Electroless nickel plating: Bath control

R. Tenno, K. Kantola, H. Koivo

Research output: Contribution to journalArticle in a proceedings journalScientificpeer-review


in this paper, bath control is proposed for the electroless nickel plating through holes board process. The main parameters of the product (board) - thickness of the plating film and phosphorous content - are stabilized at constant levels using optimal tracking control. The set point for control is calculated from the model in dependence on the current state of the process. The pH-index and nickel percentage are stabilised at time-variable set points using simple feed-forward PI-control that is robust to the loading perturbation. Copyright © 2005 IFAC.
Original languageEnglish
Pages (from-to)339-344
JournalIFAC Proceedings Volumes
Issue number1
Publication statusPublished - 2005
MoE publication typeA4 Article in a conference publication


  • Chemical industry
  • Control
  • Modelling


Dive into the research topics of 'Electroless nickel plating: Bath control'. Together they form a unique fingerprint.

Cite this