - 120

BT - 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing (Adhesives in Electronics 2000)

PB - IEEE Institute of Electrical and Electronic Engineers

ER -

Pietilä M, Mäkelä T, Levon K, Kivilahti J, Isotalo H. Electrically conductive polyaniline adhesive. In 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing (Adhesives in Electronics 2000): Espoo, Finland, 18-21 June 2000. IEEE Institute of Electrical and Electronic Engineers. 2000. p. 118-120 doi: 10.1109/ADHES.2000.860584

Electrically conductive polyaniline adhesive

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