Electroless nickel plating: Bath control

R. Tenno; K. Kantola; H. Koivo

doi:10.3182/20050703-6-cz-1902.01632

Electroless nickel plating: Bath control

R. Tenno, K. Kantola, H. Koivo

Not published at VTT

Aalto University

Research output: Contribution to journal › Article in a proceedings journal › Scientific › peer-review

Abstract

in this paper, bath control is proposed for the electroless nickel plating through holes board process. The main parameters of the product (board) - thickness of the plating film and phosphorous content - are stabilized at constant levels using optimal tracking control. The set point for control is calculated from the model in dependence on the current state of the process. The pH-index and nickel percentage are stabilised at time-variable set points using simple feed-forward PI-control that is robust to the loading perturbation. Copyright © 2005 IFAC.

Original language	English
Pages (from-to)	339-344
Journal	IFAC Proceedings Volumes
Volume	38
Issue number	1
DOIs	https://doi.org/10.3182/20050703-6-cz-1902.01632
Publication status	Published - 2005
MoE publication type	A4 Article in a conference publication

Keywords

Chemical industry
Control
Modelling

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@article{56543ad1d15b450895fd45d852f92f2a,

title = "Electroless nickel plating: Bath control",

abstract = "in this paper, bath control is proposed for the electroless nickel plating through holes board process. The main parameters of the product (board) - thickness of the plating film and phosphorous content - are stabilized at constant levels using optimal tracking control. The set point for control is calculated from the model in dependence on the current state of the process. The pH-index and nickel percentage are stabilised at time-variable set points using simple feed-forward PI-control that is robust to the loading perturbation. Copyright {\textcopyright} 2005 IFAC.",

keywords = "Chemical industry, Control, Modelling",

author = "R. Tenno and K. Kantola and H. Koivo",

year = "2005",

doi = "10.3182/20050703-6-cz-1902.01632",

language = "English",

volume = "38",

pages = "339--344",

journal = "IFAC Proceedings Volumes",

issn = "1474-6670",

publisher = "Elsevier B.V.",

number = "1",

}

TY - JOUR

T1 - Electroless nickel plating: Bath control

AU - Tenno, R.

AU - Kantola, K.

AU - Koivo, H.

PY - 2005

Y1 - 2005

N2 - in this paper, bath control is proposed for the electroless nickel plating through holes board process. The main parameters of the product (board) - thickness of the plating film and phosphorous content - are stabilized at constant levels using optimal tracking control. The set point for control is calculated from the model in dependence on the current state of the process. The pH-index and nickel percentage are stabilised at time-variable set points using simple feed-forward PI-control that is robust to the loading perturbation. Copyright © 2005 IFAC.

AB - in this paper, bath control is proposed for the electroless nickel plating through holes board process. The main parameters of the product (board) - thickness of the plating film and phosphorous content - are stabilized at constant levels using optimal tracking control. The set point for control is calculated from the model in dependence on the current state of the process. The pH-index and nickel percentage are stabilised at time-variable set points using simple feed-forward PI-control that is robust to the loading perturbation. Copyright © 2005 IFAC.

KW - Chemical industry

KW - Control

KW - Modelling

UR - https://www.mendeley.com/catalogue/9efe4ce7-0d16-30dc-9d5a-289a4c5daf17/

U2 - 10.3182/20050703-6-cz-1902.01632

DO - 10.3182/20050703-6-cz-1902.01632

M3 - Article in a proceedings journal

SN - 1474-6670

VL - 38

SP - 339

EP - 344

JO - IFAC Proceedings Volumes

JF - IFAC Proceedings Volumes

IS - 1

ER -

Electroless nickel plating: Bath control

Abstract

Keywords

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