Abstract
The process of electroless nickel plating in printed circuit boards (PCB) industries by plating-through-hole (PTH) was discussed. In the technology, the product quality is controlled through the process chemistry using an automatic control system stabilizing the nickel concentration and pH-index continuously. The current densities of the electrochemical reactions were represented as a two-directional process in a model, which was mainly the anodic reaction model for oxidation and cathodic reaction model for others. To prevent unstable situations, a piecewise constant pH-trajectory was aimed while the nickel concentration level was aimed for keeping the level constant.
| Original language | English |
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| Title of host publication | Proceedings of AIChE Annual Meeting 2004 |
| Publisher | American Institute of Chemical Engineers (AIChE) |
| Pages | 7533-7544 |
| Number of pages | 12 |
| Publication status | Published - 2004 |
| MoE publication type | A4 Article in a conference publication |